Influence of the structure on the mechanical properties of electrodeposited metallic thin films
Keyword(s):
ABSTRACTProduction of thin (10 to 200 microns thick) metallic (Cu, Co and Ni-P) foils is performed by electrodeposition on various substrates. A competition between substrate-induced and electroplating-induced inhibition of crystal growth appears. Film structures observed by SEM, TEM and X-Ray diffraction are related to the mechanical properties of the films (stress-strain curves, microhardness and work hardening bend test).In some cases, copper thin films with a large number of submicron crystals are obtained. These films recrystallize at room temperature and their mechanical properties are completely modified by this ageing process.
Physical and Mechanical Properties of Cement Paste Were Used Partially with Fly Ash and Kaolin Waste
2017 ◽
Vol 866
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pp. 199-203
Keyword(s):
2007 ◽
Vol 546-549
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pp. 257-260
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