Read-Shockley Boundaries in Thin Films

1997 ◽  
Vol 472 ◽  
Author(s):  
Alexander H. King

ABSTRACTWhen a grain boundary is terminated by a free surface, its behavior may be significantly different than for the same boundary either in an infinite bicrystal, or terminated by triple junctions. In this paper we describe some phenomena related to the free-surface interactions of interfacial dislocations, in thin films. We show that surface relaxation stresses can exert a powerful destabilizing influence upon the dislocation structure of many grain boundaries, and that they can only be made stable if a large lattice friction stress, or other pinning force, resists the motion of the dislocations. Finally, we will show that the only intrinsically stable grain boundary in a thin film is a tilt boundary with its rotation axis parallel to the normal of the film.

Anales AFA ◽  
2020 ◽  
Vol 31 (1) ◽  
pp. 7-12
Author(s):  
C. L. Di Prinzio ◽  
P. I. Achával ◽  
D. Stoler ◽  
G. Aguirre Varela

This paper presents the evolution of a flat grain boundary in a thin sample, using a numerical algorithm based on the Monte Carlo method. The grain boundary is driven by an external force and the effect of the free surface is studied.The grain boundary migration on the free surface is spasmodic, which means that it has alternating periods of movement and stagnation. Stagnation periods are inversely proportional to the thickness of the sample. The results obtained computationally fitted acceptable with the theoretical results obtained by different authors.


1994 ◽  
Vol 356 ◽  
Author(s):  
A. S. Nandedkar

AbstractAtomistic simulations were used to study the configurations of defects in copper aluminum alloy (2% copper, 98% aluminum). In the presence of free surface, the copper atoms migrated towards the surface. When the aluminum cell (about 2000 atoms) contained a dislocation, copper atoms segregated near the dislocation core on the compressional side. In presence of a grain boundary, copper atoms moved into the boundary plane. The segregation in these simulations resulted from reduction in localized strain near the structural defects.


2000 ◽  
Vol 10 (06) ◽  
pp. 895-921 ◽  
Author(s):  
HARALD GARCKE ◽  
BRITTA NESTLER

We use geometrical arguments based on grain boundary symmetries to introduce crystalline interfacial energies for interfaces in polycrystalline thin films with a cubic lattice. These crystalline energies are incorporated into a multi-phase field model. Our aim is to apply the multi-phase field method to describe the evolution of faceted grain boundary triple junctions in epitaxially growing microstructures. In particular, we are interested in symmetry properties of triple junctions in tricrystalline thin films. Symmetries of triple junctions in tricrystalline films have been studied in experiments by Dahmen and Thangaraj.6,25 In accordance with their experiments, we find in numerical simulations that any two neighboring triple junctions belong to different symmetry classes. We introduce a local equilibrium condition at triple junctions which can be interpreted as a crystalline version of Young's law. The local equilibrium condition at triple junctions is purely determined by the grain boundary energies. In particular no triple junction energies are necessary to explain which triple junctions are possible. All triple junctions observed in the experiments as well as in the simulations fulfil the crystalline version of Young's law. Our approach is also capable of describing grain boundary motion in general polycrystalline thin films.


1989 ◽  
Vol 167 ◽  
Author(s):  
P. F. Tang ◽  
A. G. Milnes ◽  
C. L. Bauer ◽  
S. Mahajan

AbstractEvolution of the fractional change of electrical resistance ΔR/R in thin films of Au on (001) substrates of semi-insulating GaAs has been investigated as a function of time t, temperature T, and current density j. Initially, ΔR/R increases linearly with increasing t for constant T and j, and exponentially with increasing T for constant t and j, characterized by an activation energy of 0.73 eV. An analytical model is developed to evaluate ΔR/R for the early stages of electromigration. This model is based on flux divergence at grain boundary triple junctions resulting from variations of grain boundary inclination and/or diffusivity. Using a Monte Carlo method, conducting lines containing a prescribed number of random triple junctions are simulated, wherein distribution of mass flux divergence determines initial values of ΔR/R. Moreover, by selection of an appropriate failure criterion, the sequence of cumulative failures is characterized by a log-normal-like distribution, which defines mean time to failure and corresponding standard deviation. In general, the model is in good agreement with experimental observations.


Author(s):  
D. H. Shin ◽  
J. Silcox ◽  
D. K. Lathrop ◽  
S. E. Russek ◽  
R. A. Buhrman

The grain boundary structures of high Tc superconducting YBa2Cu3O7-x thin films grown on yttrium-stabilized zirconia and MgO have been studied using a VG-HB501A STEM operating at 100 keV (bright field, Cs=1.l mm, αobj=12 mrad,θcol=4 mrad). In Fig. 1, lattice images of various types of grain boundaries of a superconducting film grown on MgO by low-temperature (660 °C) in situ sputtering are shown. This sample has a critical current density of ∼5 × 106 amp/cm2 at 4 K and a somewhat depressed transition temperature near 70 K possibly due to ion bombardment during the sputtering process and oxygen deficiencies. Beyond a few atomic distances most of the grain boundaries are clean and coherent.Since each grain in the film can take any of the possible orientations satisfying substrate-film lattice matching (along [100], [110], and [120] of the substrate, with either c-axis parallel or c-axis perpendicular, in the case of (100) MgO substrate), several different types of grain boundaries occur. Fig. 1(a) shows a grain boundary between two grains with c-axes in the plane of the substrate. Fig. 1(b), (c), and upper left area of (d) show grain boundaries between two grains, one with c-axis in the plane, and the other with c-axis perpendicular to the plane. At these grain boundaries c-axes are rotated through 90°.


