scholarly journals The Organometallic Chemical Vapor Deposition of Transition Metal Carbides: the Use of Homoleptic Alkyls

1993 ◽  
Vol 327 ◽  
Author(s):  
Matthew D. Healy ◽  
David C. Smith ◽  
Rodrigo R. Rubiano ◽  
Robert W. Springer ◽  
John E. Parmeter
Keyword(s):  
Chemical Vapor Deposition ◽  
Transition Metal ◽  
Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Metal Carbides ◽  
Transition Metal Carbides ◽  
Steel Substrates ◽  
Surface Decomposition ◽  
Organometallic Chemical Vapor Deposition

AbstractThe organometallic chemical vapor deposition (OMCVD) of transition metal carbides (M = Ti, Zr, Hf, and Cr) from tetraneopentyl-metal precursors has been carried out. Metal carbides can be deposited on Si, A120 3, and stainless steel substrates from M[CH 2C(CH3)3]4 at temperatures in the range of 300 to 750 "C and pressures from 10-2 to 10-4 Torr. Thin films have also been grown using a carrier gas (Ar, H2). The effects of variation of the metal center, deposition conditions, and reactor design on the resulting material have been examined by SEM, XPS, XRD, ERD and AES. Hydrocarbon fragments generated in the deposition chamber have been studied by in-situ mass spectrometry. Complimentary studies examining the UHV surface decomposition of Zr[CH2C(CH3)3]4 have allowed for a better understanding of the mechanism leading to film growth.

Low-Temperature Organometallic Chemical Vapor Deposition of Transition Metals

1988 ◽  
Vol 131 ◽  
Author(s):  
Herbert D. Kaesz ◽  
R. Stanley Williams ◽  
Robert F. Hicks ◽  
Yea-Jer Arthur Chen ◽  
Ziling Xue ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Transition Metal ◽  
Metal Complexes ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Metal Films ◽  
Film Deposition ◽  
X Ray ◽  
Substrate Temperatures ◽  
Organometallic Chemical Vapor Deposition

ABSTRACTA variety of transition-metal films have been grown by organometallic chemical vapor deposition (OMCVD) at low temperatures using hydrocarbon or hydrido-carbonyl metal complexes as precursors. The vapors of the metal complexes are transported with argon as the carrier gas, adding H2 to the stream shortly before contact with a heated substrate.High-purity platinum films have been grown using (η5−C5H5)PtMe3 [1] or (η5−CH3C5H4)PtMe3 [2] at substrate temperatures of 180°C or 120°C, respectively. The incorporation of a methyl substituent on the cyclopentadienyl ligand decreases the melting point of the organoplatinum complex from 106°C [1] to 30°C [2] and increases the vapor pressure substantially. Film deposition also occurs at a lower substrate temperature. Analyses by X-ray diffraction (XRD), Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) indicate that the films are well crystallized and do not contain any observable impurities after sputter cleaning.The substrate temperatures for the first appearance of other transition-metal films from organometallic precursors are as follows (°C): Rh(η3−C3H5)3 (120/Si), Ir(η3-C3H5)3 (100/Si), HRe(CO)5 (130/Si) and Ni(η5−CH3C5H4)2 (190/glass, 280/Si). These films are essentially amorphous and contain trace oxygen impurities (< 2%), except for the Re film, which was 10% oxygen and 20%carbon.

Heteroepitaxial growth of 3C–SiC film on Si(100) substrate by plasma chemical vapor deposition using monomethylsilane

2007 ◽  
Vol 22 (5) ◽  
pp. 1275-1280 ◽  
Author(s):  
Y. Morikawa ◽  
M. Hirai ◽  
A. Ohi ◽  
M. Kusaka ◽  
M. Iwami
Keyword(s):  
Chemical Vapor Deposition ◽  
Substrate Temperature ◽  
Single Molecule ◽  
Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Heteroepitaxial Growth ◽  
Plasma Chemical ◽  
Plasma Chemical Vapor Deposition ◽  
Sic Film

We have studied the heteroepitaxial growth of 3C–SiC film on an Si(100) substrate by plasma chemical vapor deposition using monomethylsilane, a single-molecule gas containing both Si and C atoms. We have tried to introduce an interval process, in which we decrease the substrate temperature for a few minutes at a suitable stage of film growth. It was expected that, during the interval process, stabilization such as desorption of nonreacted precursors and lateral diffusion of species produced at the initial stage of film growth would occur. From the results, it appears that the interval process using a substrate temperature of 800 °C effectively suppresses polycrystallization of 3C–SiC growth on the Si(100) surface

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