Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

2011 ◽  
Vol 99 (8) ◽  
pp. 082114 ◽  
Author(s):  
Tian Tian ◽  
Feng Xu ◽  
Jung Kyu Han ◽  
Daechul Choi ◽  
Yin Cheng ◽  
...  
Keyword(s):  
High Resolution ◽  
Synchrotron Radiation ◽  
Flip Chip ◽  
Solder Joints ◽  
Failure Time ◽  
Rapid Diagnosis

Effect of Al trace dimension on electromigration failure time of flip-chip solder joints

2006 ◽  
Vol 35 (9) ◽  
pp. 1740-1744 ◽  
Author(s):  
S. H. Chiu ◽  
Chih Chen ◽  
D. J. Yao
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Failure Time

Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints

2010 ◽  
Vol 39 (10) ◽  
pp. 2316-2323
Author(s):  
S. W. Liang ◽  
H. Y. Hsiao ◽  
Chih Chen
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Failure Time

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

2013 ◽  
Author(s):  
Hiroyuki Tsuritani ◽  
Toshihiko Sayama ◽  
Yoshiyuki Okamoto ◽  
Takeshi Takayanagi ◽  
Kentaro Uesugi ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Synchrotron Radiation ◽  
Crack Propagation ◽  
Flip Chip ◽  
Solder Joints ◽  
Fatigue Cracks ◽  
Propagation Process ◽  
X Ray ◽  
Micro Cracks ◽  
Crack Propagation Process

The reliability and lifetime of micro-joints on printed circuit boards (PCBs) is significantly affected by fatigue processes, including fatigue crack initiation and propagation to failure. Accordingly, the industries producing electronic devices and components strongly desire the development of a new nondestructive inspection technology, which detects micro-cracks appearing as thermal fatigue fractures in these joints. Accordingly, the authors have demonstrated that the micro-cracks in the micro-solder joints can be observed using the SP-μCT synchrotron X-ray micro tomography system. However, in order for such solder joint micro-cracks to be observable by SP-μCT, the observation object must have a diameter of less than roughly 1 mm. In this investigation, we applied a synchrotron radiation X-ray laminography system to three-dimensionally and nondestructively evaluate the fatigue crack propagation process in flip chip solder micro-joints. X-ray laminography is a technique for nondestructively observing planar objects. The optical system developed for use in X-ray laminography was constructed to provide the rotation stage with a 20° tilt from the horizontally incident X-ray beam. For this reason, X-rays were sufficiently transmitted through the planar object, in all directions. The observed specimens had a flip chip structure, in which a 10.04 mm square LSI chip is connected to a 52.55 mm (length) × 30.0 mm (width) FR-4 substrate by 120 μm diameter Sn-3.0wt%Ag-0.5wt%Cu lead-free solder bumps. A thermal cycle test was carried out, and specimens were collected at fixed cycle numbers. The same solder joints were observed successively using the synchrotron radiation X-ray laminography system at beamline BL20XU at SPring-8, the largest synchrotron radiation facility in Japan. An X-ray beam energy of 29.0 keV was selected to obtain laminography images with high contrast among component. The obtained laminography images clearly show the evolution of cracks, voids, and the Ag3Sn phase due to the thermal cyclic loading of the solder joints. In addition, the surface area of the same fatigue cracks was also measured, to quantify the crack propagation process. However, the surface area change measured by laminography differed from the crack propagation results obtained by standard SP-μCT. This difference may be due to an inability to observe some micro-cracks, due to crack closure to beneath than the detection limit of synchrotron radiation X-ray laminography. Consequently, these results demonstrate the possibility that nondestructive observation of fatigue cracks in the solder bumps on a large size electronic substrate by synchrotron radiation X-ray laminography, although its detection ability for narrow cracks may be limited, compared to SP-μCT.

Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints

2011 ◽  
Vol 127 (1-2) ◽  
pp. 85-90 ◽  
Author(s):  
Y.W. Chang ◽  
S.H. Chiu ◽  
Chih Chen ◽  
D.J. Yao
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Failure Time

ANALYSIS OF THE ATOMIC Fe3d AND 4s PARTIAL CROSS SECTIONS IN THE REGION OF THE 3p → 3d GIANT RESONANCE

2002 ◽  
Vol 09 (02) ◽  
pp. 1229-1233 ◽  
Author(s):  
S. B. WHITFIELD ◽  
R. WEHLITZ ◽  
M. O. KRAUSE ◽  
C. D. CALDWELL
Keyword(s):  
High Resolution ◽  
Synchrotron Radiation ◽  
Cross Sections ◽  
Systematic Study ◽  
Giant Resonance ◽  
Fitting Procedure

Using the technique of photoelectron spectrometry in conjunction with synchrotron radiation, we have carried out a systematic study of the partial cross sections of the main photoelectron lines arising from the ionization of the 3d and 4s subshells of atomic Fe in the vicinity of 3p → 3d autoionizing resonances. Our results confirm the presence of two broad and intense resonances which have been observed earlier. However, our high resolution results also clearly indicate the presence of numerous other weaker resonances. Through a fitting procedure we were able to accurately determine both resonance widths and positions.

Broadband THz high-resolution interferometry using coherent synchrotron radiation

2012 ◽  
Author(s):  
J. Barros ◽  
L. Manceron ◽  
J.-B. Brubach ◽  
C. Evain ◽  
M.-E. Couprie ◽  
...  
Keyword(s):  
High Resolution ◽  
Synchrotron Radiation ◽  
Coherent Synchrotron Radiation

High-resolution three-dimensional imaging of flat objects by synchrotron-radiation computed laminography

2005 ◽  
Vol 86 (7) ◽  
pp. 071915 ◽  
Author(s):  
L. Helfen ◽  
T. Baumbach ◽  
P. Mikulík ◽  
D. Kiel ◽  
P. Pernot ◽  
...  
Keyword(s):  
High Resolution ◽  
Synchrotron Radiation ◽  
Three Dimensional ◽  
Three Dimensional Imaging ◽  
Computed Laminography

3-Dimensional Characterization of Polycrystalline Bulk Materials Using High-Energy Synchrotron Radiation

2007 ◽  
Vol 539-543 ◽  
pp. 2353-2358 ◽  
Author(s):  
Ulrich Lienert ◽  
Jonathan Almer ◽  
Bo Jakobsen ◽  
Wolfgang Pantleon ◽  
Henning Friis Poulsen ◽  
...  
Keyword(s):  
High Resolution ◽  
Synchrotron Radiation ◽  
High Energy ◽  
Mapping Technique ◽  
X Ray Diffraction ◽  
Bulk Materials ◽  
Reciprocal Space Mapping ◽  
3 Dimensional ◽  
Individual Grains

The implementation of 3-Dimensional X-Ray Diffraction (3DXRD) Microscopy at the Advanced Photon Source is described. The technique enables the non-destructive structural characterization of polycrystalline bulk materials and is therefore suitable for in situ studies during thermo-mechanical processing. High energy synchrotron radiation and area detectors are employed. First, a forward modeling approach for the reconstruction of grain boundaries from high resolution diffraction images is described. Second, a high resolution reciprocal space mapping technique of individual grains is presented.

Sign in / Sign up

Export Citation Format

Share Document