1999 ◽  
Vol 5 (S2) ◽  
pp. 846-847
Author(s):  
C.J. Wauchope ◽  
R.R. Keller ◽  
J.E. Sanchez

Al thin films, used as interconnects in integrated circuit devices, are subject to voiding failures due to electromigration and stress. Electromigration is a diffusion process and voids are known to form at points of flux divergence such as triple junctions. Void formation in Al-Cu films has also been associated with 9θ-phase (Al2 Cu) precipitates [1], which form preferentially at grain boundaries and triple junctions. Some triple junctions are favored as nucleation sites [2], presumably due to energetic differences arising from the crystallographic nature of the junctions. Their character can be calculated from the crystallographic orientations of the surrounding grains and the associated grain boundary dislocation networks [3]. Bollmann's method of analysis results in two categories of triple lines: I-lines - the special case where the grain boundary dislocations balance; and U-lines - the general case where the dislocation arrays do not balance. U-lines should have higher energies than I-lines and should therefore behave differently [3, 4]. This paper investigates the relationship between triple-line character and the location of Al2 Cu precipitates at certain triple junctions in Al-lCu thin films.


1993 ◽  
Vol 317 ◽  
Author(s):  
H.J. Frost ◽  
Y. Hayashi ◽  
C.V. Thompson ◽  
D.T. Walton

ABSTRACTIn simulations of grain growth in thin films we have considered the effect of variations in grain boundary energy. Boundary energy depends on both the misorientation between the two neighboring grains, and the angles which the boundary plane makes with the crystallographic axes of the two crystals. Variations in grain boundary energy mean that dihedral angles at triple junctions deviate from 120°. The proportionality between boundary velocities and local curvatures, and the critical curvature for boundary pinning due to surface grooving also both depend on boundary energy. One effect of variable boundary energies is that grains no longer gain or lose area at rates determined solely by their topology or number of sides. (They no longer obey the Von Neumann/Mullins law). Another effect is that as the grain structures evolve, the fraction of high-energy boundaries decreases. Also, the stagnant structures have broader grain size distributions.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
Hamish L. Fraser

The topic of strain and lattice parameter measurements using CBED is discussed by reference to several examples. In this paper, only one of these examples is referenced because of the limitation of length. In this technique, scattering in the higher order Laue zones is used to determine local lattice parameters. Work (e.g. 1) has concentrated on a model strained-layer superlattice, namely Si/Gex-Si1-x. In bulk samples, the strain is expected to be tetragonal in nature with the unique axis parallel to [100], the growth direction. When CBED patterns are recorded from the alloy epi-layers, the symmetries exhibited by the patterns are not tetragonal, but are in fact distorted from this to lower symmetries. The spatial variation of the distortion close to a strained-layer interface has been assessed. This is most readily noted by consideration of Fig. 1(a-c), which show enlargements of CBED patterns for various locations and compositions of Ge. Thus, Fig. 1(a) was obtained with the electron beam positioned in the center of a 5Ge epilayer and the distortion is consistent with an orthorhombic distortion. When the beam is situated at about 150 nm from the interface, the same part of the CBED pattern is shown in Fig. 1(b); clearly, the symmetry exhibited by the mirror planes in Fig. 1 is broken. Finally, when the electron beam is positioned in the center of a 10Ge epilayer, the CBED pattern yields the result shown in Fig. 1(c). In this case, the break in the mirror symmetry is independent of distance form the heterointerface, as might be expected from the increase in the mismatch between 5 and 10%Ge, i.e. 0.2 to 0.4%, respectively. From computer simulation, Fig.2, the apparent monocline distortion corresponding to the 5Ge epilayer is quantified as a100 = 0.5443 nm, a010 = 0.5429 nm and a001 = 0.5440 nm (all ± 0.0001 nm), and α = β = 90°, γ = 89.96 ± 0.02°. These local symmetry changes are most likely due to surface relaxation phenomena.


Author(s):  
M.J. Kim ◽  
Y.L. Chen ◽  
R.W. Carpenter ◽  
J.C. Barry ◽  
G.H. Schwuttke

The structure of grain boundaries (GBs) in metals, semiconductors and ceramics is of considerable interest because of their influence on physical properties. Progress in understanding the structure of grain boundaries at the atomic level has been made by high resolution electron microscopy (HREM) . In the present study, a Σ=13, (510) <001>-tilt grain boundary in silicon was characterized by HREM in conjunction with digital image processing and computer image simulation techniques.The bicrystals were grown from the melt by the Czochralski method, using preoriented seeds. Specimens for TEM observations were cut from the bicrystals perpendicular to the common rotation axis of pure tilt grain boundary, and were mechanically dimpled and then ion-milled to electron transparency. The degree of misorientation between the common <001> axis of the bicrystal was measured by CBED in a Philips EM 400ST/FEG: it was found to be less than 1 mrad. HREM was performed at 200 kV in an ISI-002B and at 400 kv in a JEM-4000EX.


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