Low Dielectric Constant Laminates Containing Microspheres

1994 ◽  
Vol 372 ◽  
Author(s):  
Robert M. Japp ◽  
Kostas I. Papathomas
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Electronic Devices ◽  
Effective Dielectric Constant ◽  
Low Dielectric Constant ◽  
Glass Microspheres ◽  
Hollow Glass Microspheres ◽  
Hollow Glass ◽  
Low Dielectric

AbstractAs electronic devices become faster, the effective dielectric constant of the circuit packaging connecting them becomes more important. The dielectric constant of standard epoxy/glass laminates can be significantly reduced by the addition of hollow glass microspheres. However the addition of such microspheres usually results in the degradation of other physical, electrical and mechanical properties which are prerequisites for materials to be used in commercial circuit packaging. By carefully optimizing the formulation many of these undesirable effects can be avoided. These topics and others pertaining to the development and testing of a microsphere laminate are discussed.

The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

2003 ◽  
Vol 766 ◽  
Author(s):  
Jin-Heong Yim ◽  
Jung-Bae Kim ◽  
Hyun-Dam Jeong ◽  
Yi-Yeoul Lyu ◽  
Sang Kook Mah ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Pore Structure ◽  
Pore Diameter ◽  
Dielectric Films ◽  
Low Dielectric Constant ◽  
Cyclodextrin Derivatives ◽  
Low Dielectric ◽  
Low K

AbstractPorous low dielectric films containing nano pores (∼20Å) with low dielectric constant (<2.2), have been prepared by using various kinds of cyclodextrin derivatives as porogenic materials. The pore structure such as pore size and interconnectivity can be controlled by changing functional groups of the cyclodextrin derivatives. We found that mechanical properties of porous low-k thin film prepared with mCSSQ (modified cyclic silsesquioxane) precursor and cyclodextrin derivatives were correlated with the pore interconnection length. The longer the interconnection length of nanopores in the thin film, the worse the mechanical properties of the thin film (such as hardness and modulus) even though the pore diameter of the films were microporous (∼2nm).

Tensile and Impact Properties of Recycled Poly(Ethylene Terephthalate) and Polycarbonate Composites Reinforced with Silane Treated Hollow Glass Microspheres

2018 ◽  
Vol 772 ◽  
pp. 33-37
Author(s):  
Nattakarn Hongsriphan ◽  
Pajaera Patanathabutr ◽  
Kanyakarn Lappokachai
Keyword(s):  
Mechanical Properties ◽  
Interfacial Adhesion ◽  
Ethylene Terephthalate ◽  
Chain Extender ◽  
Glass Microspheres ◽  
Hollow Glass Microspheres ◽  
Hollow Glass ◽  
Poly Ethylene Terephthalate ◽  
Fixed Composition ◽  
Poly Ethylene

Recycled poly (ethylene terephthalate) or R-PET is conventionally melt blended with polycarbonate with the presence of chain extender in order to produce polymer blend that provides good mechanical properties and cost effectiveness. This research was carried out to improve properties of such a blend by compounding them with silane treated hollow glass microspheres (HGMs), which mixing procedure was emphasized how it could affect mechanical properties. R-PET/PC/HGM composites of a fixed composition were melt compounded with three different mixing procedures. It was found that the compounding HGMs with PC and then R-PET obtained the most rigidity specimens than the all-in-one compounding or the compounding HGMs with R-PET and then PC. Silane treated HGMs were well distributed in the polymer matrix presenting good interfacial adhesion. However, the notched impact strength of all composites were inspected to be in the same range.

Robust spin-on-glass poly(methyl)silsesquioxane-based low-k materials derived from a cyclic siloxane precursor

RSC Advances ◽  
2015 ◽  
Vol 5 (82) ◽  
pp. 66511-66517 ◽  
Author(s):  
Albert S. Lee ◽  
Sung Yeoun Oh ◽  
Seung-Sock Choi ◽  
He Seung Lee ◽  
Seung Sang Hwang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Cyclic Siloxane ◽  
Low Dielectric ◽  
Methyl Silsesquioxane ◽  
Low K

Low dielectric constant poly(methyl)silsesquioxane spin-on-glass resins incorporating a cyclic precursor exhibited exceptional mechanical properties to withstand CMP processes.

scholarly journals Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1383
Author(s):  
Panpan Zhang ◽  
Lize Zhang ◽  
Ke Zhang ◽  
Jiupeng Zhao ◽  
Yao Li
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Phase Inversion ◽  
Polyimide Film ◽  
Porous Film ◽  
Breakdown Field ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Dielectric Performance ◽  
Fluorinated Graphene

Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of theoretical and practical significance in the application of polyimide for 5G communications. In this work, different fluorinated graphene/polyamic acids (FG/PAA) were used as the precursor, and the porous polyimide film was successfully prepared by phase inversion. The dielectric constant of the porous polyimide film is relatively low, being less than 1.7. When the content of fluorinated graphene is 0.5 wt%, the overall dielectric performance of the porous film is the best, with a dielectric constant of 1.56 (10 kHz) and a characteristic breakdown field strength of 56.39 kV/mm. In addition, the mechanical properties of the film are relatively poor, with tensile strengths of 13.87 MPa (0.2 wt%), 13.61 MPa (0.5 wt%), and 6.25 MPa (1.0 wt%), respectively. Therefore, further improving the breakdown resistance and mechanical properties of the porous film is essential for the application of porous ultra-low dielectric polyimide materials.

