Three-Dimensional (3-D) Plastic Part Extrusion And Conductive Ink Printing For Flexible Electronics

2012 ◽  
Author(s):  
Tracy D. Hudson ◽  
Carrie D. Hill
Keyword(s):  
Flexible Electronics ◽  
Three Dimensional ◽  
Conductive Ink ◽  
Plastic Part

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Printable and Recyclable Conductive Ink Based on a Liquid Metal with Excellent Surface Wettability for Flexible Electronics

2021 ◽  
Vol 13 (6) ◽  
pp. 7443-7452
Author(s):  
Jianyu Xu ◽  
Hongda Guo ◽  
Hongyao Ding ◽  
Qiao Wang ◽  
Ziqing Tang ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Surface Wettability ◽  
Conductive Ink

Preparation of Conductive Nanosilver Ink and its Application on RFID Tags

2014 ◽  
Vol 904 ◽  
pp. 121-125 ◽  
Author(s):  
Ji Lan Fu ◽  
Ya Ling Li ◽  
Li Xin Mo ◽  
Yu Wang ◽  
Jun Ran ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Screen Printing ◽  
Surface Resistance ◽  
Large Scale ◽  
Printed Electronics ◽  
Silver Content ◽  
Rfid Tags ◽  
Rheological Characteristics ◽  
Conductive Ink ◽  
New Type

The recent dramatic progress in the printed electronics and flexible electronics, due to the universality of the substrates including the foldable and stretchable substrates, has opened a new prospect in the field of future electronics. In this paper, silver nanospheres in large-scale are synthesized, the nanosilver ink with 63.88% silver content are prepared and a new type of highly conductive and far identify distance RFID tags are manufactured. Especially there are no resin and other additives containing in our conductive ink which satisfy the rheological characteristics and process of screen printing. The tags exhibit the best radiation performance own to there is no high temperature sintering in need. The surface resistance of the tags could be 80 mΩ/, and the identify distance reach to 6.0m. Keywords:silver nanoparticles, conductive ink, RFID tags

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Methyl Cellulose ◽  
Conductive Ink ◽  
Content Type ◽  
Nano Silver ◽  
Printed Circuit ◽  
Silver Ink ◽  
Sintering Time ◽  
Water Based

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

Three-Dimensional Graphene Structure for Healable Flexible Electronics Based on Diels–Alder Chemistry

2018 ◽  
Vol 10 (11) ◽  
pp. 9727-9735 ◽  
Author(s):  
Jinhui Li ◽  
Qiang Liu ◽  
Derek Ho ◽  
Songfang Zhao ◽  
Shuwen Wu ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Three Dimensional ◽  
Diels Alder

scholarly journals Geometric and Kinematic Analyses and Novel Characteristics of Origami-Inspired Structures

Symmetry ◽  
2019 ◽  
Vol 11 (9) ◽  
pp. 1101 ◽  
Author(s):  
Yao Chen ◽  
Jiayi Yan ◽  
Jian Feng
Keyword(s):  
Flexible Electronics ◽  
Kinematic Analysis ◽  
Three Dimensional ◽  
Research Progress ◽  
The Novel ◽  
Pattern Design ◽  
Research Directions ◽  
Practical Engineering ◽  
Kinematic Analyses ◽  
The Common

In recent years, origami structures have been gradually applied in aerospace, flexible electronics, biomedicine, robotics, and other fields. Origami can be folded from two-dimensional configurations into certain three-dimensional structures without cutting and stretching. This study first introduces basic concepts and applications of origami, and outlines the common crease patterns, whereas the design of crease patterns is focused. Through kinematic analysis and verification on origami structures, origami can be adapted for practical engineering. The novel characteristics of origami structures promote the development of self-folding robots, biomedical devices, and energy absorption members. We briefly describe the development of origami kinematics and the applications of origami characteristics in various fields. Finally, based on the current research progress of crease pattern design, kinematic analysis, and origami characteristics, research directions of origami-inspired structures are discussed.

4D printing of a self-morphing polymer driven by a swellable guest medium

Soft Matter ◽  
2018 ◽  
Vol 14 (5) ◽  
pp. 765-772 ◽  
Author(s):  
Jheng-Wun Su ◽  
Xiang Tao ◽  
Heng Deng ◽  
Cheng Zhang ◽  
Shan Jiang ◽  
...  
Keyword(s):  
Tissue Engineering ◽  
Flexible Electronics ◽  
Three Dimensional ◽  
Advanced Materials ◽  
Soft Robotics ◽  
4D Printing ◽  
3D Structures

There is a significant need of advanced materials that can be fabricated into functional devices with defined three-dimensional (3D) structures for application in tissue engineering, flexible electronics, and soft robotics.

scholarly journals Design of a Fully Integrated Inductive Coupling System: A Discrete Approach Towards Sensing Ventricular Pressure

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1525
Author(s):  
Natiely Hernández Sebastián ◽  
Noé Villa Villaseñor ◽  
Francisco-Javier Renero-Carrillo ◽  
Daniela Díaz Alonso ◽  
Wilfrido Calleja Arriaga
Keyword(s):  
Pressure Sensor ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Three Dimensional ◽  
Magnetic Coupling ◽  
Circuit Board ◽  
Ventricular Pressure ◽  
Capacitive Pressure Sensor ◽  
Implantable Medical Device

In this paper, an alternative strategy for the design of a bidirectional inductive power transfer (IPT) module, intended for the continuous monitoring of cardiac pressure, is presented. This new integrated implantable medical device (IMD) was designed including a precise ventricular pressure sensor, where the available implanting room is restricted to a 1.8 × 1.8 cm2 area. This work considers a robust magnetic coupling between an external reading coil and the implantable module: a three-dimensional inductor and a touch mode capacitive pressure sensor (TMCPS) set. In this approach, the coupling modules were modelled as RCL circuits tuned at a 13.56 MHz frequency. The analytical design was validated by means of Comsol Multiphysics, CoventorWare, and ANSYS HFSS software tools. A power transmission efficiency (PTE) of 94% was achieved through a 3.5 cm-thick biological tissue, based on high magnitudes for the inductance (L) and quality factor (Q) components. A specific absorption rate (SAR) of less than 1.6 W/Kg was attained, which suggests that this IPT system can be implemented in a safe way, according to IEEE C95.1 safety guidelines. The set of inductor and capacitor integrated arrays were designed over a very thin polyimide film, where the 3D coil was 18 mm in diameter and approximately 50% reduced in size, considering any conventional counterpart. Finally, this new approach for the IMD was under development using low-cost thin film manufacturing technologies for flexible electronics. Meanwhile, as an alternative test, this novel system was fabricated using a discrete printed circuit board (PCB) approach, where preliminary electromagnetic characterization demonstrates the viability of this bidirectional IPT design.

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