Fabrication of High Quality Silicide Layers by Ion Implantation

1989 ◽  
Vol 147 ◽  
Author(s):  
Karen J Reeson ◽  
Ann De Veirman ◽  
Russell Gwilliam ◽  
Chris Jeynes ◽  
Brian J Sealy ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Single Crystal Silicon ◽  
High Quality ◽  
Crystal Silicon ◽  
The Matrix ◽  
Buried Layer ◽  
Buried Layers ◽  
C 30 ◽  
Type Lattice ◽  
Anneal Temperature

AbstractBuried layers of CoSi2 have been successfully fabricated in (100) single crystal silicon by implanting 350 keV Co+ to doses in the range 2 - 7 × 1017 cm−2 at a temperature of ∼550°C. For doses ≥ 4 × 101759Co+ cm−2, a continuous buried layer of CoSi2 grows epitaxially, during implantation. After annealing (1000°C 30 minutes) continuous layers of stoichiometric CoSi2 which are coherent with the matrix are produced for doses ≥ 4 × 101759Co+ cm−2. For doses of ≤ 2 × 101759Co+, cm−2, discrete octahedral precipitates of monocrystalline CoSi2 are observed. Isochronal annealing (for 5s) at temperatures in the range 800–1200°C, shows that at temperatures ≥ 900°C there is significant redistribution of the Co from B-type or interstitial sites → substitutional A-type lattice sites. As the anneal temperature is increased there is a corresponding improvement in the crystallinity and coherency of the Si and CoSi2 lattices. This shows that at a given temperature much of the Co redistribution takes place within the first 5s of the anneal.

Formation of Buried Tisi2 Layers in Single Crystal Silicon by Ion Implantion

1987 ◽  
Vol 107 ◽  
Author(s):  
P. Madakson ◽  
G.J. Clark ◽  
F.K. Legoues ◽  
F.M. d'Heurle ◽  
J.E.E. Baglin
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Room Temperature ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Buried Layers

Buried TiSi2 layers, about 600Å thick and 900Å below the surface, were formed in < 111> silicon by ion implantation. The implantation was done with either 120 or 170 keV Ti+ to doses ranging from 5 x 1016 to 2 x 1017 ions/cm2, and at temperatures of between ambient and 650° C. Annealing was done at 600° C, 700°C and 1000°C. Continuous buried layers were achieved only with samples implanted with doses equal or greater than 1017 ions/cm2 and at temperatures above 450°C. Below this dose TiSi2, was present only as discrete precipitates. For room temperature implants, the TiSi2, layer is formed on the surface. The damage present consists of dispersed TiSi6 precipitates and microtwins.

Synthesis of Buried Layers of β Sic in Single Crystal Silicon

1987 ◽  
Vol 107 ◽  
Author(s):  
Karen J Reeson ◽  
Peter L F Hemment ◽  
John Stoemenos ◽  
John R Davis ◽  
George K Celler
Keyword(s):  
Single Crystal ◽  
Single Crystal Silicon ◽  
Silicon Substrates ◽  
Carbon Ions ◽  
Crystal Silicon ◽  
Implantation Temperature ◽  
High Temperature Anneal ◽  
Buried Layer ◽  
Buried Layers ◽  
High Doses

AbstractIt is demonstrated that buried layers of β SiC can be fabricated within single crystal silicon substrates by implanting high doses of energetic carbon ions. If the implantation temperature is sufficiently high >625°C then the β SiC grows epitaxially within the silicon, during implantation, using the substrate as a seed. During the subsequent high temperature anneal redistribution of the implanted species occurs to give a well defined buried layer of β SiC overlain by single crystal silicon.

Analysis of Silicon-On-Insulator Structures Formed By Oxygen Ion Implantation

1985 ◽  
Vol 43 ◽  
pp. 300-301
Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Dose ◽  
Crystal Silicon ◽  
Oxygen Ion ◽  
Oxygen Ion Implantation

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.

scholarly journals Effect of Ion Implantation on the Adhesion of Positive Diazoquinone-Novolak Photoresist Films to Single-Crystal Silicon

2020 ◽  
Vol 14 (6) ◽  
pp. 1352-1357
Author(s):  
S. A. Vabishchevich ◽  
S. D. Brinkevich ◽  
V. S. Prosolovich ◽  
N. V. Vabishchevich ◽  
D. I. Brinkevich
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Crystal Silicon

Effect of Thermal Processing Conditions on Ferroelectric PZT Thin Films

1990 ◽  
Vol 200 ◽  
Author(s):  
Chi K. Kwok ◽  
Seshu B. Desu ◽  
Lee Kammerdiner
Keyword(s):  
Thin Films ◽  
Lead Zirconate Titanate ◽  
Surface Composition ◽  
Rf Sputtering ◽  
Single Crystal Silicon ◽  
Lead Zirconate ◽  
Crystal Silicon ◽  
Pyrochlore Type ◽  
Switching Characteristics ◽  
Anneal Temperature

ABSTRACTFerroelectric and transparent lead–zirconate–titanate thin films were fabricated by rf sputtering. The substrates used were Pt–coated single crystal silicon. The deposition temperatures were relatively low (≅ 200°C). Annealing at high temperatures yielded first pyrochlore type and finally perovskite with good switching characteristics. The phase structure, microstructure, surface composition, and properties were measured as a function annealing time and temperature. In general, the Pb concentration on the surface decreased with increasing annealing temperature or time, whereas Zr concentration increased. It was observed that the grain size of perovskite PZT did not show any significant changes with increasing either anneal temperature or time.

