Advanced passivation techniques for high-voltage GaN heterojunction power transistors

2014 ◽  
Author(s):  
Zhikai Tang
2002 ◽  
Vol 716 ◽  
Author(s):  
Larry Rice

AbstractMicroscopists are faced with many challenges in locating and examining failure sites in the ever-shrinking semiconductor device. The site must be located using electrical characterization techniques like electron beam induced current (EBIC), photo emission microscopy (PEM) or liquid crystal (LC) and then cross-sectioned with a focused ion beam (FIB). Both PEM and LC require the semiconductor circuit to be running near operating conditions which has been observed to locally melt the area of interest, frequently destroying evidence of the failure mechanism. In contrast, EBIC typically can be accomplished at low or no applied voltage eliminating further damage to the circuit. EBIC has been applied to locate leakage sites in high voltage metal oxide semiconductor (MOS) electro static discharge (ESD) reliability failures. In addition to a brief revisit of the basic principles of EBIC and describing a technique to successfully cross section ‘hot spots’ for transmission electron microscopy (TEM) observation, focus will be placed on a case study of the reliability testing failure analysis of ESD power transistors using EBIC, SEM, focused ion beam (FIB), and XTEM.


2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000116-000121
Author(s):  
Xavier Baie ◽  
Vincent Dessard ◽  
René Escoffier ◽  
Fabien Laplace ◽  
Gonzalo Picun

Abstract In this paper, a compact isolated and self-supplied single channel driver module for operation at 200C (392F) is presented. It is aimed to drive a normally-on GaN device within a high voltage half bridge topology. The driver is implemented on a compact hybrid module. Two of such modules are then assembled on a dedicated half-bridge DBC with two GaN devices.


2019 ◽  
pp. 307-388
Author(s):  
Badih El-Kareh ◽  
Lou N. Hutter

1987 ◽  
Vol 62 (6) ◽  
pp. 857-861 ◽  
Author(s):  
B. D. LIU ◽  
C. Y. CHANG ◽  
K. C. CHEN

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