Mechanism of Reactive Ion Etching of Polymeric Films in Oxygen-Based Plasmas

1992 ◽  
Vol 282 ◽  
Author(s):  
Sandra W. Graham ◽  
Christoph Steinbrüchel
Keyword(s):  
Etch Rate ◽  
Reactive Ion Etching ◽  
Polymeric Films ◽  
Surface Chemical ◽  
Ion Etching ◽  
Atom Concentration ◽  
Modified Model ◽  
Physical Sputtering ◽  
Low Pressures ◽  
The Relationship

ABSTRACTThe etching of polymeric films in O2 plasmas containing small amounts of CF4 has been studied at low pressures (10–60 mtorr) in an RIE reactor. The relationship between etch rate, ion flux, and O atom concentration is investigated for photoresist, polyimide, and amorphous carbon. The applicability of a surface-chemical model proposed by Joubert, et al. (J. Appl. Phys. 65(12) 1989, 5096) is explored. Modifications to the model are made to include physical sputtering and direct reactive ion etching. The modified model provides an improved description of the process, showing the various contributions of the ions and O atoms to the overall etching.

Kinetics of Reactive Ion Etching of Polymers in an Oxygen Plasma: The Importance of Direct Reactive Ion Etching

1993 ◽  
Vol 334 ◽  
Author(s):  
Sandra W. Graham ◽  
Christoph SteinbrüChel
Keyword(s):  
Polymer Films ◽  
Langmuir Probe ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Surface Chemical ◽  
Ion Etching ◽  
Modified Model ◽  
Physical Sputtering ◽  
The Relationship ◽  
Kinetics Of

AbstractThe etching of polymer films in oxygen-based plasmas has been studied between 5 and 100 mTorr in a reactive ion etch reactor using Langmuir probe and optical actinometry measurements. Results for the etch yield (the number of carbon atoms removed per incident ion) are analyzed in terms of a surface-chemical model for ion-enhanced etching proposed by Joubert et al. (J. Appl. Phys. 65, 5096 (1989)). A proper description of the results requires that this model be modified by including a term due to direct reactive ion etching and physical sputtering. The contribution by direct reactive ion etching to the overall etching turns out to be significant under all conditions and even dominant at the lowest pressures. The modified model should be applicable to the etching of polymers in other types of reactors, especially highplasma- density reactors. The relationship between these results and the anisotropic patterning of polymer films is also discussed.

Reactive Ion Etching of GaSb, (Ai,Ga)Sb, and InAs for Novel Device Applications.

1990 ◽  
Vol 216 ◽  
Author(s):  
D.C. La Tulipe ◽  
D.J. Frank ◽  
H. Munekata
Keyword(s):  
Etch Rate ◽  
Reactive Ion Etching ◽  
Scanning Electron Micrographs ◽  
Electrical Characteristics ◽  
Ion Etching ◽  
Novel Device ◽  
Physical Sputtering ◽  
Chlorine Gas ◽  
Device Applications ◽  
Scanning Electron

ABSTRACT-Although a variety of novel device proposals for GaSb/(Al,Ga)Sb/InAs heterostructures have been made, relatively little is known about processing these materials. We have studied the reactive ion etching characteristics of GaSb, (AI,Ga)Sb, and InAs in both methane/ hydrogen and chlorine gas chemistries. At conditions similar to those reported elsewhere for RIE of InP and GaAs in CH4/H2, the etch rate of (AI,Ga)Sb was found to be near zero, while GaSb and InAs etched at 200Å/minute. Under conditions where the etch mechanism is primarily physical sputtering, the three compounds etch at similar rates. Etching in Cl2 was found to yield anisotropic profiles, with the etch rate of (AI,Ga)Sb increasing with Al mole fraction, while InAs remains unetched. Damage to an InAs “stop layer” was investigated by sheet resistance and mobility measurements. These etching techniques were used to fabricate a novel InAs-channel FET composed of these materials. Several scanning electron micrographs of etching results are shown along with preliminary electrical characteristics.

