Kinetics of Reactive Ion Etching of Polymers in an Oxygen Plasma: The Importance of Direct Reactive Ion Etching

1993 ◽  
Vol 334 ◽  
Author(s):  
Sandra W. Graham ◽  
Christoph SteinbrüChel
Keyword(s):  
Polymer Films ◽  
Langmuir Probe ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Surface Chemical ◽  
Ion Etching ◽  
Modified Model ◽  
Physical Sputtering ◽  
The Relationship ◽  
Kinetics Of

AbstractThe etching of polymer films in oxygen-based plasmas has been studied between 5 and 100 mTorr in a reactive ion etch reactor using Langmuir probe and optical actinometry measurements. Results for the etch yield (the number of carbon atoms removed per incident ion) are analyzed in terms of a surface-chemical model for ion-enhanced etching proposed by Joubert et al. (J. Appl. Phys. 65, 5096 (1989)). A proper description of the results requires that this model be modified by including a term due to direct reactive ion etching and physical sputtering. The contribution by direct reactive ion etching to the overall etching turns out to be significant under all conditions and even dominant at the lowest pressures. The modified model should be applicable to the etching of polymers in other types of reactors, especially highplasma- density reactors. The relationship between these results and the anisotropic patterning of polymer films is also discussed.

Mechanism of Reactive Ion Etching of Polymeric Films in Oxygen-Based Plasmas

1992 ◽  
Vol 282 ◽  
Author(s):  
Sandra W. Graham ◽  
Christoph Steinbrüchel
Keyword(s):  
Etch Rate ◽  
Reactive Ion Etching ◽  
Polymeric Films ◽  
Surface Chemical ◽  
Ion Etching ◽  
Atom Concentration ◽  
Modified Model ◽  
Physical Sputtering ◽  
Low Pressures ◽  
The Relationship

ABSTRACTThe etching of polymeric films in O2 plasmas containing small amounts of CF4 has been studied at low pressures (10–60 mtorr) in an RIE reactor. The relationship between etch rate, ion flux, and O atom concentration is investigated for photoresist, polyimide, and amorphous carbon. The applicability of a surface-chemical model proposed by Joubert, et al. (J. Appl. Phys. 65(12) 1989, 5096) is explored. Modifications to the model are made to include physical sputtering and direct reactive ion etching. The modified model provides an improved description of the process, showing the various contributions of the ions and O atoms to the overall etching.

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

Reactive Ion Etching of GaSb, (Ai,Ga)Sb, and InAs for Novel Device Applications.

1990 ◽  
Vol 216 ◽  
Author(s):  
D.C. La Tulipe ◽  
D.J. Frank ◽  
H. Munekata
Keyword(s):  
Etch Rate ◽  
Reactive Ion Etching ◽  
Scanning Electron Micrographs ◽  
Electrical Characteristics ◽  
Ion Etching ◽  
Novel Device ◽  
Physical Sputtering ◽  
Chlorine Gas ◽  
Device Applications ◽  
Scanning Electron

ABSTRACT-Although a variety of novel device proposals for GaSb/(Al,Ga)Sb/InAs heterostructures have been made, relatively little is known about processing these materials. We have studied the reactive ion etching characteristics of GaSb, (AI,Ga)Sb, and InAs in both methane/ hydrogen and chlorine gas chemistries. At conditions similar to those reported elsewhere for RIE of InP and GaAs in CH4/H2, the etch rate of (AI,Ga)Sb was found to be near zero, while GaSb and InAs etched at 200Å/minute. Under conditions where the etch mechanism is primarily physical sputtering, the three compounds etch at similar rates. Etching in Cl2 was found to yield anisotropic profiles, with the etch rate of (AI,Ga)Sb increasing with Al mole fraction, while InAs remains unetched. Damage to an InAs “stop layer” was investigated by sheet resistance and mobility measurements. These etching techniques were used to fabricate a novel InAs-channel FET composed of these materials. Several scanning electron micrographs of etching results are shown along with preliminary electrical characteristics.

Characterization of Sidewall Residue Film and Atomic Structure of the Trench Formed by BCI3/CI2 Reactive Ion Etching

1989 ◽  
Vol 158 ◽  
Author(s):  
Sun Jin Yun ◽  
Young-Jin Jeon ◽  
Jeong Y. Lee
Keyword(s):  
Photoelectron Spectroscopy ◽  
Secondary Ion Mass Spectrometry ◽  
Reactive Ion Etching ◽  
Surface Region ◽  
Bottom Surface ◽  
Silicon Substrates ◽  
Ion Etching ◽  
Transmission Electron ◽  
Physical Sputtering ◽  
20 Nm

ABSTRACTThe silicon trench etching in BCl3/Cl2 reactive ion etching plasma leads to the intrinsic bonding damage, the permeations of etching species and impurities into silicon substrates, and the deposition of residue film on trench sidewall. The contaminations and the damages in trench were investigated by using high resolution transmission electron microscopy (HRTEM), secondary ion mass spectrometry (SIMS), and x-ray photoelectron spectroscopy (XPS). The microstructure of the rounded bottom surface showed that the surface region was distorted by 2 - 6 atomic layers and the trench etch was mainly limited by the physical sputtering-like mechanism. The damage in the silicon lattice consisted of prominent planar defects roughly confined to {110} and {111} planes. The thickness of sidewall residue film was 10 - 90 nm, which was thinner at deeper region of the trench, whereas that of residue film at the trench bottom was 1.5 - 3.5 nm. The SIMS results of no-patterned specimen presented that the permeation depths of boron and chlorine into the Si-substrate were about 40 and 20 nm, respectively. The presence of BxCly and Cl-related Si chemical states was identified from XPS analysis of the residue film.

Reactive ion etching of poly (cyclohexene carbonate) in oxygen plasma

2018 ◽  
Vol 191 ◽  
pp. 1-9 ◽  
Author(s):  
Xingjun Xue ◽  
Kun Zhou ◽  
Jian Cai ◽  
Qian Wang ◽  
Zheyao Wang
Keyword(s):  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Ion Etching

Reactive-ion etching of nylon fabric meshes using oxygen plasma for creating surface nanostructures

2015 ◽  
Vol 356 ◽  
pp. 408-415 ◽  
Author(s):  
Hernando S. Salapare ◽  
Thierry Darmanin ◽  
Frédéric Guittard
Keyword(s):  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Nylon Fabric ◽  
Surface Nanostructures
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