Printable and Recyclable Conductive Ink Based on a Liquid Metal with Excellent Surface Wettability for Flexible Electronics

2021 ◽  
Vol 13 (6) ◽  
pp. 7443-7452
Author(s):  
Jianyu Xu ◽  
Hongda Guo ◽  
Hongyao Ding ◽  
Qiao Wang ◽  
Ziqing Tang ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Surface Wettability ◽  
Conductive Ink

scholarly journals Is There a Relationship between Surface Wettability of Structured Surfaces and Lyophobicity toward Liquid Metals?

Materials ◽  
2020 ◽  
Vol 13 (10) ◽  
pp. 2283 ◽  
Author(s):  
Stephan Handschuh-Wang ◽  
Lifei Zhu ◽  
Tao Wang
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Liquid Metals ◽  
Metal Layer ◽  
Surface Wettability ◽  
Diamond Coating ◽  
Air Plasma ◽  
Structured Surfaces ◽  
Static Contact ◽  
The Impact

The liquid metal lyophobicity of a rough substrate was, in previous articles, found to be rather independent on the surface wettability. In this article, we scrutinize the impact of surface wettability of a structured (rough) surface on the liquid metal wettability and adhesion. As a model system, a structured diamond coating was synthesized and modified by air plasma. We show that surface wettability (surface free energy) does not play a prominent role for static contact angle measurements and for the liquid metal repelling properties of the diamond coating in droplet impact experiments. In contrast, roll off angles and repeated deposition experiments illustrate that the increased hydrophilicity impacts the long-term liquid metal repellency of our coating. Liquid metal adhered after around 50 deposition/removal cycles on the hydrophilic diamond coating, while no liquid metal adhesion was visible after 100 cycles on the hydrophobic diamond coating, illustrating the fundamental role for the adhesion of liquid metal. The effect of repeated deposition in conjunction with gentle applied force was employed for coating the liquid metal lyophobic (hydrophilic) diamond coating with a thin liquid metal layer. The observed effect may find application in flexible electronics and thermal management systems as a means to improve interfacing of the liquid metal with conductive non-metal coatings.

Liquid metal-based nanocomposite materials: Fabrication technology and applications

Nanoscale ◽  
2021 ◽  
Author(s):  
Hiroki Ota ◽  
Nyamjargal Ochirkhuyag ◽  
Ryosuke Matsuda ◽  
Zihao Song ◽  
Fumika Nakamura ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Liquid Metals ◽  
Nanocomposite Materials ◽  
Fabrication Technology

Research on liquid metals has been steadily garnering more interest in recent times because the properties of these metals are conducive to flexible electronics applications; further, these metals are in...

Preparation of Conductive Nanosilver Ink and its Application on RFID Tags

2014 ◽  
Vol 904 ◽  
pp. 121-125 ◽  
Author(s):  
Ji Lan Fu ◽  
Ya Ling Li ◽  
Li Xin Mo ◽  
Yu Wang ◽  
Jun Ran ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Screen Printing ◽  
Surface Resistance ◽  
Large Scale ◽  
Printed Electronics ◽  
Silver Content ◽  
Rfid Tags ◽  
Rheological Characteristics ◽  
Conductive Ink ◽  
New Type

The recent dramatic progress in the printed electronics and flexible electronics, due to the universality of the substrates including the foldable and stretchable substrates, has opened a new prospect in the field of future electronics. In this paper, silver nanospheres in large-scale are synthesized, the nanosilver ink with 63.88% silver content are prepared and a new type of highly conductive and far identify distance RFID tags are manufactured. Especially there are no resin and other additives containing in our conductive ink which satisfy the rheological characteristics and process of screen printing. The tags exhibit the best radiation performance own to there is no high temperature sintering in need. The surface resistance of the tags could be 80 mΩ/, and the identify distance reach to 6.0m. Keywords:silver nanoparticles, conductive ink, RFID tags

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Methyl Cellulose ◽  
Conductive Ink ◽  
Content Type ◽  
Nano Silver ◽  
Printed Circuit ◽  
Silver Ink ◽  
Sintering Time ◽  
Water Based

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

scholarly journals Sequential Oxidation Strategy for the Fabrication of Liquid Metal Electrothermal Thin Film with Desired Printing and Functional Property

Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1539
Author(s):  
Jun-Heng Fu ◽  
Xu-Dong Zhang ◽  
Peng Qin ◽  
Jing Liu
Keyword(s):  
Thin Film ◽  
Liquid Metal ◽  
Composite Film ◽  
Flexible Electronics ◽  
High Performance ◽  
Polyimide Film ◽  
Great Promise ◽  
Metal Composite ◽  
Resistive Layer ◽  
Film Substrate

Room temperature liquid metal (LM) showcases a great promise in the fields of flexible functional thin film due to its favorable characteristics of flexibility, inherent conductivity, and printability. Current fabrication strategies of liquid metal film are substrate structure specific and sustain from unanticipated smearing effects. Herein, this paper reported a facile fabrication of liquid metal composite film via sequentially regulating oxidation to change the adhesion characteristics, targeting the ability of electrical connection and electrothermal conversion. The composite film was then made of the electrically resistive layer (oxidizing liquid metal) and the insulating Polyimide film (PI film) substrate, which has the advantages of electrical insulation and ultra-wide temperature working range, and its thickness is only 50 μm. The electrical resistance of composite film can maintain constant for 6 h and could work normally. Additionally, the heating film exhibited excellent thermal switching characteristics that can reach temperature equilibrium within 100 s, and recovery to ambient temperature within 50 s. The maximum working temperature of the as-prepared film is 115 °C, which is consistent with the result of the theoretical calculation, demonstrating a good electrothermal conversion capability. Finally, the heating application under extreme low temperature (−196 °C) was achieved. This conceptual study showed the promising value of the prototype strategy to the specific application areas such as the field of smart homes, flexible electronics, wearable thermal management, and high-performance heating systems.

Femtosecond laser preparing patternable liquid-metal-repellent surface for flexible electronics

2020 ◽  
Vol 578 ◽  
pp. 146-154 ◽  
Author(s):  
Jingzhou Zhang ◽  
Keyue Zhang ◽  
Jiale Yong ◽  
Qing Yang ◽  
Yongning He ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Femtosecond Laser ◽  
Flexible Electronics

scholarly journals Low-Cost Rapid Fabrication of Conformal Liquid-Metal Patterns

2019 ◽  
Vol 9 (8) ◽  
pp. 1565 ◽  
Author(s):  
Elassy ◽  
Akau ◽  
Shiroma ◽  
Seo ◽  
Ohta
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Communication Systems ◽  
Liquid Metals ◽  
Low Cost ◽  
Spray Coating ◽  
Uv Curable ◽  
Rapid Fabrication ◽  
Communication Devices ◽  
Stretchable Conductors

Patterned conformal conductive structures are used to realize flexible electronics for applications such as electronic skin, communication devices, and sensors. Thus, there is a demand for low-cost rapid fabrication techniques for flexible and stretchable conductors. Spray-coating of liquid metals is a prototyping method that is compatible with elastic substrates. In this work, UV-curable and polyimide masks were used to pattern sprayed liquid metal (LM). The effect of the spraying parameters on the thickness and conductivity of the LM was characterized. A minimum LM linewidth of 48 µm was achieved, along with a minimum gap width of 34 µm. A LM patch antenna and transmission line, which can potentially be used for communication systems, were demonstrated using this fabrication process.

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