The Effect of Reflow Temperature on Time at the End of Gravity Zone (Tgz) of Sn-3.8Ag-0.7Cu Solder Alloy

2020 ◽  
Vol 9 (1) ◽  
pp. 20190230
Author(s):  
Ramanandan Santhanu Panikar ◽  
V. Amogha Skanda ◽  
Sanjay Tikale ◽  
K. Narayan Prabhu
Keyword(s):  
Solder Alloy ◽  
Reflow Temperature

Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

2013 ◽  
Vol 315 ◽  
pp. 675-680 ◽  
Author(s):  
Efzan M.N. Ervina ◽  
S.Y. Tan
Keyword(s):  
Contact Angle ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Temperature ◽  
Ε Phase ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Significant Increment

This work presents the studies of wettability Sn-6Zn-4Bi lead-free solder alloy in electronic applications. A reference solder Sn-3.1Ag-0.9 Cu lead-free solder alloy is used to compare the properties of both solders. Differential Scanning Calorimeter (DSC) profile, wettability and the microstructure of the solder were investigated. The melting temperature of Sn-Zn-Bi (Tm=194.97°C) is lower than Sn-Ag-Cu (Tm=220.40°C). Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for Sn-Ag-Cu was decreasing from 28.23º to 24.97º and for Sn-Zn-Bi solder alloys were decreasing from 48.92º to 29.78º as the temperature increased from 230°C to 250°C. A significant increment of contact angle for Sn-Zn-Bi at 270°C and the contact angle did not change at 270°C for Sn-Ag-Cu. The result of spreading area is inversed with the contact angle. The layers of intermetallic compound were examined by energy-dispersive X-ray. The Sn-Zn-Bi solder exhibits a mixture of Cu-Sn+Cu-Zn phase and ϒ-Cu5Zn8phase. The Sn-Ag-Cu solder exhibits Cu6Sn5 (η-phase) and Cu3Sn (ε-phase). As a conclusion, Sn-Zn-Bi is a potential lead-free solder to develop based on its wettability properties than previous available solder materials.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

2002 ◽  
Author(s):  
Cemal Basaran ◽  
Jianbin Jiang
Keyword(s):  
Grain Size ◽  
Elastic Modulus ◽  
Single Crystal ◽  
Solder Alloy ◽  
Ultrasonic Testing ◽  
Heterogeneous Materials ◽  
Testing Methods ◽  
Nano Indentation ◽  
Deformation Kinetics ◽  
Kinetics Of

Young’s modulus (E) values published in literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.

A modified energy-based low cycle fatigue model for eutectic solder alloy

1999 ◽  
Vol 41 (3) ◽  
pp. 289-296 ◽  
Author(s):  
X.Q Shi ◽  
H.L.J Pang ◽  
W Zhou ◽  
Z.P Wang
Keyword(s):  
Solder Alloy ◽  
Low Cycle Fatigue ◽  
Cycle Fatigue ◽  
Eutectic Solder ◽  
Fatigue Model

scholarly journals Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1545
Author(s):  
Agata Skwarek ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Przemysław Ptak ◽  
Krzysztof Górecki ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Zno Nanoparticles ◽  
Composite Solder ◽  
Void Formation ◽  
Particle Sizes ◽  
Solder Paste ◽  
Solder Alloys ◽  
Ion Microscopy ◽  
Zno Ceramics ◽  
Thermoelectric Parameters

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.

Selective separation of copper over solder alloy from waste printed circuit boards leach solution

2017 ◽  
Vol 60 ◽  
pp. 636-642 ◽  
Author(s):  
Maryam Kavousi ◽  
Anahita Sattari ◽  
Eskandar Keshavarz Alamdari ◽  
Sadegh Firozi
Keyword(s):  
Solder Alloy ◽  
Printed Circuit Boards ◽  
Leach Solution ◽  
Selective Separation ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

scholarly journals Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

2015 ◽  
Vol 20 ◽  
pp. 9-14 ◽  
Author(s):  
Mohd Faizul Mohd Sabri ◽  
Suhana Binti Mohd Said ◽  
Dhafer Abdulameer Shnawah
Keyword(s):  
Solder Alloy ◽  
Cu Substrate ◽  
Spread Area

scholarly journals Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2335
Author(s):  
Jialong Qiu ◽  
Yanzhi Peng ◽  
Peng Gao ◽  
Caiju Li
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Tensile Tests ◽  
Melting Behavior ◽  
Second Phase ◽  
Solder Alloys ◽  
Cu Content ◽  
Diffusion Force ◽  
Fine Microstructure ◽  
Effect Of Copper

The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

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