Characterization of a Thick Homoepitaxial CVD Diamond Film

1994 ◽  
Vol 339 ◽  
Author(s):  
M. A. Plano ◽  
M. D. Moyer ◽  
M. M. Moreno ◽  
D. Black ◽  
H. Burdette ◽  
...  

ABSTRACTA thick homoepitaxial CVD diamond film was grown on a large high temperature, high pressure (HTHP) Ha diamond to study the defects present in the CVD film. The HTHP diamond had dimensions of 6 mm x 6 mm x 0.44 mm. The thickness of the diamond was increased to 0.84 mm by microwave plasma CVD. X-ray topographs were taken before and after growth to compare the defects in CVD diamond to those in the HTHP diamond. Prior to growth the substrate was unstrained and the characteristic microstructure of stacking faults and dislocations was observed. There was also a surface relief, visible optically, on the substrate of lines along the [100] which are probably due to polishing. After deposition of the CVD film, the crystal was strained with the film in tension. The defect structure observed throughout the CVD film followed the surface relief of the substrate. Cathodoluminescence spectra indicate that the film contains nitrogen defect complexes which are not present in the substrate. Cathodoluminescence also indicates that there are more non-radiative recombination centers in the film than in the substrate. Electrical results from transient photoconductivity measurements indicate that while the mobilities of the film and the substrate are comparable, the lifetime is much shorter in the film, possibly reflecting the higher concentration of non-radiative recombination centers.

1996 ◽  
Vol 47 (7) ◽  
pp. 611-615
Author(s):  
Hiroyuki TANAKA ◽  
Toshiaki TANAKA ◽  
Hideaki SOHMA ◽  
Masato YOSHIDA ◽  
Akira SAKAI ◽  
...  

2008 ◽  
Vol 53-54 ◽  
pp. 111-118
Author(s):  
Ze Wei Yuan ◽  
Zhu Ji Jin ◽  
B.X. Dong ◽  
Ren Ke Kang

Although various diamond polishing techniques have been studied for many years, no individual method can polish free-standing CVD diamond film with high efficiency and high polishing quality. This paper investigates polishing CVD diamond film by the combination of electro-discharge machining (EDM) and chemical mechanical polishing (CMP). Scanning electro microscopy, Optical microscopy, Energy dispersive X-ray analysis, Talysurf surface profiler and Raman spectroscopy were used to evaluate the surface integrity and quality of diamond film before and after polishing. Based on the experimental results, the material removal during EDM process can be a chemo-mechanical process, including gasification, melting, sputtering, oxidation and graphitization. While in CMP process, diamond was removed under the mechanical and tribochemical interaction. The combination of EDM and CMP has advantages of high efficiency, high polishing quality and low damage. It is suitable to polish large area free-standing CVD diamond film.


2012 ◽  
Vol 217-219 ◽  
pp. 1022-1027
Author(s):  
Liu Jin Bian ◽  
Zi Chao Lin ◽  
Fang Hong Sun ◽  
Song Shou Guo

Abstract:The shaped-wire drawing dies are used more and more popularly in the metal product industry for several advantages of locked structure. In present investigation, a layer of CVD diamond film is deposited on the interior-hole surface of shaped-wire drawing die using a hot filament chemical vapor deposition (HFCVD) method, followed by a surface polishing process, aiming at further prolonging its working lifetime of shaped-wire drawing dies and improving the surface quality of produced wires. The scanning electron microscopy (SEM), surface profiler and Raman spectroscopy are adopted to present the characterization of both as-deposited CVD diamond films before and after polishing. Furthermore, the performance of as-fabricated CVD diamond coated drawing dies is examined in the practical production process. The results show that as-deposited CVD diamond films are homogeneous and the working surface is smoother after polishing. Comparing with the conventional shaped drawing dies, the working lifetime of the diamond coated shaped-wire drawing dies can be increased by a factor of above 10, and the shaped wires with higher surface quality can be obtained.


2010 ◽  
Vol 135 ◽  
pp. 271-276
Author(s):  
Shu Tao Huang ◽  
Li Zhou ◽  
Li Fu Xu

Super-high speed polishing of diamond film is a newly proposed method due to its outstanding features such as low cost and simple apparatus. The interface temperature rise is due to the friction force and the relative sliding velocity between the CVD diamond film and the polishing metal plate surface. In this paper, the interface temperature rise in super-high speed polishing of CVD diamond film was investigated by using the single-point temperature measurement method. Additionally, the influence of polishing plate material on the characteristics of super-high speed polishing has been studied. The results showed that cast iron is not suitable for super-high polishing, while both 0Cr18Ni9 stainless steel and pure titanium can be used for the super-high polishing of CVD diamond film. The quality and efficiency of polishing with 0Cr18Ni9 stainless steel plate is much higher than those of pure titanium, and the material removal rate could reach to 36-51 m/h when the polishing speed and pressure are 100 m/s and 0.17-0.31 MPa, respectively.


2005 ◽  
Vol 71 (12) ◽  
pp. 1541-1547
Author(s):  
Tsuyoshi YOKOSAWA ◽  
Jun-ichiro TAKAGI ◽  
Seiji KATAOKA

Sign in / Sign up

Export Citation Format

Share Document