Tensile Behavior of Free-Standing Gold Films

1997 ◽  
Vol 472 ◽  
Author(s):  
R.D. Emery ◽  
D.X. Lenshek ◽  
B. Behin ◽  
M. Gherasimova ◽  
G.L. Povirk
Keyword(s):  
Thin Film ◽  
Tensile Strength ◽  
Tensile Testing ◽  
Metal Film ◽  
Tensile Behavior ◽  
Gold Films ◽  
Free Standing ◽  
Microelectronic Fabrication ◽  
Silicon Frame ◽  
Bulk Gold

ABSTRACTA method for tensile testing thin gold films is presented. Free-standing tensile specimens were prepared by evaporating 0.8 μm of gold onto a patterned oxidized silicon wafer. Using common microelectronic fabrication techniques, free-standing thin film specimens were produced that span rectangular windows in the wafer. The wafer was diced into individual tensile specimens composed of a thin film surrounded by a silicon frame. The final step before testing was to cleave the silicon frame so that the load was completely carried by the metal film. The ultimate tensile strength of the films was found to be approximately 150% greater than that of annealed bulk gold. In contrast, the measured elastic modulus for the thin film specimens was approximately the same as that documented for bulk gold.

High Temperature Tensile Behavior Of Free-Standing Gold Films

1997 ◽  
Vol 505 ◽  
Author(s):  
R. Emery ◽  
C. Simons ◽  
B. Mazin ◽  
G. L. Povirk
Keyword(s):  
Low Temperatures ◽  
Tensile Testing ◽  
Elevated Temperatures ◽  
Tensile Tests ◽  
Tensile Behavior ◽  
Gold Films ◽  
Strain Rates ◽  
Free Standing ◽  
Increasing Temperature ◽  
High Temperature Tensile

ABSTRACTA method for tensile testing thin films at elevated temperatures is presented. Freestanding tensile specimens were prepared by evaporating 2.1 μm of gold onto a patterned oxidized silicon wafer. Tensile tests were performed at various temperatures up to 600°C. The ultimate tensile strengths of the films decreased as temperature increased, and ductility increased with increasing temperature. Films tested at high temperatures (≥ 400 °C) exhibited significant strain rate-dependence, while films tested at low temperatures (≤ 200 °C) were found to be virtually rate-independent. At higher temperatures and strain rates, stress-enhanced grain growth was observed.

Microstructure and Cryogenic Mechanical Properties of AA5083 Joints Prepared by Friction Stir Welding

2014 ◽  
Vol 788 ◽  
pp. 243-248 ◽  
Author(s):  
Bao Kang Gu ◽  
Da Tong Zhang
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Aluminum Alloy ◽  
Tensile Testing ◽  
Base Material ◽  
Tensile Behavior ◽  
Planar Slip ◽  
Friction Stir ◽  
5083 Aluminum Alloy ◽  
Cryogenic Mechanical Properties

In this study, 5083 aluminum alloy plates with a thickness of 3mm are friction stir welded and the microstructure and mechanical properties of the joints were characterized. In particular, tensile behavior of the joints is examined at 77K. It is found that defect-free joints can be obtained under a tool rotational rate of 800rpm and a welding speed of 60mm/min. The friction stirring welds exhibit finer microstructure and higher hardness than that of the base material due to the grain refinement. The ultimate tensile strength (UTS) and elongation of the joints measured at 298K are 316MPa and 21.3%, which are nearly equal to those of the base material. With the tensile test temperature decreasing to 77K, UTS and elongation of both the base material and joints increase. Comparing with tensile testing at 298K, dimples on the fracture surface of the samples tested at 77K are more uniform in distribution. The improvement of the mechanical properties of specimens at low temperature is related to the inactivation of planar slip and the strengthening of strain hardening.

