Interfacial Adhesion of Film/Substrate System Characterized by Nanoindentation

2015 ◽  
pp. 332-393
Keyword(s):  
Interfacial Adhesion ◽  
Film Substrate

Interfacial adhesion of nanoporous zeolite thin films

2006 ◽  
Vol 21 (2) ◽  
pp. 505-511 ◽  
Author(s):  
Lili Hu ◽  
Junlan Wang ◽  
Zijian Li ◽  
Shuang Li ◽  
Yushan Yan
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Interfacial Adhesion ◽  
Interfacial Strength ◽  
Future Generation ◽  
In Situ Growth ◽  
Seeded Growth ◽  
Si Substrates ◽  
Film Substrate

Nanoporous silica zeolite thin films are promising candidates for future generation low-dielectric constant (low-k) materials. During the integration with metal interconnects, residual stresses resulting from the packaging processes may cause the low-k thin films to fracture or delaminate from the substrates. To achieve high-quality low-k zeolite thin films, it is important to carefully evaluate their adhesion performance. In this paper, a previously reported laser spallation technique is modified to investigate the interfacial adhesion of zeolite thin film-Si substrate interfaces fabricated using three different methods: spin-on, seeded growth, and in situ growth. The experimental results reported here show that seeded growth generates films with the highest measured adhesion strength (801 ± 68 MPa), followed by the in situ growth (324 ± 17 MPa), then by the spin-on (111 ± 29 MPa). The influence of the deposition method on film–substrate adhesion is discussed. This is the first time that the interfacial strength of zeolite thin films-Si substrates has been quantitatively evaluated. This paper is of great significance for the future applications of low-k zeolite thin film materials.

Determination of the Adhesive Strength of Film-Substrate Interfaces Using the Constant Depth Scratch Test

1995 ◽  
Vol 390 ◽  
Author(s):  
I. Dutta ◽  
J. C. Campbell
Keyword(s):  
Aluminum Nitride ◽  
Interfacial Adhesion ◽  
Polycrystalline Diamond ◽  
Sample Surface ◽  
Scratch Test ◽  
Constant Depth ◽  
Theoretical Formulation ◽  
Set Up ◽  
Film Substrate

ABSTRACTA constant depth scratch test (CDST) has been recently developed to quantify the shear strength of film-substrate interfaces. This test is capable of measuring interfacial adhesion as a function of position on the sample surface during a continuous scratch. Unlike many of the currently available tests which are applicable to a limited array of materials systems, or are experimentally complex, this test is quite versatile, and is relatively straightforward to conduct and interpret because of the constant depth geometry. The theoretical basis and the experimental set-up for the test have been previously presented. In this paper, extensions of the theoretical formulation to account for different debonding behaviors of different film-substrate systems are discussed. Experimental results generated with a number of systems, including chromium on glass, gold on aluminum nitride, gold on aluminum nitride with a chromium inter-layer, and polycrystalline diamond on aluminum nitride are presented.

scholarly journals Near-Plastic Threshold Indentation and the Residual Stress in Thin Films

1996 ◽  
Vol 436 ◽  
Author(s):  
J. E. Houston ◽  
T. A. Michalske
Keyword(s):  
Residual Stress ◽  
Interfacial Adhesion ◽  
Maximum Shear Stress ◽  
Indentation Modulus ◽  
Film Properties ◽  
Nanomechanical Properties ◽  
Average Grain Size ◽  
Film Substrate ◽  
Substrate Surfaces ◽  
Interfacial Force

AbstractIn recent studies, we used the Interfacial Force Microscope in a nanoindenter mode to survey the nanomechanical properties of Au films grown on various substrates. Quantitative tabulations of the indentation modulus and the maximum shear stress at the plastic threshold showed consistent values over individual samples but a wide variation from substrate to substrate. These values were compared with film properties such as the surface roughness, average grain size and interfacial adhesion and no correlation was found. However, in a subsequent analysis of the the results, we found consistencies which support the integrity of the data and point to the fact that the results are sensitive to some property of the various film/substrate combinations. In the present paper, we discuss these consistencies and show recent measurements which strongly suggest that the property that is being probed is the residual stress in the films caused by their interaction with the substrate surfaces.

Film/Substrate Adhesion Assessment by Scratch Tests Performed With Different Indenters

2014 ◽  
Author(s):  
Vincent Le Houérou ◽  
Leandro Jacomine ◽  
Christian Gauthier
Keyword(s):  
Interfacial Adhesion ◽  
Scratch Test ◽  
Scratch Resistance ◽  
In Situ Observation ◽  
Brittle Behavior ◽  
Adhesion Measurement ◽  
Extensive Growth ◽  
Energy Dissipated ◽  
Film Substrate ◽  
Industrial Solutions

