The Effect of Ta and N Content on Mechanical Properties of DC Magnetron Sputtered fen and Fetan thin films

1996 ◽  
Vol 436 ◽  
Author(s):  
Hong Deng ◽  
M. Kevin Minor ◽  
John A. Barnard

AbstractThis paper reports nanoindentation studies of the effect of Ta and N content on the mechanical properties of magnetically soft high moment FeN and FeTaN thin films prepared by dc magnetron sputtering. The FeTaN films were deposited on oxidized silicon (100) substrates with a series of FeTa targets in which the Ta content varies from 0 to 25wt%. The hardness (H) and Young's modulus (E) were measured by the Nano Indenter at nine indenter penetration depths: 20, 30, 40, 50, 60, 80, 100, 120 and 200 nm. The inherent hardness values of these films (no substrate effect) can be determined at penetration depths ranging from 20 to 60 nm for the 500 nm thick film used in the study. It was found that for the films deposited from the pure Fe target when the nitrogen flow rate increases from 0 to about 0.5 sccm the hardness of the film increases. However, a decreasing trend in hardness of these films was observed on further increasing the nitrogen flow rate. On the other hand, for the films prepared from the targets with the Ta content in the range of 5–15wt%, the hardness increases whenever Ta and N contents increase. These effects are clearly illustrated by 3-D and contour hardness and Young's modulus maps in this paper.

2019 ◽  
Vol 42 (5) ◽  
Author(s):  
Dhruva Kumar ◽  
Ranjan Kr Ghadai ◽  
Soham Das ◽  
Ashis Sharma ◽  
Bibhu P Swain

2001 ◽  
Vol 672 ◽  
Author(s):  
A.B. Agarwal ◽  
B.A. Rainey ◽  
S.M. Yalisove ◽  
J.C. Bilello

ABSTRACTNanoindentation experiments have been performed to assess the mechanical behavior of chromium nitride (CrxNy) thin films sputtered in different deposition geometries and with varying Ar and N2 pressures. The hardness and elastic modulus of chromium nitrides are of great interest with regard to their applications. In the present work, two different deposition geometries, i.e. multi-substrate and confocal, were used to sputter (DC magnetron) a CrxNy layer on Si (100) wafers at varying nitrogen flow rates. The results of the nanoindentation experiments indicate that, over a similar argon and nitrogen regime, the CrxNy films grown in a multi- substrate geometry exhibit higher hardness and elastic modulus on the average than those grown in the confocal geometry. Furthermore, it was found that in the multi-substrate geometry the hardness and elastic modulus of the films were significantly higher than those in the confocally deposited films for a specific regime of the nitrogen flow rate (10-14 sccm). Finally, observations of the mechanical properties trends could be correlated with a higher degree of anisotropic stress for films grown in the multi-substrate in comparison to the confocal geometry.


2016 ◽  
Vol 2016 ◽  
pp. 1-12 ◽  
Author(s):  
Yu-Wei Lin ◽  
Chia-Wei Lu ◽  
Ge-Ping Yu ◽  
Jia-Hong Huang

This study aims to investigate the effects of nitrogen flow rate (0–2.5 sccm) on the structure and properties of TiZrN films. Nanocrystalline TiZrN thin films were deposited on Si (001) substrates by unbalanced magnetron sputtering. The major effects of the nitrogen flow rate were on the phase, texture, N/(Ti + Zr) ratio, thickness, hardness, residual stress, and resistivity of the TiZrN films. The nitrogen content played an important role in the phase transition. With increasing nitrogen flow rate, the phase changed from mixed TiZr and TiZrN phases to a single TiZrN phase. The X-ray diffraction results indicated that (111) was the preferred orientation for all TiZrN specimens. The N/(Ti + Zr) ratio of the TiZrN films first increased with increasing nitrogen flow rate and then stabilized when the flow rate further increased. When the nitrogen flow rate increased from 0.4 to 1.0 sccm, the hardness and residual stress of the TiZrN thin film increased, whereas the electrical resistivity decreased. None of the properties of the TiZrN thin films changed with nitrogen flow rate above 1.0 sccm because the films contained a stable single phase (TiZrN). At high nitrogen flow rates (1.0–2.5 sccm), the average hardness and resistivity of the TiZrN thin films were approximately 36 GPa and 36.5 μΩ·cm, respectively.


2009 ◽  
Vol 355 (31-33) ◽  
pp. 1622-1629 ◽  
Author(s):  
M. Anutgan ◽  
T. Aliyeva Anutgan ◽  
E. Ozkol ◽  
I. Atilgan ◽  
B. Katircioglu

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.


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