Modeling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects

1997 ◽  
Vol 490 ◽  
Author(s):  
S. P. Riege ◽  
V. Andleigh ◽  
C. V. Thompson ◽  
H. J. Frost
Keyword(s):  
Grain Growth ◽  
Volume Fraction ◽  
Grain Structure ◽  
Structure Evolution ◽  
2D Simulation ◽  
Grain Structures ◽  
Average Grain Size ◽  
Interconnect Reliability ◽  
Bamboo Structure ◽  
Cu Thin Film

ABSTRACTWe have extended a 2D simulation of grain growth to treat the effects of precipitates on the evolution of interconnect grain structures during post-patterning processing. It is known from experiments that different annealing histories result in different precipitate sizes and locations. Precipitates capture and effectively pin grain boundaries and inhibit grain growth and evolution toward bamboo structures. We find that even a small volume fraction of precipitates prevent an interconnect strip from reaching the fully bamboo structure by retarding grain growth and lowering the average grain size. At a late stage of evolution, cluster regions are pinned by precipitates on both sides, preventing further transformation to the by far more reliable bamboo structure. The results from grain growth simulations have been used with our electromigration simulator MTT/EmSim to investigate the dependence of interconnect reliability on linewidth and precipitate distribution. We find that in lines with precipitates the bamboo structure is not reached during post-pattern annealing even if the line width is smaller than the average grain diameter. Furthermore, it is found that while Cu in solid solution improves interconnect reliability, Al2Cu precipitates can inhibit post-patterning grain structure evolution to more reliable bamboo or near-bamboo structures so much that similar lines made of pure Al would be more reliable. Linked grain structure evolution and electromigration simulations allow process optimization for maximum interconnect reliability.

Computer Simulation of Grain Growth in Thin-film Interconnect Lines

1991 ◽  
Vol 225 ◽  
Author(s):  
D. T. Walton ◽  
H. J. Frost ◽  
C. V. Thompson
Keyword(s):  
Thin Film ◽  
Grain Boundary ◽  
Grain Growth ◽  
Integrated Circuit ◽  
Strip Width ◽  
Grain Structure ◽  
Time To Failure ◽  
Interconnect Reliability ◽  
Bamboo Structure ◽  
Individual Grains

ABSTRACTMicrostructural evolution in thin-film strips is of interest due to the direct effect of grain structure on integrated circuit interconnect reliability and resistance to electromigration-induced failure. We have explored the evolution of interconnect grain structure via a two-dimensional grain growth simulation. We focus on the strip's transformation to the bamboo structure, in which individual grains traverse the width of the strip. We find that the approach to a fully bamboo structure is exponential, and that the rate of transformation is inversely proportional to the square of the strip width. When the simulation is extended to model grain boundary pinning due to grooving at grain boundary – free surface intersections, we find that there exists a maximum strip width to thickness ratio beyond which the transformation to the bamboo structure does not proceed to completion. By using our simulation results in conjunction with a “failure unit” model for electromigration-induced failure [4] we are able to reproduce the experimentally observed abrupt increase in time-to-failure below a critical strip width, and also model the reliability as a function of annealing conditions.

The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects

1995 ◽  
Vol 391 ◽  
Author(s):  
B. D. Knowlton ◽  
R. I. Frank ◽  
C. V. Thompson
Keyword(s):  
Grain Growth ◽  
Grain Structure ◽  
Strong Function ◽  
Cu Interconnects ◽  
Cu Content ◽  
Grain Structures ◽  
Interconnect Reliability ◽  
Order Of Magnitude ◽  
History Of ◽  
Lifetime Testing

AbstractThe reliability of Al-Cu interconnects is a strong function of both grain structure and the Cu content and distribution. Because pre-patteming and post-patterning grain growth are affected by the presence of Al2Cu precipitates, the effects of grain structure and Cu distribution are interrelated. We have studied the effect of Al2Cu precipitate spacing on interconnect reliability independent of grain size effects. This was accomplished by varying the thermal history of the continuous films to produce samples with identical grain structures, but different precipitate spacings. The precipitate spacing in continuous films was varied by an order of magnitude, from 2.6 μm to 25. pm. Lines were then patterned from each sample and tested. Lifetime testing results show that the reliability of lines with smaller precipitate spacings can be roughly an order of magnitude higher than that of lines with a larger precipitate spacing. We have also qualitatively studied the effects of Cu distribution on post-patterning grain growth. We found that precipitates retard post-patterning grain evolution, leading to reduced reliability. These results suggest strategies for developing thermal histories which will lead to optimal reliability.