First Pass Study of Surface Modified Porous Low-k by Ion Implantation for Zero Thickness Barrier Requirement of Cu/MSQ/Si Stacks in Copper Metallization Scheme

2005 ◽  
Vol 863 ◽  
Author(s):  
Alok Nandini ◽  
U. Roy ◽  
Zubin P. Patel ◽  
H. Bakhru
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Ion Implantation ◽  
Porous Silica ◽  
Surface Hardness ◽  
Low Dielectric Constant ◽  
Copper Metallization ◽  
Porous Films ◽  
Critical Dimensions ◽  
Low Dielectric

AbstractLow-κ dielectrics have to meet stringent requirements in material properties in order to be successfully integrated. A particularly difficult challenge for material development is to obtain a combination of low dielectric constant with good thermal and mechanical properties. Incorporation of low dielectric constant materials such as porous silica based materials as a replacement to conventional dielectrics like SiO2 and use of Cu metallization schemes has become a necessity as critical dimensions of devices decrease. This paper is focused on the challenges in developing materials with low dielectric constant but strong thermo mechanical properties. Thin films of Ultra-Low materials such as porous Methyl Silsesquioxane (MSQ) (κ=2.2) were implanted with argon 1 × 1016 cm-2 dose at energies varying from 20 to 50 keV at room temperature. This work shows that the surface hardness of the porous films can be improved five times as compared to the as-deposited porous films by implanting Ar with 1 × 1016 cm-2 doses at 20 keV, sacrificing only a slight increase (∼9%) in dielectric constant (e.g., from 2.2 to 2.4). The hardness persists after 4500C annealing. In this current work, an ion implantation strategy was pursued to create a SiO2-like surface on MSQ. The effects of implantation parameters on the barrier property and bulk stability of MSQ were then studied. The results reveal one possible route to attain the “zero barrier thickness” requirement for interconnects systems.

scholarly journals BN Nanoparticles/Si3N4Wave-Transparent Composites with High Strength and Low Dielectric Constant

2011 ◽  
Vol 2011 ◽  
pp. 1-5 ◽  
Author(s):  
Dongliang Zhao ◽  
Yujun Zhang ◽  
Hongyu Gong ◽  
Baoxin Zhu ◽  
Xiaoyu Zhang
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Volume Content ◽  
Bending Strength ◽  
High Strength ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Transparent Composites ◽  
Gas Pressure Sintering ◽  
Dielectric And Mechanical Properties

Si3N4wave-transparent composites with different volume content of BN nanoparticles (BNnp/Si3N4) were prepared by gas pressure sintering at 1800°C in N2atmosphere. The effects of BN nanoparticles on the dielectric and mechanical properties of BNnp/Si3N4composites were investigated. The results showed that the addition of the BN nanoparticles improved the dielectric properties of BNnp/Si3N4composites effectively and decreased the mechanical properties. When the volume content of BN nanoparticles was 10%, the dielectric constant and dielectric loss tangent were 4.31 and 0.006, respectively, and the bending strength and fracture toughness still reached 198.9 MPa and 3.36 MPa·m1/2. The high mechanical properties of BNnp/Si3N4composites with 10% BN nanoparticles were attributed to homogeneously dispersed BN nanoparticles which were embedded in the pores formed by the rod-likeβ-Si3N4.

scholarly journals Lightweight Poly(ε-Caprolactone) Composites with Surface Modified Hollow Glass Microspheres for Use in Rotational Molding: Thermal, Rheological and Mechanical Properties

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 624 ◽  
Author(s):  
Adriano Vignali ◽  
Salvatore Iannace ◽  
Giulio Falcone ◽  
Roberto Utzeri ◽  
Paola Stagnaro ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Oxidative Degradation ◽  
Crystallization Rate ◽  
Rotational Molding ◽  
Glass Microspheres ◽  
Hollow Glass Microspheres ◽  
Inorganic Particles ◽  
Hollow Glass ◽  
The Matrix ◽  
Surface Modified

In this work, novel composites based on poly(ε-caprolactone) (PCL) were prepared and characterized in terms of morphological, thermal, rheological and mechanical properties. Hollow glass microspheres (HGM), alone or surface modified by treatment with (3-aminopropyl)triethoxysilane (APTES) in order to enhance the compatibility between the inorganic particles and the polymer matrix, were used to obtain lightweight composites with improved properties. The silanization treatment implies a good dispersion of filler particles in the matrix and an enhanced filler–polymer adhesion. The addition of HGM to PCL has relevant implications on the rheological and mechanical properties enhancing the stiffness of the material. Furthermore, the presence of HGM strongly interferes with the crystallization behavior and thermo-oxidative degradation of PCL. The increase of PCL crystallization rate was observed as a function of the HGM amount in the composites. Finally, rotational molding tests demonstrated the possibility of successfully producing manufactured goods in PCL and PCL-based composites on both a laboratory and industrial scale.

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