Elastic Modulus of Pb/Sn Solder Joints in Microelectronics
Keyword(s):
Young’s modulus (E) values published in literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.
2005 ◽
Vol 391
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pp. 272-284
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2005 ◽
Vol 406
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pp. 78-85
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1990 ◽
Vol 55
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pp. 345-353
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Keyword(s):
2004 ◽
Vol 381
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pp. 237-248
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2015 ◽
Vol 2
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pp. S440-S452
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1987 ◽
Vol 87
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pp. 2305-2315
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