scholarly journals A new method for Synthesis of Epitaxial Films of Silicon Carbide on Sapphire Substrates (α-Al2O3)

2018 ◽  
Vol 57 (1) ◽  
pp. 82-96 ◽  
Author(s):  
S.A. Kukushkin ◽  
A.V. Osipov ◽  
A.V. Redkov ◽  
A.S. Grashchenko ◽  
N.A. Feoktistov ◽  
...  

Abstract A fundamentally new method for synthesis of thick (200-400 nm) epitaxial films of silicon carbide on single-crystal Al2O3 substrates is proposed. The method develops the previously discovered method of topochemical substitution of atoms during the transformation of Si into SiC. In the proposed method, a layer of epitaxial Si of orientation (100) or (111) is being preliminarily deposited on the sapphire via CVD or other technique. Then, using a topochemical reaction between the CO gas and the deposited epitaxial silicon film, a part of Si atoms is being substituted by carbon atoms. As a result, the silicon film transforms into SiC film. As experimental studies have shown, in the process of this transformation a high-quality epitaxial SiC layer can be formed on the sapphire surface under certain synthesis conditions. A detailed investigation of grown SiC layers using the methods of electron diffraction, ellipsometry, Raman spectroscopy, X-ray diffractometry and scanning microscopy is conducted and an analysis of experimental data is given. Formation of both cubic 3C-SiC and hexagonal SiC polytypes during the transformation of Si into SiC was revealed by the XRD method. A detailed analysis of the current state of the problems of growth of epitaxial SiC layers on Al2O3 using various methods is provided. The method developed in this study opens up completely new perspectives not only for synthesis of semiconductors, but also for creation of new classes of composite, heat-resistant and other solid coatings.

2020 ◽  
Vol 1695 ◽  
pp. 012005
Author(s):  
A. S. Grashchenko ◽  
S. A. Kukushkin ◽  
A. V. Osipov

2016 ◽  
Vol 43 ◽  
pp. 01003
Author(s):  
Dina I. Bakranova ◽  
Sergey A. Kukushkin ◽  
Kair Kh. Nussupov ◽  
Andrey V. Osipov ◽  
Nurzhan B. Beisenkhanov

2016 ◽  
Vol 214 (4) ◽  
pp. 1600437 ◽  
Author(s):  
Atieh R. Kermany ◽  
James S. Bennett ◽  
Victor M. Valenzuela ◽  
Warwick P. Bowen ◽  
Francesca Iacopi

2011 ◽  
Vol 78 (7) ◽  
pp. 440 ◽  
Author(s):  
S. A. Kukushkin ◽  
A. V. Osipov ◽  
E. V. Osipova ◽  
S. V. Razumov ◽  
A. V. Kandakov

2008 ◽  
Vol 254 (20) ◽  
pp. 6601-6604 ◽  
Author(s):  
Xianjin Feng ◽  
Jin Ma ◽  
Fan Yang ◽  
Feng Ji ◽  
Fujian Zong ◽  
...  

2021 ◽  
Vol 1022 ◽  
pp. 80-86
Author(s):  
Mikhail G. Kholodnyak ◽  
Sergey A. Stelmakh ◽  
Evgeniy M. Shcherban ◽  
Mukhuma P. Nazhuev

The paper considers the current state of the mineral raw material base and the construction material market of the Rostov Region. The effect of various factors on the strain-stress behavior of local limestones has been investigated. The scientific and technical literary sources devoted to the processes of rock failure under various loads have been analyzed. The experimental studies have shown that the tested samples of limestone with a high content of cuboidal grains have characteristics comparable to those of the crushed granite stone. It has been concluded that the use of the Rostov Region limestones in the construction industry is competitive and feasible, provided the proper implementation of the engineering measures proposed in their production.


2000 ◽  
Author(s):  
Anatoly V. Shturbin ◽  
Ilya E. Titkov ◽  
Vadim Y. Panevin ◽  
Leonid E. Vorobjev ◽  
Renata F. Witman

2012 ◽  
Vol 717-720 ◽  
pp. 861-864 ◽  
Author(s):  
Hideki Yamada ◽  
Satarou Yamaguchi ◽  
Norimasa Yamamoto ◽  
Tomohisa Kato

A new method based on electric discharge machining (EDM) was developed for cutting a silicon carbide (SiC) ingot. The EDM method is a very useful technique to cut hard materials like SiC. By cutting with the EDM method, kerf loss and roughness of sample are generally smaller than those obtained by cutting with a diamond saw. Moreover, the warpage is smaller than that by the diamond saw cutting, and the cutting speed can be 10 times faster than that of the diamond saw at the present time. We used wires of 50 mm and 100 mm diameters in the experiments, and the experimental results of the cutting speed and the kerf losses are presented. The kerf loss of the 50 mm wire is less than 100 mm, and the cutting speed is about 0.8 mm/min for the thickness of a 6 mm SiC ingot. If we can maintain the cutting speed, the slicing time of a 2 inches diameter ingot would be about seven hours.


1994 ◽  
Vol 339 ◽  
Author(s):  
L. Rimai ◽  
R. Ager ◽  
W. H. Weber ◽  
J. Hangas ◽  
B. D. Poindexter

ABSTRACTSilicon carbide films are grown epitaxially on crystalline silicon substrates heated above 1000 °C, by laser ablation of pure carbon targets to thicknesses between 300 and 400 nm. These films grow on top of the silicon substrate from the carbon in the ablation plume and from the silicon of the substrate. By using a method of alternate ablation of a pure carbon and a pure silicon target, similar epitaxial films can be grown to thicknesses in excess of 1 μm with part of the silicon being supplied by the ablation plume of the silicon target.


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