The Role of Oxygen In the CF2Cl2 Reactive Ion Etching of Pecvd Films

1991 ◽  
Vol 223 ◽  
Author(s):  
Yue Kuo
Keyword(s):  
Etch Rate ◽  
Reactive Ion Etching ◽  
Extensive Study ◽  
Surface Chemical ◽  
Ion Etching ◽  
Chemical States ◽  
Plasma Phase ◽  
Bombardment Energy ◽  
Phase Chemistry

ABSTRACTAn extensive study on 02 effects on RIE of PECVD a-Si:H and SiNx has been carried out. Mixtures of CF2Cl2/HCI and CF2Cl2/CF3Cl were used as base gases. The addition of O2 into these gases changed the film etch rate and etch selectivity in different ways. Process results were interpreted by examining the plasma phase chemistry, the ion bombardment energy, and ESCA surface chemical states.

Reactive ion etching of TiN, TiAlN, CrN and TiCN Films in CF4/O2 and CHF3/O2 Plasmas

2005 ◽  
Vol 890 ◽  
Author(s):  
Patrick W. Leech ◽  
G. K. Reeves ◽  
A. S. Holland
Keyword(s):  
Flow Rate ◽  
Etch Rate ◽  
Power Flow ◽  
Reactive Ion Etching ◽  
Hard Coatings ◽  
Ion Etching ◽  
Flat Surfaces ◽  
Physical Sputtering ◽  
Polymer Deposition ◽  
Etch Rates

AbstractThe reactive ion etching of a range of hard coatings (TiN, TiCN, CrN and TiAlN) has been examined as a function of rf power, flow rate and pressure. The films were deposited by filtered arc deposition (TiN, TiAlN and CrN) or low energy electron beam (TiCN) on polished disc substrates of M2 tool steel. The flat surfaces were lithographically patterned with a grating structure (∼1 μm pitch). The TiN and TiCN layers have shown significantly higher etch rates (100-250 nm/min) than the CrN and TiAlN (∼5 nm/min) coatings. These regimes of higher and low etch rate were identified as ion-enhanced chemical etching and physical sputtering, respectively. In CF4/O2 plasma, the etch rate of the TiN and TiCN layers increased with rf power, flow rate and pressure which were parameters known to enhance the density of active fluorine species. The etch rates of TiN and TiCN layers were higher in CF4/O2 plasma than in CHF3/O2 gases in which polymer deposition was produced at pressure ≥ 35 mTorr.

Reactive Ion Etching of CVD Diamond in CF4/O2, O2 and O2/Ar Plasmas

2000 ◽  
Vol 622 ◽  
Author(s):  
Patrick W. Leech ◽  
Geoffrey K. Reeves ◽  
Anthony S. Holland
Keyword(s):  
Bias Voltage ◽  
Chemical Etching ◽  
Etch Rate ◽  
Reactive Ion Etching ◽  
Cvd Diamond ◽  
Flow Ratio ◽  
Ion Etching ◽  
Physical Sputtering ◽  
High Etch Rate ◽  
Low Rate

ABSTRACTThe reactive ion etching of diamond in O2, CF4/O2, CHF3/O2, O2/Ar) discharges has been examined as a function of bias voltage, flow rate and composition of the gas mixtures. Etching in O2 and O2/Ar plasmas (with flow ratio of O2/Ar >25% ) was characterised by a high etch rate (∼35 nm/min) and an increase in surface roughness with rising bias voltage. The CF4/O2 plasmas also produced a high etch rate (∼50 nm/min) but with only minor dependence of roughness on bias voltage. In comparison, the O2/Ar (with O2/Ar flow ratio <25%) and CHF3/O2 plasmas resulted in a low etch rate (7-10 nm/min). The high and low rate regimes were identified as ion- enhanced chemical etching and physical sputtering respectively. Etching in the O2/Ar plasmas has been attributed to a combination of the two processes dependent on the O2 content.

