Investigation of Burst Pressures Prediction of Slit Aluminum Cylinders Subjected to Localized Heating

2005 ◽  
Author(s):  
C. T. Sun ◽  
T. Tanner ◽  
A. Deitemeyer ◽  
D. Nakaima ◽  
N. Bruno ◽  
...  
Keyword(s):  
Localized Heating

Localized heating/bonding techniques in MEMS packaging

2005 ◽  
Author(s):  
J. R. Mabesa, Jr. ◽  
A. J. Scott ◽  
X. Wu ◽  
G. W. Auner
Keyword(s):  
Mems Packaging ◽  
Localized Heating

scholarly journals Localized heating in nanoscale Pt constrictions measured using blackbody radiation emission

2008 ◽  
Vol 93 (21) ◽  
pp. 213108 ◽  
Author(s):  
Daniel R. Ward ◽  
Naomi J. Halas ◽  
Douglas Natelson
Keyword(s):  
Blackbody Radiation ◽  
Radiation Emission ◽  
Localized Heating

Storage Battery Explosions: Heating and Jarring

1986 ◽  
Vol 3 (2) ◽  
Author(s):  
Harry S. Dixon
Keyword(s):  
High Rate ◽  
Storage Battery ◽  
High Current ◽  
Vapor Explosion ◽  
Popular Belief ◽  
Boiling Liquid ◽  
Localized Heating ◽  
A Cell ◽  
Current Drain

A previous paper entitled Storage Battery Explosions: Hydrogen or BLEVE.? showed that contrary to popular belief storage battery explosions concurrent with or following a high rate of discharge were BLEVE (Boiling Liquid Expanding Vapor Explosion) explosions rather than hydrogen. The bases of that paper were the explosions of two batteries. Because of low liquid in a cell there had been excessive localized heating, actually superheating, between the plates. However, other than the explosion resulting from alleged superheating there was no other indication nor evidence of heating. This paper describes a BLEVE explosion that resulted simply from jarring after the overheating of the battery which had been subjected to high current drain in attempting to start the automobile. It is referred to as the Salaam case.

MEMS Post-Packaging by Localized Heating

2000 ◽  
Author(s):  
Liwei Lin
Keyword(s):  
Vapor Deposition ◽  
Microelectromechanical Systems ◽  
Chemical Vapor ◽  
Research Subject ◽  
Major Research ◽  
Research Directions ◽  
Mems Packaging ◽  
Fusion Bonding ◽  
Localized Heating ◽  
Pressure Chemical

Abstract This work addresses important post-packaging issues for microelectromechanical systems (MEMS) and introduces specific research directions by means of localized heating and bonding. MEMS packaging has become a major research subject due to the stringent packaging requirements in the emerging filed of MEMS. Establishing a versatile post-packaging process not only advances the field scientifically but also helps product commercialization in industry. An innovative post-packaging approach by localized heating and bonding is proposed and presented in this paper. Various post-packaging processes are demonstrated, including an integrated LPCVD (Low Pressure Chemical Vapor Deposition) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

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