Mechanical Properties of Multilayered Copper-Nickel thin films Measured by Indentation Techniques

1990 ◽  
Vol 188 ◽  
Author(s):  
T. E. Schlesinger ◽  
R. C. Cammarata ◽  
C. Kim ◽  
S. B. Qadri ◽  
A. S. Edelstein
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Ion Beam ◽  
Repeat Length ◽  
Elastic Behavior ◽  
Ion Beam Sputtering ◽  
Individual Layer ◽  
Nickel Thin Films ◽  
Copper Nickel ◽  
Low Load

ABSTRACTArtificially multilayered copper/nickel thin films with bilayer repeat lengths between 1.6 and 12 nm were produced by ion beam sputtering. The mechanical properties of these films were investigated by low load microhardness and nanoindentation (force versus depth) techniques. It was found that none of the films displayed bilayer repeat length dependent enhanced elastic behavior (the supermodulus effect) as measured during unloading in the nanoindenter. However, enhancements in hardness, as measured by both the nanoindenter and the low load microhardness tester, were observed in films with small bilayer repeat lengths. These measurements displayed a Hall-Petch-type relationship, using the individual layer thickness (equal to half the bilayer repeat length) as the characteristic “grain size.” This hardness behavior can be understood in terms of a mechanism involving dislocation pinning at the interfaces analogous to the mechanism of grain boundary hardening.

Ion Beam Processing of Optical Materials

1988 ◽  
Vol 129 ◽  
Author(s):  
F. L. Williams ◽  
L. L. Boyer ◽  
W. Reicher ◽  
J. J. McNally ◽  
G. A. Al-Jumaily ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Packing Density ◽  
Optical Materials ◽  
Ion Beam ◽  
Film Material ◽  
Ion Beam Sputtering ◽  
Beam Sputtering ◽  
Optical And Mechanical Properties ◽  
Deposition Techniques

ABSTRACTWe have deposited thin films of optical materials using ion beam sputtering and ion assisted deposition techniques. It is possible to obtain good quality film material deposited on substrates at temperatures lower than normally required. Ion assisted deposition influences film stoichiometry and packing density, which in turn determine optical and mechanical properties of the film material. We discuss two general indicators which appear helpful in predicting the degree to which these occur.

Structural and Mechanical Properties of Stainless Steel Thin Films Elaborated by Thermal Evaporation and Ion Beam Sputtering

2003 ◽  
Vol 426-432 ◽  
pp. 3451-3456 ◽  
Author(s):  
Philippe Goudeau ◽  
N. Merakeb ◽  
J.P. Eymery ◽  
D. Faurie ◽  
B. Boubeker ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Stainless Steel ◽  
Thermal Evaporation ◽  
Ion Beam ◽  
Ion Beam Sputtering ◽  
Beam Sputtering

Ion Beam Processing of Optical Materials

1988 ◽  
Vol 128 ◽  
Author(s):  
F. L. Williams ◽  
L. L. Boyer ◽  
D W. Reicher ◽  
J. J. McNally ◽  
G. A. Al-Jumaily ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Packing Density ◽  
Optical Materials ◽  
Ion Beam ◽  
Film Material ◽  
Ion Beam Sputtering ◽  
Beam Sputtering ◽  
Optical And Mechanical Properties ◽  
Deposition Techniques

ABSTRACTWe have deposited thin films of optical materials using ion beam sputtering and ion assisted deposition techniques. It is possible to obtain good quality film material deposited on substrates at temperatures lower than normally required. Ion assisted deposition influences film stoichiometry and packing density, which in turn determine optical and mechanical properties of the film material. We discuss two general indicators which appear helpful in predicting the degree to which these occur.

Preparation of thin films of (Tb,Dy)Fe2 giant magnetostrictive alloy by ion beam sputtering process.

1996 ◽  
Vol 8 (1/2) ◽  
pp. 27-28
Author(s):  
Mitsuhiro WADA ◽  
Yoshihito MATSUMURA ◽  
Hirohisa UCHIDA ◽  
Haru-Hisa UCHIDA ◽  
Hideo KANEKO
Keyword(s):  
Thin Films ◽  
Ion Beam ◽  
Ion Beam Sputtering ◽  
Beam Sputtering

Percolation Effects in the Mechanical Properties of Granular Ni-A12O3 thin films

1990 ◽  
Vol 195 ◽  
Author(s):  
T.E. Schlesinger ◽  
A. Gavrin ◽  
R.C. Cammarata ◽  
C.-L. Chien
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Plastic Deformation ◽  
Magnetic Properties ◽  
Percolation Threshold ◽  
Volume Fraction ◽  
Electrical And Magnetic Properties ◽  
Low Load

ABSTRACTThe mechanical properties of sputtered Ni-Al2O3 granular thin films were investigated by low load microharaness testing. It was found that the microhardness of these films displayed a percolation threshold at a nickel volume fraction of about 0.6, below which the hardness is greatly enhanced. This behavior is qualitatively similar to the electrical and magnetic properties of these types of films. A percolation threshold in hardness can be understood as due to a change in the mechanism for plastic deformation.

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

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