High Temperature Tensile Behavior Of Free-Standing Gold Films
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ABSTRACTA method for tensile testing thin films at elevated temperatures is presented. Freestanding tensile specimens were prepared by evaporating 2.1 μm of gold onto a patterned oxidized silicon wafer. Tensile tests were performed at various temperatures up to 600°C. The ultimate tensile strengths of the films decreased as temperature increased, and ductility increased with increasing temperature. Films tested at high temperatures (≥ 400 °C) exhibited significant strain rate-dependence, while films tested at low temperatures (≤ 200 °C) were found to be virtually rate-independent. At higher temperatures and strain rates, stress-enhanced grain growth was observed.
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2020 ◽
Vol 93
(1)
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pp. 183-194
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2011 ◽
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pp. 1157-1163
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2007 ◽
Vol 22
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pp. 1839-1848
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2014 ◽
Vol 783-786
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pp. 1182-1187
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Vol 2018
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