In most cases, scratching of the surface of a polymeric glass elicits brittle behavior and industrial solutions like coating have been successfully used to improve the scratch resistance. The origin of the success of the coating technique is still of great research interest since one of the limitations of this technique is the risk of cracking and chipping. In terms of interfacial adhesion characterization, a wide variety of methods have been used to assess this property of material systems. Nevertheless, the adhesion of coatings still remains to be successfully determined in a test which can reproduce the damage undergone by the coated surface during its real lifetime. In this context, scratch test constitutes a good candidate. The present study deals with the scratching technique as an interfacial adhesion measurement in coated systems. Using a single-asperity scratching device allowing in-situ observation of the scratch, the fracture of a thin nano-composite coating deposited on its substrate was investigated under different conditions of temperature and scratching speed. Four types of fracture kinetics were observed depending on these two variables. One of these exhibits a stable blister growth at the same speed as the movement of the indenter over hundreds micrometers. This slow and extensive growth of a blister was obtained at 80 °C at a scratching speed of 10 μm/s. When the blister has reached a certain size, it propagates with the indenter without increasing further in size: it constitutes the steady state blister growth. A variational form of the energy balance of a blistering process is proposed, which permits to assess the adhesion of the system. Actually, the energy spent in the delamination process can be determined by following the delaminated area during the blistering process with regard to the scratching distance. The main difficulty is to estimate the energy dissipated in plastic flow. Different tests were conducted with various indenters: spheres with different radius and roughness. Thanks to this multi-criterion approach, it was possible to fit a unique value of the adhesion in the case of experimental stable blistering growths. The results are discussed with regard to reliability and probe characteristics.

Experimental Analysis of the Adhesion of Copper and Chromium Films Deposited on a Polymer

1992 ◽  
Vol 264 ◽  
Author(s):  
M. Ignat ◽  
L. Fayette ◽  
P. Normandon ◽  
F. Templier ◽  
J. Torres
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Interfacial Adhesion ◽  
Polymer Substrate ◽  
Critical Parameters ◽  
Interfacial Damage ◽  
Adhesion Properties ◽  
Film Substrate ◽  
Chromium Films ◽  
Scanning Electron

AbstractAn analysis of bulk and interfacial damage of film/substrate systems consisting of copper or chromium films deposited on a single polymer substrate, is presented here. For these systems (metal/single polymer substrate) the failure analysis is based on the experimental results obtained from deformation experiments performed in a scanning electron microscope. Critical parameters deduced from the experiments, and microstructural observations allow us to discuss the mechanical behaviour of these systems, and their interfacial adhesion properties.

Laser Induced Decohesion Spectroscopy: A New Technique for Measuring Polymer Interfacial Adhesion

1996 ◽  
Vol 461 ◽  
Author(s):  
J. S. Meth ◽  
D. Sanderson ◽  
C. Mutchler ◽  
S. J. Bennison
Keyword(s):  
Laser Pulse ◽  
Interfacial Adhesion ◽  
System Parameter ◽  
Laser Pulse Energy ◽  
Work Of Adhesion ◽  
New Technique ◽  
Physical Variables ◽  
A New Technique ◽  
Automotive Finish ◽  
Film Substrate

ABSTRACTWe present a new technique, laser induced decohesion spectroscopy (LIDS), which is capable of measuring the practical work of adhesion G between a transparent polymer film and an opaque substrate. In LIDS, a laser pulse directed onto the sample creates a blister at the film/substrate interface. The blister's internal pressure depends on the laser pulse energy, and at a critical pressure the sample fractures. We have derived a theoretical analysis of this experiment based on elasticity theory and fracture mechanics, and present the results. By measuring physical variables such as the thickness of the transparent polymer, the blister radius, and the blister curvature, it is possible to deduce G between the two coatings. Here we report G for a matrix of automotive finish systems consisting of four opaque basecoats of various colors (black, white, red, green) coated with a clearcoat of various thicknesses. We expect G to be a system parameter for each basecoat independent of clearcoat thickness. The values of G for the different basecoats yield the relative adhesion of the various pigmented paint formulations.

Interfacial Adhesion of Pure-Silica-Zeolite Low-k Thin Films

2005 ◽  
Vol 875 ◽  
Author(s):  
Lili Hu ◽  
Junlan Wang ◽  
Zijian Li ◽  
Shuang Li ◽  
Yushan Yan
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Interfacial Adhesion ◽  
Interfacial Strength ◽  
Laser Spallation ◽  
Si Substrates ◽  
Low Dielectric ◽  
Pure Silica ◽  
Film Substrate ◽  
First Time

AbstractNanoporous zeolite thin films are promising candidates as future low dielectric constant (low-k) materials. During the integration process with other semiconductor materials, the residual stresses resulting from the synthesis processes may cause fracture or delamination of the thin films. In order to achieve high quality low-k zeolite thin films, the evaluation of the adhesion performance is important. In this paper, laser spallation technique is utilized to investigate the interfacial adhesion of zeolite thin film-Si substrate interfaces prepared using three different processes. The experimental results demonstrate that the nature of the deposition method has a great effect on the resulted interfacial adhesion of the film-substrate interfaces. This is the first time that the interfacial strength of zeolite thin films-Si substrates is quantitatively evaluated. The results have great significance in the future applications of low-k zeolite thin film materials.

The Effect of Residual Stresses on the Rupture Properties of Film/Substrate Samples

1989 ◽  
Vol 153 ◽  
Author(s):  
M. Ignat ◽  
A. Chouaf ◽  
C. Bernard ◽  
J.M. Terriez
Keyword(s):  
Residual Stresses ◽  
Interfacial Adhesion ◽  
Experimental Results ◽  
Film Substrate ◽  
Rupture Properties

AbstractThe residual stresses of two different film/substrate systems were calculated. Besides, several micromechanical tests were performed. Joining the calculated residual stresses to the analysis of the experimental results, some insight on the interfacial adhesion of film/substrate systems is presented.

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