Manipulation of Stresses in Metallic Thin Films by Alloying
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AbstractAtomistic simulations were used to study the configurations of defects in copper aluminum alloy (2% copper, 98% aluminum). In the presence of free surface, the copper atoms migrated towards the surface. When the aluminum cell (about 2000 atoms) contained a dislocation, copper atoms segregated near the dislocation core on the compressional side. In presence of a grain boundary, copper atoms moved into the boundary plane. The segregation in these simulations resulted from reduction in localized strain near the structural defects.
2014 ◽
Vol 16
(9)
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pp. 1105-1110
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2017 ◽
Vol 46
(8)
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pp. 4891-4897
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1993 ◽
Vol 95-98
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pp. 445-448
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1976 ◽
Vol 34
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pp. 396-397