Physical Based Microstructure Modelling Coupled with Nucleation Theory during and after Hot Forming of AA5083

2010 ◽  
Vol 89-91 ◽  
pp. 509-514
Author(s):  
Pavel Sherstnev ◽  
Christof Sommitsch ◽  
Stefan Mitsche ◽  
Carsten Melzer
Keyword(s):  
Aluminium Alloy ◽  
Hot Rolling ◽  
Volume Fraction ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Nucleation Theory ◽  
Structure Evolution ◽  
Nucleation Sites ◽  
Nucleation Mechanisms ◽  
Backscatter Diffraction

A physical model based on three types of dislocations and three nucleation sites for recrystallized grain is applied to hot rolling simulation. This model was implemented into a commercial Finite Element (FE) analysis package FORGE 2008 to calculate both the structure evolution during and the recrystallized volume fraction after hot working of aluminium alloy 5083. It is shown that the main nucleation mechanisms in the aluminium alloy are the particle stimulated nucleation (PSN) and nucleation at grain boundaries. Hence the precipitation kinetics during homogenisation was investigated by use of the thermodynamic calculation software MatCalc. To validate the simulation results hot rolling experiments were performed by means of a laboratory mill. The grain structure evolution was analysed by electron backscatter diffraction (EBSD).

The Effect of Variability Among Grain Boundary Energies on Grain Growth in Thin Film Strips

1994 ◽  
Vol 338 ◽  
Author(s):  
H.J. Frost ◽  
Y. Hayashi ◽  
C.V. Thompson ◽  
D.T. Walton
Keyword(s):  
Thin Film ◽  
Grain Boundary ◽  
Grain Growth ◽  
Boundary Energy ◽  
Strip Width ◽  
Grain Boundary Energy ◽  
Triple Junctions ◽  
Interconnect Reliability ◽  
Bamboo Structure ◽  
Grain Boundary Pinning

ABSTRACTGrain growth in thin-film strips is important to interconnect reliability because grain boundary structures strongly effect the rate and mechanism of electromigration-induced failure. Previous simulations of this process have indicated that the transformation to the fully bamboo structure proceeds at a rate which decreases exponentially with time, and which is inversely proportional to the square of the strip width. We have also reported that grain boundary pinning due to surface grooving implies that there exists a maximum strip width to thickness ratio beyond which the transformation to the bamboo structure does not proceed to completion. In this work we have extended our simulation of grain growth in thin films and thin film strips to consider the effects of variations in grain boundary energy. Boundary energy is taken to depend on the misorientation between the two neighboring grain and the resulting variations in grain boundary energy mean that dihedral angles at triple junctions deviate from 120°. The proportionality between boundary velocities and local curvatures, and the critical curvature for boundary pinning due to surface grooving also both depend on boundary energy. In the case of thin-film strips, the effect of boundary energy variability is to impede the transformation to the bamboo structure, and reduce the width above which the complete bamboo structure is never reached. Those boundaries which do remain upon stagnation tend to be of low energy (low misorientation angle) and are therefore probably of low diffusivity, so that their impact on reliability is probably reduced.

Annealing Treatment for Superplastic Forming of Twin Roll Casted AZ31 Magnesium Sheet

2011 ◽  
Vol 239-242 ◽  
pp. 50-54 ◽  
Author(s):  
Guo Dong Shi ◽  
Jun Qiao
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Mechanical Test ◽  
Dynamic Balance ◽  
Annealing Treatment ◽  
Optical Microscope ◽  
Grain Structure ◽  
Average Grain Size ◽  
Az31 Sheet ◽  
Twin Roll

Annealing treatments at 200°C, 250 °C, 300°C, and 350°C were conducted on a twin-roll casted AZ31 sheet with an initial average grain size of 10.11 mm. Microstructure and mechanical behaviors were studied by optical microscope observation and tensile mechanical test. Expermeintal results show that grain size experienced three stage evolution during 180 min annealing at each temperature: recrystallization refinement, stabilization under dynamic balance of recrystallization and grain growth, and grain growth. The minimum average grain size of 5.96 μm was achieved after 120 min annealing at 200°C. The refined grain structure causes a decrease of ultimate tensile strength and an increase of elongation, and facilitates superplastic deformation of the material.

Characterization of Plated Cu Thin Film Microstructures

1999 ◽  
Vol 564 ◽  
Author(s):  
L. M. Gignac ◽  
K. P. Rodbel ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
P. M. Rice ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Grain Structure ◽  
Grain Structures ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Gaussian Fit ◽  
Cu Thin Film ◽  
Log Normal ◽  
Electron Imaging

AbstractElectroplated Cu was found to have a fine as-plated microstructure, 0.05 ± 0.03 μm, with multiple grains through the film thickness and evidence of twins and dislocations within grains. Over time at room temperature, the grains grew to greater than 1 μm in size. Studied as a function of annealing temperature, the recrystallized grains were shown to be 1.6 ± 1.0 μm in size, columnar and highly twinned. The grain growth was directly related to the time dependent decrease in sheet resistance. The initial grain structure was characterized using scanning transmission electron microscopy (STEM) from a cross-section sample prepared by a novel focused ion beam (FIB) and lift-out technique. The recrystallized grain structures were imaged using FIB secondary electron imaging. From these micrographs, the grain boundary structures were traced, and an image analysis program was used to measure the grain areas. A Gaussian fit of the log-normal distribution of grain areas was used to calculate the mean area and standard deviation. These values were converted to grain size diameters by assuming a circular grain geometry.

