Schottky Barrier Formation on Electron Beam Deposited Amorphous Si1−xGex:H alloys and Amorphous (Si/Si1−xGex):H Modulated Structures

1985 ◽  
Vol 54 ◽  
Author(s):  
A. Christou ◽  
P. Tzanetakis ◽  
Z. Hatzopoulos ◽  
G. Kiriakidis
Keyword(s):  
Electron Beam ◽  
Barrier Height ◽  
Deep Level ◽  
Negative Resistance ◽  
Ion Source ◽  
Schottky Barriers ◽  
Fermi Level Pinning ◽  
Barrier Formation ◽  
Modulated Structures ◽  
Amorphous Si

ABSTRACTAmorphous Si:H and Si1−xGex:H films were prepared by mixing electron beam evaporated silicon with a molecular beam of germanium from a Knudsen cell and with a beam of ionized hydrogen produced by a 0–3 keV ion source. Aluminum Schottky barriers on two types of samples: (1) a-Si1−xGex:H with.15<×<.85 and (2) modulated structures of 50 × 100 Å layers of a-Si:H/a-Si.8Ge.2:H (10-5 Torr PH hydrogen) were investigated. Barrier height was found to depend on the Ge concentration and possible Fermi-level pinning due to the dangling bond deep level. The modulated structures showed a negative resistance region and a barrier height determined only by the composition of the first layer.

Schottky barrier formation on electron beam deposited amorphous Si1−xGex: H alloys and amorphous (Si/Si1−xGex): H modulated structures

1986 ◽  
Vol 48 (6) ◽  
pp. 408-410 ◽  
Author(s):  
A. Christou ◽  
P. Tzanetakis ◽  
Z. Hatzopoulos ◽  
G. Kyriakidis ◽  
W. Tseng ◽  
...  
Keyword(s):  
Electron Beam ◽  
Schottky Barrier ◽  
Barrier Formation ◽  
Modulated Structures ◽  
Amorphous Si

Electrical Properties and Schottky Barriers of Metal-Semiconductor Interfaces

1990 ◽  
Vol 181 ◽  
Author(s):  
M.O. Aboelfotoh
Keyword(s):  
Electrical Properties ◽  
Temperature Dependence ◽  
Schottky Barrier ◽  
Barrier Height ◽  
Fermi Level Pinning ◽  
Barrier Heights ◽  
Semiconductor Interfaces ◽  
Barrier Formation ◽  
Indirect Band Gap ◽  
P Type

ABSTRACTThe electrical properties of metal/Si(100) and metal/Ge(100) interfaces formed by the deposition of metal on both n-type and p-type Si(100) and Ge(100) have been studied in the temperature range 77-295 K with the use of current- and capacitance-voltage techniques. Compound formation is found to have very little or no effect on the Schottky-barrier height and its temperature dependence. For silicon, the barrier height and its temperature dependence are found to be affected by the metal. For germanium, on the other hand, the barrier height and its temperature dependence are unaffected by the metal. The temperature dependence of the Si and Ge barrier heights is found to deviate from the predictions of recent models of Schottky-barrier formation based on the suggestion of Fermi-level pinning in the center of the semiconductor indirect band gap.

Metal In-Diffusion during Fe and Co-Germanidation of Germanium

2007 ◽  
Vol 131-133 ◽  
pp. 47-52 ◽  
Author(s):  
Eddy Simoen ◽  
K. Opsomer ◽  
Cor Claeys ◽  
Karen Maex ◽  
Christophe Detavernier ◽  
...  
Keyword(s):  
Band Gap ◽  
Barrier Height ◽  
Rapid Thermal Annealing ◽  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Reverse Current ◽  
Deep Levels ◽  
Schottky Barriers ◽  
Deep Acceptor ◽  
Transient Spectroscopy

In this paper, the deep levels occurring in Fe- or Co-germanide Schottky barriers on ntype Ge have been studied by Deep Level Transient Spectroscopy (DLTS). As is shown, no traps have been found for germanidation temperatures up to 500 oC, suggesting that in both cases no marked metal in-diffusion takes place during the Rapid Thermal Annealing (RTA) step. Deep acceptor states in the upper half of the Ge band gap and belonging to substitutional Co and Fe can be detected by DLTS only at higher RTA temperatures (TRTA). For the highest TRTA, deep levels belonging to other metal contaminants (Cu) have been observed as well. Simultaneously, the reverse current of the Schottky barriers increases with TRTA, while the barrier height is also strongly affected.

