Ni-Silicided Deep Source/Drain Junctions Formed by Solid Phase Epitaxial Regrowth
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ABSTRACTMaking use of SPER (Solid Phase Epitaxial Regrowth) As and B deep source/drain junctions with high activation can be obtained at temperatures below 700°C. However, higher thermal budget is required to regrow and activate the dopants in the poly gates. Low junction leakage and low contact resistance can be obtained for Ni-silicided As and B SPER junctions making use of deep As and B implants. Because of the low thermal budget source/drain junctions obtained by SPER are an attractive alternative to conventional spike annealed junctions for technologies making use of metal gates.
2006 ◽
Vol 53
(7)
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pp. 1657-1668
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1990 ◽
Vol 19
(10)
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pp. 1061-1064
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