Effect of Surface Cleaning on Laser Texturing of Multicrystalline Silicon Wafer

2018 ◽  
Vol 10 (5) ◽  
pp. 690-693
Author(s):  
Hee Soo Kim ◽  
Seung Hyun Ha ◽  
Sang Joon Park ◽  
Ji Hyeon Kim
Keyword(s):  
Silicon Wafer ◽  
Surface Cleaning ◽  
Multicrystalline Silicon ◽  
Laser Texturing ◽  
Effect Of Surface

Surface cleaning of silicon wafer by laser sparking

2001 ◽  
Vol 13 (4) ◽  
pp. 154-158 ◽  
Author(s):  
J. M. Lee ◽  
K. G. Watkins ◽  
W. M. Steen
Keyword(s):  
Silicon Wafer ◽  
Surface Cleaning

scholarly journals Comparison of the Electrical Properties of PERC Approach Applied to Monocrystalline and Multicrystalline Silicon Solar Cells

2016 ◽  
Vol 2016 ◽  
pp. 1-6 ◽  
Author(s):  
Enyu Wang ◽  
He Wang ◽  
Hong Yang
Keyword(s):  
Solar Cells ◽  
Silicon Wafer ◽  
Crystalline Silicon ◽  
Cost Effective ◽  
Monocrystalline Silicon ◽  
Multicrystalline Silicon ◽  
Silicon Solar Cells ◽  
Next Generation ◽  
Crystalline Silicon Solar Cells ◽  
Commercial Applications

At present, the improvement in performance and the reduction of cost for crystalline silicon solar cells are a key for photovoltaic industry. Passivated emitter and rear cells are the most promising technology for next-generation commercial solar cells. The efficiency gains of passivated emitter and rear cells obtained on monocrystalline silicon wafer and multicrystalline silicon wafer are different. People are puzzled as to how to develop next-generation industrial cells. In this paper, both monocrystalline and multicrystalline silicon solar cells for commercial applications with passivated emitter and rear cells structure were fabricated by using cost-effective process. It was found that passivated emitter and rear cells are more effective for monocrystalline silicon solar cells than for multicrystalline silicon solar cells. This study gives some hints about the industrial-scale mass production of passivated emitter and rear cells process.

The Effect of Surface Cleaning on Current Collapse in AlGaN/GaN HEMTs

2019 ◽  
Vol 3 (5) ◽  
pp. 373-379
Author(s):  
J. Bardwell ◽  
Soufien Haffouz ◽  
Ross McKinnon ◽  
Craig Storey ◽  
Haipeng Tang ◽  
...  
Keyword(s):  
Surface Cleaning ◽  
Current Collapse ◽  
Gan Hemts ◽  
Effect Of Surface

Study on the effect of Silicon surface cleaning processes on Gate Oxide Integrity

1997 ◽  
Vol 477 ◽  
Author(s):  
A. Corradi ◽  
E. Borzoni ◽  
P. Godio ◽  
G. Borionetti
Keyword(s):  
Experimental Design ◽  
Silicon Wafer ◽  
Silicon Surface ◽  
Surface Preparation ◽  
Gate Oxide ◽  
Surface Cleaning ◽  
Wafer Surface ◽  
Quality Performance ◽  
Wafer Cleaning ◽  
Silicon Wafer Surface

ABSTRACTThe effect of different silicon wafer surface preparation in modulating gate oxide quality performance has been studied through an experimental design which examines key phases of wafer cleaning and polishing processes. An interpretation of the root causes of GOI degradation has been proposed and discussed.

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