Temperature Dependent Schottky Contacts to InP and GaAs

1991 ◽  
Vol 240 ◽  
Author(s):  
Z. Q. Shi ◽  
R. L. Wallace ◽  
W. A. Anderson
Keyword(s):  
Substrate Temperature ◽  
Fermi Level ◽  
Barrier Height ◽  
Leakage Current ◽  
Deep Level ◽  
Interface State ◽  
State Density ◽  
Fermi Level Pinning ◽  
Order Of Magnitude ◽  
Transient Spectroscopy

ABSTRACTThe barrier height of a Pd/n-InP diode was found to be increased from 0.48 to 0.96eV with the substrate temperature decreased from 300 to 77K during metal deposition. The leakage current density was reduced by more than six order of magnitude. It is obvious that the interface Fermi-level position lies well outside the variance associated with Fermi-level pinning. The barrier height for the Au/n-GaAs diode was found to be increased by about 0.25 eV with low temperature deposition and the leakage current reduced by more than five orders of magnitude. The mechanism responsible for the ultrahigh barrier height obtained at low substrate temperature was investigated by Raman spectroscopy, current voltage temperature measurement, deep level transient spectroscopy, and electroreflectance technique. The metal-insulator-semiconductor (MIS)-like structure formed at low substrate temperature and the reduction of interface state density may be the main reason for the dramatic enhancement of Schottky barrier height.

Thermal Stability of Ti/Mo Schottky Contacts on p-Si and Defects Introduced in p-Si during Electron Beam Deposition of Ti/Mo

2005 ◽  
Vol 108-109 ◽  
pp. 561-566 ◽  
Author(s):  
F. Danie Auret ◽  
A.G.M. Das ◽  
C. Nyamhere ◽  
M. Hayes ◽  
N.G. van der Berg
Keyword(s):  
Thermal Stability ◽  
Electron Beam ◽  
Barrier Height ◽  
Deep Level ◽  
Schottky Contact ◽  
Depletion Region ◽  
Schottky Contacts ◽  
Electron Beam Deposition ◽  
Transient Spectroscopy ◽  
Beam Deposition

In this study we have investigated the thermal stability (in the range 100 oC - 900 oC) of defects introduced in p-Si by electron beam deposition (EBD) of Ti and Ti/Mo Schottky contacts. The depletion regions below these contacts were probed by conventional deep level transient spectroscopy (DLTS) as well as Laplace (high-resolution) DLTS (L-DLTS). We have chosen Ti as the Schottky contact because the barrier height of Ti/p-Si (0.53 eV) is close to that of TiSi2/p-Si (0.50 eV) that forms after annealing at 600 – 650 oC. The Mo was added on top of the Ti in order to prevent annealing degradation. These contacts were annealed in Ar at temperatures of up to 900 oC in 100 oC steps for half-hour periods. Current – voltage (I-V) and capacitance – voltage (C-V) measurements were used to monitor the quality of the Schottky contacts. DLTS was performed after each annealing cycle to monitor the presence of the EBD-induced defects and to obtain heir electronic properties. We have found that that the Ti/Mo contacts were superior to the Ti contacts. Their (Ti/Mo) barrier height after EBD was 0.52 eV and it gradually increased to 0.56 eV after annealing at 500 oC - 600oC and then dropped to 0.50 eV annealing at 700 oC. DLTS revealed that the main defects introduced during metallization are hole traps H(0.17), H(0.23), H(0.37) and H(0.49). Annealing at 350 oC introduced an additional hole trap H(0.39). After annealing at 550 oC all defects were removed from the depletion region.

Nucleation and Early Growth of Sputtered thin Films

1970 ◽  
Vol 28 ◽  
pp. 516-517
Author(s):  
Dudley M. Sherman ◽  
Thos. E. Hutchinson
Keyword(s):  
Thin Films ◽  
Electron Beam ◽  
Ion Beam ◽  
Ion Source ◽  
Water Cooling ◽  
Stages Of Growth ◽  
Lens Assembly ◽  
Microscope Technique ◽  
Ion Beam Sputter Deposition

The in situ electron microscope technique has been shown to be a powerful method for investigating the nucleation and growth of thin films formed by vacuum vapor deposition. The nucleation and early stages of growth of metal deposits formed by ion beam sputter-deposition are now being studied by the in situ technique.A duoplasmatron ion source and lens assembly has been attached to one side of the universal chamber of an RCA EMU-4 microscope and a sputtering target inserted into the chamber from the opposite side. The material to be deposited, in disc form, is bonded to the end of an electrically isolated copper rod that has provisions for target water cooling. The ion beam is normal to the microscope electron beam and the target is placed adjacent to the electron beam above the specimen hot stage, as shown in Figure 1.

Metal silicide Schottky barriers on Si and Ge show weaker Fermi level pinning

2012 ◽  
Vol 101 (5) ◽  
pp. 052110 ◽  
Author(s):  
L. Lin ◽  
Y. Guo ◽  
J. Robertson
Keyword(s):  
Fermi Level ◽  
Schottky Barriers ◽  
Metal Silicide ◽  
Fermi Level Pinning

Mass analyzer using electron‐beam‐guiding type ion source

1979 ◽  
Vol 50 (12) ◽  
pp. 1517-1520 ◽  
Author(s):  
Tohru Kishi ◽  
Isao Yamada ◽  
Toshinori Takagi
Keyword(s):  
Electron Beam ◽  
Ion Source ◽  
Mass Analyzer
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