The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

1998 ◽  
Vol 516 ◽  
Author(s):  
Peng Su ◽  
Chen Zhou ◽  
Sven Rzepka ◽  
Matt Korhonen ◽  
Che-Yu Li
Keyword(s):  
Fatigue Damage ◽  
Flip Chip ◽  
Solder Joints ◽  
Integral Approach ◽  
Damage Rate ◽  
Power Cycling ◽  
Chip Carrier ◽  
Type Relation ◽  
Accelerated Thermal Cycling ◽  
Total Damage

AbstractThermal fatigue of flip-chip solder joints between a chip and chip carrier is a serious reliability concern. Differences in the temperature and/or in the coefficients of thermal expansion between the chip and substrate lead to stresses which may result in fatigue damage and eventual failure of the interconnect. Conventionally, the solder lives have been estimated by a Coffin-Manson type relation. However, this largely empirical approach becomes inadequate when comparing thermal histories that are widely different, as in the cases of accelerated thermal cycling and power cycling. In this study, we use a damage integral approach where the fatigue damage rate is calculated based on the momentary stress and strain (estimated analytically) experienced by the solder joints. The momentary damage is then integrated over the entire loading history to yield total damage at any moment.

Shorter Field Life in Power Cycling for Organic Packages

2006 ◽  
Vol 129 (1) ◽  
pp. 28-34 ◽  
Author(s):  
S. B. Park ◽  
Izhar Z. Ahmed
Keyword(s):  
Fatigue Life ◽  
Temperature Distribution ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Uniform Temperature ◽  
Transfer Coefficients ◽  
Solder Interconnects ◽  
Power Cycling ◽  
Plastic Ball ◽  
Accelerated Thermal Cycling

The importance of power cycling as a mean of reliability assessment was revisited for flip chip plastic ball grid array (FC-PBGA) packages. Conventionally, reliability was addressed empirically through accelerated thermal cycling (ATC) because of its simplicity and conservative nature of life prediction. It was well accepted and served its role effectively for ceramic packages. In reality, an assembly is subjected to a power cycling, i.e., nonuniform temperature distribution with a chip as the only heat source and other components as heat dissipaters. This non-uniform temperature distribution and different coefficient of thermal expansion (CTE) of each component make the package deform differently than the case of uniform temperature in ATC. Higher substrate CTE in a plastic package generates double curvature in the package deformation and transfers higher stresses to the solder interconnects at the end of die. This mechanism makes the solder interconnects near the end of die edge fail earlier than those of the highest distance to neutral point. This phenomenon makes the interconnect fail earlier in power cycling than ATC. Apparently, we do not see this effect (the die shadow effect) in ceramic packages. In this work, a proper power cycling analysis procedure was proposed and conducted to predict solder fatigue life. An effort was made for FC-PBGA to show the possibility of shorter fatigue life in power cycling than the one of ATC. The procedure involves computational fluid dynamics (CFD) and finite element analyses (FEA). CFD analysis was used to extract transient heat transfer coefficients while subsequent FEA–thermal and FEA–structural analyses were used to calculate temperature distribution and strain energy density, respectively.

A Damage Integral Approach to Solder Joint Fatigue

1990 ◽  
Vol 203 ◽  
Author(s):  
C.-Y. Li ◽  
R. Subrahmanyan ◽  
J. McGroarty
Keyword(s):  
Solder Joint ◽  
Crack Growth ◽  
Fatigue Damage ◽  
Constitutive Relations ◽  
Failure Criteria ◽  
Integral Approach ◽  
State Variable ◽  
Damage Rate ◽  
Solder Joint Fatigue ◽  
Data Representative

ABSTRACTThe application of a damage integral approach which provides numerical accounting of the accumulated fatigue damage in solder joint is reviewed. The instantaneous fatigue damage rate is determined by the solder stress state, temperature and environment using a phenomenological crack growth law. The stress is calculated using state variable constitutive relations for inelastic deformation. The material parameters for the crack growth law are determined from isothermal fatigue data. Representative damage integral calculations are used to illustrate the application of the approach. Finally, the significance of failure criteria on the apparent fatigue life is discussed in terms of the damage integral approach.

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

2011 ◽  
Vol 99 (8) ◽  
pp. 082114 ◽  
Author(s):  
Tian Tian ◽  
Feng Xu ◽  
Jung Kyu Han ◽  
Daechul Choi ◽  
Yin Cheng ◽  
...  
Keyword(s):  
High Resolution ◽  
Synchrotron Radiation ◽  
Flip Chip ◽  
Solder Joints ◽  
Failure Time ◽  
Rapid Diagnosis

A Comparison of Fracture Mechanics and S–N Curve Approaches in Designing Drill Pipe

1992 ◽  
Vol 114 (3) ◽  
pp. 205-211 ◽  
Author(s):  
A. Ertas ◽  
G. Mustafa ◽  
O. Cuvalci
Keyword(s):  
Fracture Mechanics ◽  
Fatigue Damage ◽  
Drill Pipe ◽  
Ball Joint ◽  
Marine Riser ◽  
Deep Drilling ◽  
Miner’S Rule ◽  
Miner's Rule ◽  
Total Damage ◽  
Dynamic Fatigue

It is well known that the upper ball joint in a marine riser, in deep drilling, can cause fatigue damage in the drill pipe passing through it. A study of fracture mechanics and S–N curve approaches has been undertaken to determine the dynamic fatigue damage in the drill pipe. Miner’s rule is utilized in both methods to determine the total damage. The results of both methods are compared.

Crack Propagation Experiments on Flip Chip Solder Joints

1998 ◽  
Vol 515 ◽  
Author(s):  
S. Wiese ◽  
F. Feustel ◽  
S. Rzepka ◽  
E. Meusel
Keyword(s):  
Crack Propagation ◽  
Flip Chip ◽  
Solder Joints ◽  
Shear Loading ◽  
Displacement Curve ◽  
In Situ Experiments ◽  
Propagation Experiment ◽  
Crack Propagation Experiment ◽  
Number Of Cycles ◽  
Force Displacement

ABSTRACTThe paper presents crack propagation experiments on real flip chip specimens applied to reversible shear loading. Two specially designed micro testers will be introduced. The first tester provides very precise measurements of the force displacement hysteresis. The achieved resolutions have been I mN for force and 20 nm for displacement. The second micro tester works similar to the first one, but is designed for in-situ experiments inside the SEM. Since it needs to be very small in size it reaches only resolutions of 10 mN and 100nm, which is sufficient to achieve equivalence to the first tester. A cyclic triangular strain wave is used as load profile for the crack propagation experiment. The experiment was done with both machines applying equivalent specimens and load. The force displacement curve was recorded using the first micro mechanical tester. From those hysteresis, the force amplitude has been determined for every cycle. All force amplitudes are plotted versus the number of cycles in order to quantify the crack length. With the second tester, images were taken at every 10th … 100th cycle in order to locate the crack propagation. Finally both results have been linked together for a combined quatitive and spatial description of the crack propagation in flip chip solder joints.

Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration

2006 ◽  
Vol 89 (22) ◽  
pp. 221906 ◽  
Author(s):  
Fan-Yi Ouyang ◽  
K. N. Tu ◽  
Yi-Shao Lai ◽  
Andriy M. Gusak
Keyword(s):  
Entropy Production ◽  
Flip Chip ◽  
Solder Joints ◽  
Microstructure Change ◽  
Eutectic Snpb
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