Abnormal Grain Growth in Metals

2007 ◽  
Vol 558-559 ◽  
pp. 717-722 ◽  
Author(s):  
J. Dennis ◽  
Pete S. Bate ◽  
John F. Humphreys
Keyword(s):  
Grain Growth ◽  
Volume Fraction ◽  
Abnormal Grain Growth ◽  
Grain Structure ◽  
Second Phase ◽  
Boundary Misorientation ◽  
Phase Volume Fraction ◽  
Abnormal Growth ◽  
Grain Boundary Misorientation ◽  
Dominant Characteristic

Grain growth may occur in two forms, normal grain growth, characterized by a constant grain size distribution during growth, and abnormal grain growth, where one or more abnormally large grains may form in the microstructure. The presence of abnormally large grains in an otherwise uniform microstructure may be detrimental to the mechanical properties of a polycrystalline structure. Little is understood of the exact cause of abnormal grain growth. The annealing conditions leading to the onset of abnormal grain growth have been investigated via a series of grain growth experiments carried out on an Al-4wt%Cu alloy. The structure of which consisted of equiaxed grains (<8μ) pinned by a fine dispersion of sub-micron second phase particles, which may dissolve upon annealing. Minority texture components may experience accelerated growth due to a higher energy and mobility compared to the surrounding grain structure. The combination of these two events may result in the abnormal growth of some grains. SEM imaging and EBSD data has then made it possible to characterize the influence of particle dissolution and grain boundary misorientation on the onset of abnormal grain growth. The stability of ‘island grains’ found to exist internally in abnormally large grains has also been investigated in relation to the misorientation relationship and localized second phase volume fraction found there. There was only weak evidence of special misorientation relationships between the island grains and the abnormally large grains in which they exist, and although there was evidence of an enhanced fraction of pinning particles at island grain boundaries, this was also true of boundaries in general. The larger size of island grains is their dominant characteristic, and grains which become island grains may have been incipient abnormal grains.

Simulation of the Grain Structure Evolution of a Mg-Al-Ca-Based Alloy during Hot Extrusion Using the Cellular Automation Method

2011 ◽  
Vol 491 ◽  
pp. 265-272 ◽  
Author(s):  
L. Li ◽  
F. He ◽  
X. Liu ◽  
Yan Lou ◽  
Jie Zhou ◽  
...  
Keyword(s):  
Hot Extrusion ◽  
Extrusion Process ◽  
Grain Structure ◽  
Structure Evolution ◽  
Compression Tests ◽  
3D Fem ◽  
Parameter Recovery ◽  
Cellular Automation ◽  
Average Grain Size ◽  
Ram Speed

In the present study, the evolution of the grain structure of a Mg-Al-Ca-based alloy during hot extrusion was simulated with the cellular automation method. The Laasraoui-Jonas microstructure model was used to describe the dislocation evolution inside crystallites during dynamic recrystallization. The parameters in the Laasraoui-Jonas model, such as the hardening parameter, recovery parameter and material constants, were determined from the flow stress-strain data obtained from hot compression tests using a Gleeble-1500 thermomechanical simulator. The extrusion process was simulated using a DEFORM 3D FEM code. The influence of ram speed on grain structure evolution was analyzed. It was found that the average grain size increases with increasing ram speed. Good agreements between the predicted and observed grain structures were achieved.

Grain Structure Evolution during Grain Growth in 2-D Aluminum Foils

1994 ◽  
Vol 157-162 ◽  
pp. 1063-1068 ◽  
Author(s):  
Lasar S. Shvindlerman ◽  
Vera G. Sursaeva ◽  
R.G. Faulkner ◽  
V.Yu. Novikov
Keyword(s):  
Grain Growth ◽  
Grain Structure ◽  
Structure Evolution

Observations Of Grain Growth In Thin Films

1991 ◽  
Vol 238 ◽  
Author(s):  
D. A. Smith ◽  
S. J. Townsend ◽  
C. S. Nichols
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Growth ◽  
Pure Metal ◽  
Grain Structure ◽  
Metallic Films ◽  
Ion Probe ◽  
Grain Structures ◽  
Transmission Electron

ABSTRACTGrain growth occurs during the deposition and subsequent processing of metallic films. Observation of the grain structure by scanning ion probe microscopy and grain growth by in situ transmission electron microscopy using a heating stage serves to define some characteristic grain structures and their evolution in pure metal and alloy films used for metallisation.

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