Field Emission From Tetrahedrally Bonded Amorphous Carbon as a Function of Surface Treatment and Contact Material

1997 ◽  
Vol 498 ◽  
Author(s):  
W. I. Milne ◽  
J. Robertson ◽  
B. S. Satyanarayana ◽  
A. Hart ◽  
B. Kleinsorge

ABSTRACTIn order to test whether field emission from tetrahedrally bonded amorphous (ta-C) is affected by the back contact material we have carried out a series of emission experiments on Filtered Cathodic Vacuum Arc (FCVA) produced ta-C films. The measurements were made on identical films of approximately 25 nm thickness which have been grown simultaneously on various substrates of different work function. For these experiments the substrates used were p-type c-Si, n-type c-Si, SnO2, tungsten, gold, lead, aluminium, molybdenum, chromium and titanium. Threshold fields for emission were generally in the range of 5–15 V/micron and showed no direct dependence on back contact material work function. Films grown on Ti and W however had much higher threshold fields in the range 30–35 V/micron and this is thought to be associated with the native oxide which was present between the back contact and the ta-C film. As grown ta-C is also known to have a 1–2 nm thick sp2 rich layer on its surface and this layer may also have some effect on field emission. The layer was etched in either an O2 or H2 plasma and both etched surfaces led to improved emission efficiency.

1999 ◽  
Vol 558 ◽  
Author(s):  
A.I. Kosarev ◽  
A.S. Abramov ◽  
A.J. Vinogradov ◽  
M.V. Shutov ◽  
T.E. Felter ◽  
...  

ABSTRACTAs previously demonstrated, non-diamond carbon (NDC) films deposited at low temperatures 200-300 °C on silicon tips reduced the threshold of field emission. In this paper we will present the results of the study of field emission from flat NDC films prepared by VHF CVD. Emission measurements were performed in a diode configuration at approximately 10−10 Torr. NDC films were deposited on ceramic and on c-Si substrates sputter coated with layers of Ti, Cu, Ni and Pt. The back contact material influences the emission characteristics but not as a direct correlation to work function. A model of field emission from metal-NDC film structures will be discussed.


1997 ◽  
Vol 471 ◽  
Author(s):  
W. I. Milne ◽  
J. Robertson ◽  
B. S. Satyanarayanan ◽  
A. Hart

ABSTRACTA series of tetrahedrally bonded carbon (ta-C) films have been produced using a Filtered Cathodic Vacuum Arc System. The threshold field and current densities achievable have been investigated as a function of sp3/sp2 bonding ratio and nitrogen content. Typical undoped ta-C films have a threshold field of 15–20V/μm and optimally nitrogen doped films exhibit threshold fields as low as ∼ 5 V/μm. Current densities of typically 10-4 A/cm2 at an applied field of 20V/micron were also obtained.


2002 ◽  
Vol 16 (06n07) ◽  
pp. 933-945 ◽  
Author(s):  
B. K. TAY ◽  
Y. H. CHENG ◽  
S. P. LAU ◽  
X. SHI

Nanocomposite amorphous carbon (a-C:Me) films including a-C:Ni , a-C:Co , a-C:Ti , a-C:W , a-C:Fe , a-C:Al , and a-C:Si films were deposited using metal-carbon composite target by filtered cathodic vacuum arc (FCVA) technique. Atomic force microscopy (AFM), Raman, and X-ray photoelectron spectroscopy (XPS) were used to characterize the morphology and structure of the films. Nanoindenter and surface profilometer were used to determine the hardness, Young's modulus, and internal stress. Contact angle and field emission experiments were used to study the surface energy and field emission properties of the films respectively. The influence of the type of elements and its composition in the target on the structural, mechanical, surface energy, and field emission properties were studied. The incorporation of elements into the films results in the decrease of sp 3 C fraction, internal stress in the deposited films, but the hardness and Young's modulus remains at high level. The effect of non-carbide forming elements in the films on the mechanical properties is more pronounced than that of carbide forming elements. The surface energy of the films increases with incorporating Ni atoms, but decreases after incorporating Fe and Al atoms into the films. After heat treatment, the incorporation of metal into ta-C films can greatly improve the field emission performance.


1996 ◽  
Vol 423 ◽  
Author(s):  
F. J. Clough ◽  
B. Kleinsorge ◽  
W. I. Milne ◽  
J. Robertson

AbstractThis paper describes the design and fabrication of a carbon based thin film transistor (TFT). The active layer is formed from a novel form of amorphous carbon (a-C) known as tetrahedrally bonded amorphous carbon (ta-C) which can be deposited at room temperature using a filtered cathodic vacuum arc (FCVA) technique. In its ‘as grown’ condition, ta-C is p-type and the devices described here, produced using undoped material, exhibit p-channel operation.


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