Study on Reactive Ion Etching of Vanadium Oxide Thin Film by Taguchi Method

2014 ◽  
Vol 909 ◽  
pp. 91-94
Author(s):  
Jun Gou ◽  
Hui Ling Tai ◽  
Jun Wang ◽  
De En Gu ◽  
Xiong Bang Wei ◽  
...  
Keyword(s):  
Thin Film ◽  
Taguchi Method ◽  
Vanadium Oxide ◽  
Etch Rate ◽  
Reactive Ion Etching ◽  
Oxide Thin Film ◽  
Optimum Process ◽  
Rf Power ◽  
Ion Etching ◽  
Vanadium Oxide Thin Film

A high selectivity patterning technology of vanadium oxide (VOx) thin film was suggested in this paper. VOxthin film was etched through a photoresist (PR) mask using Cl/N based gases in a reactive ion etching (RIE) system. Taguchi method was used for process design to identify factors that influence the patterning and find optimum process parameters. Experimental results suggested that RF power was the largest contribution factor for VOxetch rate, PR selectivity and uniformity on 6 inch diameter wafer. Uniformity and PR selectivity were improved by introducing a small amount of N2. High resolution and low roughness patterning transfer was achieved with a non uniformity of 2.4 %, an VOxetch rate of 74 nm/min, a PR selectivity of 0.96, a Si3N4selectivity of 5 and a SiO2selectivity of 10.

The effect of BCl3 pretreatment on the etching of AlN in Cl2-based plasma

2008 ◽  
Vol 1108 ◽  
Author(s):  
Xiaoyan Xu ◽  
Vladimir Kuryatkov ◽  
Boris Borisov ◽  
Mahesh Pandikunta ◽  
Sergey A Nikishin ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Plasma Etching ◽  
Inductively Coupled Plasma ◽  
Etch Rate ◽  
Reactive Ion Etching ◽  
Native Oxide ◽  
Short Exposure ◽  
Ion Etching ◽  
Inductively Coupled ◽  
High Etch Rate

AbstractThe effect of BCl3 and BCl3/Ar pretreatment on Cl2/Ar and Cl2/Ar/BCl3 dry etching of AlN is investigated using inductively coupled plasma reactive ion etching. The native AlN oxide can be effectively removed by a short exposure to BCl3 or BCl3/Ar plasma. Compared to the chlorine based plasma etching, BCl3/Ar is found to have the highest etch rate for both AlN and its native oxide. Following removal of the native oxide, Cl2/Ar/BCl3 plasma etching with 15% BCl3 fraction results in a high etch rate ˜ 87 nm/min and modest increases in the surface roughness.

Characterization of Sidewall Residue Film and Atomic Structure of the Trench Formed by BCI3/CI2 Reactive Ion Etching

1989 ◽  
Vol 158 ◽  
Author(s):  
Sun Jin Yun ◽  
Young-Jin Jeon ◽  
Jeong Y. Lee
Keyword(s):  
Photoelectron Spectroscopy ◽  
Secondary Ion Mass Spectrometry ◽  
Reactive Ion Etching ◽  
Surface Region ◽  
Bottom Surface ◽  
Silicon Substrates ◽  
Ion Etching ◽  
Transmission Electron ◽  
Physical Sputtering ◽  
20 Nm

ABSTRACTThe silicon trench etching in BCl3/Cl2 reactive ion etching plasma leads to the intrinsic bonding damage, the permeations of etching species and impurities into silicon substrates, and the deposition of residue film on trench sidewall. The contaminations and the damages in trench were investigated by using high resolution transmission electron microscopy (HRTEM), secondary ion mass spectrometry (SIMS), and x-ray photoelectron spectroscopy (XPS). The microstructure of the rounded bottom surface showed that the surface region was distorted by 2 - 6 atomic layers and the trench etch was mainly limited by the physical sputtering-like mechanism. The damage in the silicon lattice consisted of prominent planar defects roughly confined to {110} and {111} planes. The thickness of sidewall residue film was 10 - 90 nm, which was thinner at deeper region of the trench, whereas that of residue film at the trench bottom was 1.5 - 3.5 nm. The SIMS results of no-patterned specimen presented that the permeation depths of boron and chlorine into the Si-substrate were about 40 and 20 nm, respectively. The presence of BxCly and Cl-related Si chemical states was identified from XPS analysis of the residue film.

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