High frequency characterization and analytical modeling of through glass via (TGV) for 3D thin-film interposer and MEMS packaging
1999 ◽
Vol 23
(4_2)
◽
pp. 1621-1624
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1992 ◽
Vol 7
(10)
◽
pp. 773-778
2019 ◽
Vol 18
(2)
◽
pp. 543-552
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2008 ◽
Vol 320
(20)
◽
pp. e963-e966
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Keyword(s):
1998 ◽
Vol 22
(4_2)
◽
pp. 861-864
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1991 ◽
Vol 27
(6)
◽
pp. 4876-4878
◽