Synthesis of Buried Layers of β Sic in Single Crystal Silicon

1987 ◽  
Vol 107 ◽  
Author(s):  
Karen J Reeson ◽  
Peter L F Hemment ◽  
John Stoemenos ◽  
John R Davis ◽  
George K Celler

AbstractIt is demonstrated that buried layers of β SiC can be fabricated within single crystal silicon substrates by implanting high doses of energetic carbon ions. If the implantation temperature is sufficiently high >625°C then the β SiC grows epitaxially within the silicon, during implantation, using the substrate as a seed. During the subsequent high temperature anneal redistribution of the implanted species occurs to give a well defined buried layer of β SiC overlain by single crystal silicon.

1985 ◽  
Vol 128 (1-2) ◽  
pp. 125-131 ◽  
Author(s):  
P.L.F. Hemment ◽  
E.A. Maydell-Ondrusz ◽  
J.E. Castle ◽  
R. Paynter ◽  
M.C. Wilson ◽  
...  

1989 ◽  
Vol 147 ◽  
Author(s):  
Karen J Reeson ◽  
Ann De Veirman ◽  
Russell Gwilliam ◽  
Chris Jeynes ◽  
Brian J Sealy ◽  
...  

AbstractBuried layers of CoSi2 have been successfully fabricated in (100) single crystal silicon by implanting 350 keV Co+ to doses in the range 2 - 7 × 1017 cm−2 at a temperature of ∼550°C. For doses ≥ 4 × 101759Co+ cm−2, a continuous buried layer of CoSi2 grows epitaxially, during implantation. After annealing (1000°C 30 minutes) continuous layers of stoichiometric CoSi2 which are coherent with the matrix are produced for doses ≥ 4 × 101759Co+ cm−2. For doses of ≤ 2 × 101759Co+, cm−2, discrete octahedral precipitates of monocrystalline CoSi2 are observed. Isochronal annealing (for 5s) at temperatures in the range 800–1200°C, shows that at temperatures ≥ 900°C there is significant redistribution of the Co from B-type or interstitial sites → substitutional A-type lattice sites. As the anneal temperature is increased there is a corresponding improvement in the crystallinity and coherency of the Si and CoSi2 lattices. This shows that at a given temperature much of the Co redistribution takes place within the first 5s of the anneal.


1987 ◽  
Vol 107 ◽  
Author(s):  
P. Madakson ◽  
G.J. Clark ◽  
F.K. Legoues ◽  
F.M. d'Heurle ◽  
J.E.E. Baglin

Buried TiSi2 layers, about 600Å thick and 900Å below the surface, were formed in < 111> silicon by ion implantation. The implantation was done with either 120 or 170 keV Ti+ to doses ranging from 5 x 1016 to 2 x 1017 ions/cm2, and at temperatures of between ambient and 650° C. Annealing was done at 600° C, 700°C and 1000°C. Continuous buried layers were achieved only with samples implanted with doses equal or greater than 1017 ions/cm2 and at temperatures above 450°C. Below this dose TiSi2, was present only as discrete precipitates. For room temperature implants, the TiSi2, layer is formed on the surface. The damage present consists of dispersed TiSi6 precipitates and microtwins.


JOM ◽  
2013 ◽  
Vol 65 (4) ◽  
pp. 567-573 ◽  
Author(s):  
Jiapeng Xu ◽  
Daniel Erickson ◽  
Sudesna Roy ◽  
Vinod Sarin

2019 ◽  
Vol 89 (7) ◽  
pp. 1086
Author(s):  
М.В. Кузьмин ◽  
М.А. Митцев

Adsorption of carbon monoxide (CO) molecules on ytterbium nanofilms with the thickness of 16 – 200 monolayers (6.1 – 76 nm) has been studied. The films are grown on single-crystal silicon substrates with the (111) surface orientation. It is shown that before the adsorption of CO molecules, ytterbium is divalent with the electronic configuration of [Xe]4f146s2. Upon the adsorption of gas molecules, a layer of trivalent ytterbium (the electronic configuration is [Xe]4f135d16s2), which is adjacent to the film surface, is formed. Evaluations of the thickness of the layer modified by adsorbed CO molecules are performed. Such evaluations have given rise to the values within 9 – 22 monolayers (3.4 – 8.4 nm).


1983 ◽  
Vol 25 ◽  
Author(s):  
I. C. Cheng ◽  
S. S. Lau ◽  
R. D. Thompson ◽  
K. N. Tu

ABSTRACTGadolinium silicide with its attractive features of low formation temperature of about 350°C and low Schottky barrier height on n-type single-crystal silicon substrates (ϕnB1∼O.4ev,ϕpB ∼ 0.7ev) was chosen for studying the feasibility of forming shallow uniform contacts. Samples with various compositions prepared by both bilayer evaporation with a configuration of Si(α)/Gd/Si(xtl) and coevaporation with a Si−Gd /Si(xtl)structure were used for studying the contact formation as a function of composition and heat treatment. We found that shallow contact formation can be achieved provided that the following conditions are met: (a) for bilayer evaporation, the atomic ratio of Si(α)/Gd ≥ 2 should be maintained, (b) for coevaporation, the Si to Gd atomic ratio between 1.7 and 2.0 is desired. The bilayer deposition scheme appears to be a more convenient technique to use in practice.


1985 ◽  
Vol 54 ◽  
Author(s):  
E. Bauser ◽  
D. KÄss ◽  
M. Warth ◽  
H. P. Strunk

ABSTRACTSingle-crystal silicon layers and doping multilayers have been grown by liquid phase qpitaxy on silicon substrates. The substrates were either partially masked by SiO2, with via holes of various shapes and sizes, or patterned with SiO2 stripes, or profiled with grooves and ridges. The via holes and grooves were just refilled, or they acted as seeding areas for lateral overgrowth of the oxidized wafer up to 100μm. The silicon layers, interfaces and heterointerfaces were free of defects. With appropriate growth conditions the surfaces and interfaces of the epitaxial Si were outstandingly planar.


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