Mechanical Properties of Al Thin Films as Measured by Bulge Testing

1999 ◽  
Vol 594 ◽  
Author(s):  
Yinmin Wang ◽  
Richard L. Edwards ◽  
Kevin J. Hemker

AbstractFree-standing rectangular Al thin films have been fabricated using sputter deposition and standard micromachining techniques. Mechanical properties and residual stresses of both asdeposited and annealed Al films were measured by bulge testing. The films were loaded into the plastic deformation regime, and then unloaded and reloaded several times. The pressure and deflection of the thin films were recorded and used to generate stress-strain curves. The planestrain elastic modulus, flow stress and plastic behavior of the Al thin films were used to characterize the mechanical response of these films. The Al films were measured to have a plane-strain modulus that is slightly lower than the literature values for a {111} textured film. The Von-Mises equivalent yield stress was measured to be higher in the annealed films but much more significant strain hardening was observed in the as-deposited films. A plastic hysteresis was observed on unloading and reloading stress-strain curves of the as-deposited Al films but not the annealed films.

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Luke A. Galuska ◽  
Eric S. Muckley ◽  
Zhiqiang Cao ◽  
Dakota F. Ehlenberg ◽  
Zhiyuan Qian ◽  
...  

AbstractIntrinsic mechanical properties of sub-100 nm thin films are markedly difficult to obtain, yet an ever-growing necessity for emerging fields such as soft organic electronics. To complicate matters, the interfacial contribution plays a major role in such thin films and is often unexplored despite supporting substrates being a main component in current metrologies. Here we present the shear motion assisted robust transfer technique for fabricating free-standing sub-100 nm films and measuring their inherent structural–mechanical properties. We compare these results to water-supported measurements, exploring two phenomena: 1) The influence of confinement on mechanics and 2) the role of water on the mechanical properties of hydrophobic films. Upon confinement, polystyrene films exhibit increased strain at failure, and reduced yield stress, while modulus is reduced only for the thinnest 19 nm film. Water measurements demonstrate subtle differences in mechanics which we elucidate using quartz crystal microbalance and neutron reflectometry.


2008 ◽  
Vol 23 (6) ◽  
pp. 1604-1613 ◽  
Author(s):  
M.J. Cordill ◽  
N.R. Moody ◽  
W.W. Gerberich

Dynamic indentation techniques are often used to determine mechanical properties as a function of depth by continuously measuring the stiffness of a material. The dynamics are used by superimposing an oscillation on top of the monotonic loading. Of interest was how the oscillation affects the measured mechanical properties when compared to a quasi-static indent run at the same loading conditions as a dynamic. Single crystals of nickel and NaCl as well as a polycrystalline nickel sample and amorphous fused quartz and polycarbonate have all been studied. With respect to dynamic oscillations, the result is a decrease of the load at the same displacement and thus lower measured hardness values of the ductile crystalline materials. It has also been found that the first 100 nm of displacement are the most affected by the oscillating tip, an important length scale for testing thin films, nanopillars, and nanoparticles.


2022 ◽  
Author(s):  
Yuxi Ma ◽  
Quan Zhou ◽  
Jason D. Nicholas

The temperature dependence of a Mixed Ionic Electronic Conducting (MIEC) material’s thermo-chemical expansion coefficient, biaxial modulus, and/or Young’s modulus are crucial in determining the internal stress, strain, and/or mechanical stability...


1993 ◽  
Vol 308 ◽  
Author(s):  
I. C. Noyan ◽  
G. Sheikh

ABSTRACTThe mechanical response of a specimen incorporating thin films is dictated by a combination of fundamental mechanical parameters such as Young's moduli of the individual layers, and by configurational parameters such as adhesion strength at the interface(s), residual stress distribution and other process dependent factors. In most systems, the overall response will be dominated by the properties of the (much thicker) substrate. Failure within the individual layers, on the other hand, is dependent on the local strain distributions and can not be predicted from the substrate values alone. To better understand the mechanical response of these systems, the strain within the individual layers of the thin film system must be measured and correlated with applied stresses. Phase selectivity of X-ray stress/strain analysis techniques is well suited for this purpose. In this paper, we will review the use of the traditional x-ray stress/strain analysis methods for the determination of the mechanical properties of thin film systems.


2020 ◽  
Author(s):  
Taylor C. Stimpson ◽  
Daniel A. Osorio ◽  
Emily D. Cranston ◽  
Jose Moran-Mirabal

<p>To engineer tunable thin film materials, accurate measurement of their mechanical properties is crucial. However, characterizing the elastic modulus with current methods is particularly challenging for sub-micrometer thick films and hygroscopic materials because they are highly sensitive to environmental conditions and most methods require free-standing films which are difficult to prepare. In this work, we directly compared three buckling-based methods to determine the elastic moduli of supported thin films: 1) biaxial thermal shrinking, 2) uniaxial thermal shrinking, and 3) the mechanically compressed, strain-induced elastic buckling instability for mechanical measurements (SIEBIMM) method. Nanobiocomposite model films composed of cellulose nanocrystals (CNCs) and polyethyleneimine (PEI) were assembled using layer-by-layer deposition to control composition and thickness. The three buckling-based methods yielded the same trends and comparable values for the elastic moduli of each CNC-PEI film composition (ranging from 15 – 44 GPa, depending on film composition). This suggests that the methods are similarly effective for the quantification of thin film mechanical properties. Increasing the CNC content in the films statistically increased the modulus, however, increasing the PEI content did not lead to significant changes. The standard deviation of elastic moduli determined from SIEBIMM was 2-4 times larger than for thermal shrinking, likely due to extensive cracking and partial film delamination. In light of these results, biaxial thermal shrinking is recommended as the method of choice because it affords the simplest implementation and analysis and is the least sensitive to small deviations in the input parameter values, such as film thickness or substrate modulus.</p>