Picosecond Ultrasonics Studies of the Effect of Ion Implantation on InterfAcial Bonding Between a thin Film and a Substrate

1997 ◽  
Vol 505 ◽  
Author(s):  
G. Tas ◽  
J. J. Loomis ◽  
H. J. Maris ◽  
A. A. Bailes ◽  
L. E. Seiberling
Keyword(s):  
Thin Film ◽  
Silicon Substrate ◽  
Metal Film ◽  
Ion Irradiation ◽  
Interfacial Bonding ◽  
Gold Films ◽  
Acoustic Vibrations ◽  
Helium Ions ◽  
Acoustic Damping ◽  
Picosecond Ultrasonics

ABSTRACTWe have used picosecond ultrasonics to study the effects of ion irradiation on the interfacial bonding between gold films and a silicon substrate. Acoustic vibrations are excited in the metal film when a picosecond light pulse is absorbed. The rate at which these vibrations damp out via sound transmission across the interface into the substrate gives a measure of the adhesion of the film to the substrate. The films were irradiated with 2.5 MeV helium ions with doses between 7×1014 and 8×1016 ions cm-2. The adhesion, as measured by the rate of acoustic damping, was found to be significantly improved by the ion irradiation.

Bulge Test on Free Standing Gold Thin Films

2003 ◽  
Vol 795 ◽  
Author(s):  
Yawen Li ◽  
Michael J. Cima
Keyword(s):  
Gold Film ◽  
Composite Films ◽  
Pure Gold ◽  
Bulge Test ◽  
Gold Films ◽  
Free Standing ◽  
Film Properties ◽  
Dense Microstructure ◽  
Mems Device ◽  
Bulk Gold

ABSTRACTBulge test was performed on gold and gold/nitride composite films with in plane sizes ranging from 20 to 200μm. The films were prepared using the microfabrication process of a drug delivery MEMS device, and the bulge test setup was constructed using some of the packaging components of the device. Incremental pressure at 5psi interval was applied to the films, whose deflection was measured using interferometry. The extracted gold film properties from bulge test on either pure gold films or composite films yielded comparable values. The lower modulus (126∼168 GPa) comparing with the bulk gold could be due to the less dense microstructure of the evaporated gold film.

Benefits of two-dimensional detectors for synchrotron X-ray diffraction studies of thin film mechanical behavior

2008 ◽  
Vol 41 (6) ◽  
pp. 1076-1088 ◽  
Author(s):  
Guillaume Geandier ◽  
Pierre-Olivier Renault ◽  
Simon Teat ◽  
Eric Le Bourhis ◽  
Bruno Lamongie ◽  
...  
Keyword(s):  
Thin Film ◽  
Tensile Testing ◽  
Gold Films ◽  
Two Dimensional ◽  
X Ray Diffraction ◽  
Reflection And Transmission ◽  
Strain Measurements ◽  
X Ray ◽  
Polycrystalline Thin Films

Performing a completein situmechanical property analysis of polycrystalline thin films using X-ray diffraction is time consuming with most standard diffraction beamlines at synchrotron facilities and not realistic with laboratory diffractometers. Two-dimensional detection is shown to enable relatively fast and reliable X-ray strain measurements duringin situtensile testing of gold films deposited on polyimide substrates. Advantages and drawbacks in the use of two-dimensional detectors for this type of analysis are discussed for two commonly used geometries: reflection and transmission.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

scholarly journals Tunable Perfect THz Absorber Based on a Stretchable Ultrathin Carbon-Polymer Bilayer

Materials ◽  
2019 ◽  
Vol 12 (1) ◽  
pp. 143 ◽  
Author(s):  
Alesia Paddubskaya ◽  
Marina Demidenko ◽  
Konstantin Batrakov ◽  
Gintaras Valušis ◽  
Tommi Kaplas ◽  
...  
Keyword(s):  
Thin Film ◽  
Metal Film ◽  
Sandwich Structure ◽  
Thick Layer ◽  
Pyrolytic Carbon ◽  
Thz Radiation ◽  
Pdms Film ◽  
Absorption Resonance ◽  
Screen Approach ◽  
Polymer Thickness

By exploring the Salisbury screen approach, we propose and demonstrate a thin film absorber of terahertz (THz) radiation. The absorber is comprised of a less than 100 nm thick layer of pyrolytic carbon deposited on a stretchable polydimethylsiloxane (PDMS) film followed by the metal film. We demonstrate that being overall less than 200 microns thick, such a sandwich structure absorbs resonantly up to 99.9%of the incident THz radiation, and that the absorption resonance is determined by the polymer thickness, which can be adjusted by stretching.

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