Insoluble, Low Dielectric Polyimides

1990 ◽  
Vol 214 ◽  
Author(s):  
Diane M. Stoakleya ◽  
Anne K. St. Clair
Keyword(s):  
Dielectric Constants ◽  
Structure Property ◽  
Polyimide Films ◽  
Electronic Interactions ◽  
Excellent Thermal Stability ◽  
Low Dielectric ◽  
Structure Property Relationships ◽  
Enhanced Solubility ◽  
Hydraulic Fluids ◽  
Image Position

ABSTRACTStudies have been conducted at NASA Langley establishing structure-property relationships in polyimides that provide a means of lowering dielectric constants by reducing chain-chain electronic interactions and by incorporation of fluorine into the polymer molecular structure. The resulting polyimides exhibit excellent thermal stability and mechanical strength, improved resistance to moisture and enhanced solubility. Most polyimides containing fluorine in only one monomer are at least partially soluble in common organic solvents, and polyimides containing fluorine in both the dianhydride and the diamine are fully soluble. Although this enhanced solubility aides processability and is desirable for many applications, it is a severe disadvantage for aircraft applications where exposure to hydraulic fluids and other chemicals is likely to occur. This work involves the development of insoluble, low dielectric polymers prepared from 2, 2-bis[4-(3, 4-dicarboxyphenoxy)phenyl]hexafluoropropane dianhydride (BFDA) and selected fluorine-containing diamines.BFDA-containing polyimide films had dielectric constants that ranged from 2.44 to 2.53 at 10 GHz and exhibited insolubility in solvents including N, N-dimethylacetamide, chloroform, diglyme and N-methylpyrrolidinone.

Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric Films

2003 ◽  
Vol 766 ◽  
Author(s):  
Do Y. Yoon ◽  
Hyun Wook Ro ◽  
Eun Su Park ◽  
Jin-Kyu Lee ◽  
Hie-Joon Kim ◽  
...  
Keyword(s):  
Copper Interconnects ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Structure And Properties ◽  
Structure Property ◽  
Detailed Structure ◽  
Low Dielectric ◽  
Structure Property Relationships ◽  
Mechanical Modulus ◽  
Made In

AbstractPolysilsesquioxanes (PSSQs) with the empirical formula (RSiO3/2)n have become very important as low-dielectric insulators for copper interconnects in the next-generation logic devices, but the detailed structure-property relationships were completely lacking. We have investigated the microstructure and functional properties of PSSQs with varying alkyl substituents and also PSSQ copolymers. As a result, significant advances have been made in the scientific understanding of PSSQ structures and significant improvements of key properties such as the crack resistance, mechanical modulus and hardness, and incorporation of nanometer-sized (<4 nm) porosity for ultra-low dielectric constants (<2.0).

A methodology for the preparation of nanoporous polyimide films with low dielectric constants

2006 ◽  
Vol 510 (1-2) ◽  
pp. 241-246 ◽  
Author(s):  
Lizhong Jiang ◽  
Jiugui Liu ◽  
Dezhen Wu ◽  
Hangquan Li ◽  
Riguang Jin
Keyword(s):  
Dielectric Constants ◽  
Polyimide Films ◽  
Low Dielectric

Determination of structure-property relationships for 3-aminopropyltriethoxysilane films using x-ray reflectivity

2013 ◽  
Vol 28 (8) ◽  
pp. 1118-1128 ◽  
Author(s):  
Sandip U. Argekar ◽  
Terence L. Kirley ◽  
Dale W. Schaefer
Keyword(s):  
Structure Property ◽  
X Ray ◽  
Structure Property Relationships ◽  
Image Position

Abstract

Nanoporous Polyimide Films from Polyimide-Aliphatic Polyester or Polyimide-Aliphatic Polycarbonate Copolymers

1996 ◽  
Vol 431 ◽  
Author(s):  
K. R. Carter ◽  
J. L. Hedrick ◽  
R. Richter ◽  
P. T. Furuta ◽  
D. Mecerreyes ◽  
...  
Keyword(s):  
Ring Opening ◽  
Dielectric Constants ◽  
Foam Formation ◽  
Aliphatic Polyester ◽  
Trimethylene Carbonate ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Microelectronic Devices ◽  
Aliphatic Polycarbonate ◽  
Film Dielectric

AbstractWe have explored polyimide foams created using a block copolymer approach as part of our research efforts to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices. In these systems the pore sizes are in the nanometer range thus the term “nanofoam”, The polyimide foams are prepared from phase separated block copolymers consisting of thermally stabile and thermally labile blocks, the latter being the dispersed phase. Foam formation is effected by thermolysis of the labile block leaving pores the size and shape corresponding to the initial copolymer morphology. Polyimide nanofoams generated from thermolysis of polyimidealiphatic polyester and polyimide-aliphatic polycarbonate copolymers were investigated. The aliphatic co-blocks were synthesized by ring opening polymerization of the cyclic monomers, such as E-caprolactone, valerolactone, trimethylene carbonate, and L-lactide. The aliphatic blocks were designed in such a way as to allow for incorporation into polyimide copolymers. The foams were characterized by a variety of techniques including, TEM, SAXS, WAXD, DMTA, density and refractive index measurements.

scholarly journals Structural and dielectric properties of some epiclon-based polyimide films

e-Polymers ◽  
2008 ◽  
Vol 8 (1) ◽  
Author(s):  
Andreea Irina Cosutchi ◽  
Camelia Hulubei ◽  
Iuliana Stoica ◽  
Marius Dobromir ◽  
Silvia Ioan
Keyword(s):  
Chemical Structure ◽  
Electrical Conductance ◽  
Dielectric Constants ◽  
Isothermal Treatment ◽  
Cross Linking ◽  
Polyimide Films ◽  
Aromatic Polyimides ◽  
Low Dielectric ◽  
Dielectric Layers ◽  
High Roughness

AbstractSurface and electrical properties of two flexible and cross-linked epiclon based polyimide films were investigated. Surface tension measurements indicate an increased hydrophobicity due to both isothermal treatment - which induces imidization and cross-linking - and to the chemical structure, characterized by the different number of ether linkages in the polyimide backbone. Morphology of film surfaces, modified by plasma treatment, shows high roughness and, implicitly, improved adhesion, as required in electronics. The studied polyimides exhibit low dielectric constants and dielectric losses, comparatively to conventional aromatic polyimides. The electrical conductance and resistivity characteristics of these polymers recommend them as good insulators for dielectric layers in microelectronic applications.

An Interesting Result of Dielectric Property for Novel Polyimides with Fluorene Groups

2010 ◽  
Vol 663-665 ◽  
pp. 511-514 ◽  
Author(s):  
Yuan Yuan ◽  
Bing Xie ◽  
Yu Wang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Dielectric Property ◽  
Dielectric Constants ◽  
The Other ◽  
Polyimide Films ◽  
Low Dielectric ◽  
High Dielectric ◽  
Biphenyltetracarboxylic Dianhydride

A series of polyimide thin films were prepared successfully based on bis[3,5-dimethyl-4- (4-aminophenoxy)phenyl]methane （BDAPM）, 9,9-bis（4-（4-aminophenoxy）phenyl）fluorene (BAOFL) and different dianhydrides. And an interesting result of dielectric property for polyimide thin films was found that the polyimide thin film prepared with 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) exhibited high dielectric constants of 5.7 at 1MHz. Conversely, the other polyimides possessing fluorene groups showed low dielectric constants. The structures and the mechanical properties of polyimide films also proved the reason for results of dielectric properties.

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