A Polysilicon Tft Parameter Extractor

1998 ◽  
Vol 507 ◽  
Author(s):  
O.K.B. Lui ◽  
S.W.B. Tam ◽  
P. Migliorato

ABSTRACTThe achievement of large size displays and the capability of high throughput low temperature laser re-crystallised polysilicon TFTs to provide complex circuitry has opened up new market opportunities, such as the “system on panel” architecture, where the circuitry necessary for the operation of an interactive portable computer is to be fabricated on the display substrate. In the development of polysilicon technology for these applications, device physics and modelling are expected to play a major role as they have done in the case of single crystal silicon. However, polysilicon TFTs present a much higher level of complexity than single crystal devices, due to the presence of grain boundaries and associated defects which drastically affect the electrical properties. For the first time, a polysilicon TFT parameter extractor has been developed based on data from capacitance (C-V) and conductance (I-V) measurements. The method yields the flat band voltage, the front interface state density and the bulk density-of-states (DOS) for the entire range. The method is applied to laser re-crystallised polysilicon TFTs and verified via comparison with 2-D simulation. It is found that this technique allows a much higher degree of accuracy than other methods published so far.

2019 ◽  
Vol 7 (6) ◽  
pp. 1720-1725 ◽  
Author(s):  
Qingzhi Chen ◽  
Jay A. Switzer

Silver films were deposited epitaxially for the first time onto low-index, single-crystal silicon wafers through an electrochemical method in an aqueous silver acetate bath.


1981 ◽  
Vol 5 ◽  
Author(s):  
Rajiv R. Shah ◽  
D. Randy Hollingsworth ◽  
D. Lloyd Crosthwait

ABSTRACTWe demonstrate, for the first time, a technique for the fabrication of polysilicon resistors with excellent control and temperature characteristics: a standard deviation of 2.5 Ω/□ and temperature variation of -5.6% from 25° to 125°C for 1.96kΩ/□, 4.5 × 1014 cm˗2 boron implanted polysilicon resistors. The technique is based on fabricating resistors in laser recrystallized polysilicon on SiO2. Resistor performance is compared to that of similar resistors fabricated in standard LPCVD polysilicon and in single crystal silicon.


Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


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