The Physical and Electrical Properties of Buried Nitride Soi Structures Synthesized By Nitrogen Ion Implantation

1985 ◽  
Vol 53 ◽  
Author(s):  
C. Slawinski ◽  
B.-Y. Mao ◽  
P.-H. Chang ◽  
H.W. Lam ◽  
J.A. Keenan
Keyword(s):  
Ion Implantation ◽  
Nitrogen Concentration ◽  
Silicon Film ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
Silicon On Insulator ◽  
Crystal Silicon ◽  
Nitrogen Ion Implantation ◽  
Donor Formation ◽  
Nitrogen Ion

ABSTRACTBuried nitride silicon-on-insulator (SOI) structures have been fabricated using the technique of nitrogen ion implantation. The crystallinity of the top silicon film was found to be exceptionally good. The minimum channeling yield, Xmin' was better than 3%. This is comparable to the value observed for single crystal silicon. The buried insulator formed during the anneals has been identified as polycrystalline α-Si3 N4 with numerous silicon inclusions. This nitride, however, has been found to remain amorphous in regions at the center of the implant where the nitrogen concentration exceeds the stoichiometric level of Si3N4. Nitrogen donor formation in the top silicon layer has also been observed.

A New Local Electronic Stopping Model for the Monte Carlo Simulation of Arsenic Ion Implantation into (100) Single-Crystal Silicon

1995 ◽  
Vol 389 ◽  
Author(s):  
S.-H. Yang ◽  
S. Morris ◽  
S. Tian ◽  
K. Parab ◽  
A. F. Tasch ◽  
...  
Keyword(s):  
Monte Carlo ◽  
Ion Implantation ◽  
Single Crystal ◽  
Density Functional ◽  
Single Crystal Silicon ◽  
Stopping Power ◽  
Crystal Silicon ◽  
Electronic Density ◽  
New Model ◽  
Electronic Stopping Power

ABSTRACTIn this paper is reported the development and implementation of a new local electronic stopping model for arsenic ion implantation into single-crystal silicon. Monte Carlo binary collision (MCBC) models are appropriate for studying channeling effects since it is possible to include the crystal structure in the simulators. One major inadequacy of existing MCBC codes is that the electronic stopping of implanted ions is not accurately and physically accounted for, although it is absolutely necessary for predicting the channeling tails of the profiles. In order to address this need, we have developed a new electronic stopping power model using a directionally dependent electronic density (to account for valence bonding) and an electronic stopping power based on the density functional approach. This new model has been implemented in the MCBC code, UT-MARLOWE The predictions of UT-MARLOWE with this new model are in very good agreement with experimentally-measured secondary ion mass spectroscopy (SIMS) profiles for both on-axis and off-axis arsenic implants in the energy range of 15-180 keV.

Silicon Carbide: Progress in Crystal Growth

1987 ◽  
Vol 97 ◽  
Author(s):  
J. Anthony Powell
Keyword(s):  
Silicon Carbide ◽  
Crystal Growth ◽  
High Temperature ◽  
Epitaxial Growth ◽  
Recent Progress ◽  
Single Crystal Silicon ◽  
Silicon Substrates ◽  
Large Area ◽  
High Quality ◽  
Crystal Silicon

ABSTRACTSilicon carbide (SiC), with a favorable combination of semiconducting and refractory properties, has long been a candidate for high temperature semiconductor applications. Research on processes for producing the needed large-area high quality single crystals has proceeded sporadically for many years. Two characteristics of SiC have aggravated the problem of its crystal growth. First, it cannot be melted at any reasonable pressure, and second, it forms many different crystalline structures, called polytypes. Recent progress in the development of two crystal growth processes will be described. These processes are the modified Lely process for the growth of the alpha polytypes (e.g. 6H SiC), and a process for the epitaxial growth of the beta polytype (i.e. 3C or cubic SiC) on single crystal silicon substrates. A discussion of the semiconducting qualities of crystals grown by various techniques will also be included.

Single Crystal Silicon Membranes

1987 ◽  
Vol 115 ◽  
Author(s):  
Andres Fernandez ◽  
P. Hren ◽  
K. C. Lee ◽  
J. Silcox
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Silicon Wafers ◽  
Subsequent Annealing ◽  
Crystal Silicon ◽  
Anodic Etching ◽  
Silicon Membranes

ABSTRACTSelf-supporting, thin single crystal membranes can be fabricated from silicon wafers using ion implantation, anodic etching and subsequent annealing. Typically, membranes approximately 1200Å thick and about 250μm in diameter are formed in wafers 4 mil thick. Discs surrounding the membranes can be cut out to provide suitable TEM samples. In this paper, the steps for preparing such samples are presented with as much attention paid to experimental details as possible.

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