1997 ◽  
Vol 505 ◽  
Author(s):  
S. Jayaraman ◽  
R. L. Edwards ◽  
K. J. Hemker

ABSTRACTUsing standard deposition and micromachining techniques, silicon substrates with square and rectangular windows covered with membranes of polycrystalline silicon (polysilicon) have been fabricated. Pressure-displacement curves obtained during the bulge testing of membranes with the above geometries have been used to determine the elastic constants E and v of the polysilicon. The results obtained (E = 162± 4 GPa and v = 0.19±0.03) are in good agreement with literature values for bulk polycrystalline silicon.


1999 ◽  
Vol 563 ◽  
Author(s):  
J. Florando ◽  
H. Fujimoto ◽  
Q. Ma ◽  
O. Kraft ◽  
R. Schwaiger ◽  
...  

AbstractAn improved microbeam bending technique has been developed for the study of mechanical properties of thin films on substrates. This testing method utilizes a triangular beam geometry and improved micromachining techniques compared to previously used methods. The technique permits the stress-strain law for a metal film on a substrate to be determined. Single crystal Si beams and bi-layer Si/Al beams of lengths 25–100 pgm have been fabricated and tested. The beams are deflected with a nanoindenter, which accurately imposes a load on the beam and measures the corresponding displacement. For the bi-layer beams, a simple numerical model utilizing a Ramburg-Osgood constitutive law the film has been developed to determine the stress-strain behavior of the Al film.


2005 ◽  
Vol 122 (14) ◽  
pp. 144712 ◽  
Author(s):  
Kenji Yoshimoto ◽  
Tushar S. Jain ◽  
Paul F. Nealey ◽  
Juan J. de Pablo

1992 ◽  
Vol 267 ◽  
Author(s):  
Timothy Vitale

ABSTRACTThrough a series of experiments the mechanical properties of paper are explored. Hydrogen bonding is fundamental to the performance of paper and its disruption results in distinctive stress-strain behavior. Stress-strain curves were generated from which tensile strength, Young's modulus, percent stretch, and work (tensile energy absorption) were obtained.It was found that the contribution of the fiber to the mechanical properties of paper is primarily elastic. Fibers are many times stronger than paper. Only fibers which have been severely deteriorated show measurable changes in stress-strain behavior. Fiber deterioration results in characteristically different stress-strain behavior than that which results from disruption of interfiber bonding.Water immersion results in the disruption of interfiber bonds in paper, leaving only 2-3% of dry tensile strength. Interfiber bonds make a profound contribution to the mechanical properties of the paper. Aqueous treatment is shown to be a radical treatment, altering the original dried-in properties of the sheet. The release of structural bonds and dried-in strains during wetting and the subsequent reformation of interfiber bonds during drying are shown to be independent of water purity, be it ultrapure water, tap water, or water containing washing aids such as Ca(OH)2, NaOH, CaCO3 or Na2CO3.The effects of immersion in organic solvents was explored. Solvents have effects on mechanical properties which are approximately proportional to the degree of swelling caused by the solvent. Water, the liquid which caused the greatest swelling of the liquids evaluated, is shown to be the most disruptive liquid followed by methanol and acetone; toluene caused virtually no change.To explore the behavior of interfiber bonds paper was taken through a solvent exchange process. A sample was immersed in water and then taken through separate ethanol and acetone immersions to toluene, and dried. The result was a sheet with little bonding and decreases in all mechanical properties. To explore the surface tension and capillary action effects of water, the solvent-exchanged sheet was re-immersed in water. Upon drying, interfiber bonding was reintroduced which resulted in the regain of mechanical properties lost.A paradigm for the mechanical behavior of paper is developed. Fibers contribute elastic behavior and interfiber bonds are a principal source of plastic behavior.


1993 ◽  
Vol 308 ◽  
Author(s):  
J.-L. Delplancke ◽  
R. Winand ◽  
J. Dille ◽  
J. Charlier

ABSTRACTProduction of thin (10 to 200 microns thick) metallic (Cu, Co and Ni-P) foils is performed by electrodeposition on various substrates. A competition between substrate-induced and electroplating-induced inhibition of crystal growth appears. Film structures observed by SEM, TEM and X-Ray diffraction are related to the mechanical properties of the films (stress-strain curves, microhardness and work hardening bend test).In some cases, copper thin films with a large number of submicron crystals are obtained. These films recrystallize at room temperature and their mechanical properties are completely modified by this ageing process.


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