Thermal-Electrical FEA of Localized Heating for MEMS Packaging

Abstract This work addresses important post-packaging issues for microelectromechanical systems (MEMS) and introduces specific research directions by means of localized heating and bonding. MEMS packaging has become a major research subject due to the stringent packaging requirements in the emerging filed of MEMS. Establishing a versatile post-packaging process not only advances the field scientifically but also helps product commercialization in industry. An innovative post-packaging approach by localized heating and bonding is proposed and presented in this paper. Various post-packaging processes are demonstrated, including an integrated LPCVD (Low Pressure Chemical Vapor Deposition) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

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Micro-Electro-Mechanical Systems (MEMS) Micro-Heater

Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B ◽

10.1115/imece2012-85814 ◽

2012 ◽

Author(s):

C. N. Janakos ◽

F. T. Goericke ◽

A. P. Pisano

Keyword(s):

Mechanical Systems ◽

Testing Device ◽

Mems Devices ◽

Micro Electro Mechanical Systems ◽

Mems Packaging ◽

Rate Table ◽

Heating Device ◽

Localized Heating

This research addresses the problem of not having access to a localized heating device that easily integrates a variety of testing needs with MEMS packaging. This device can heat MEMS while simultaneously in vacuum, exposed to harsh gases and on a rate table. The solution is a micro-heater built directly into its packaging with the capability to test MEMS at vacuum, which can be pumped down to 1 Torr in a fraction of a second and heats the device to approximately 170 degrees Celsius to simulate the temperatures MEMS devices endure. This packaging integrated with a testing device can accommodate a broad range of MEMS devices.

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Localized Parylene-C Bonding for Micro Packaging and Cell Encapsulation using Reactive Multilayer Foils

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2010dpc-tp22 ◽

2010 ◽

Vol 2010 (DPC) ◽

pp. 000925-000940

Author(s):

Xiaotun Qiu ◽

David Welch ◽

Jennifer Blain Christen ◽

Rui Tang ◽

Jie Zhu ◽

...

Keyword(s):

Room Temperature ◽

Cell Encapsulation ◽

Mouse Fibroblast ◽

Bonding Process ◽

Parylene C ◽

Mems Packaging ◽

Multilayer Foils ◽

Localized Heating ◽

Nih 3T3 ◽

Bonding Technique

This abstract described a novel physiologically compatible wafer bonding technique for bio-microelectromechnical systems (bio-MEMS) packaging. Room temperature bonding was performed between Parylene-C and silicon wafers with a thin Parylene-C coating using reactive Ni/Al multilayer foils as localized heaters. Live NIH 3T3 mouse fibroblast cells were encapsulated in the package and they survived the bonding process owing to the localization of heating. A numerical model was developed to predict the temperature evolutions in the parylene layers, silicon wafer and the encapsulated liquid during the bonding process. The simulation results were in agreement with the cell encapsulation experiment revealing that localized heating occurred in this bonding approach. This study proved the feasibility of reactive multilayer foil bonding technique for broad applications in packaging bio-MEMS and microfluidic systems.

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