scholarly journals Effect of surface passivation on generation and recombination lifetimes in silicon wafer studied by impedance spectroscopy

2010 ◽  
Vol 96 (16) ◽  
pp. 162109 ◽  
Author(s):  
Sanjai Kumar ◽  
P. K. Singh ◽  
S. R. Dhariwal
2019 ◽  
Vol 48 (10) ◽  
pp. 6437-6445
Author(s):  
Eduardo F. Barbosa ◽  
Jaqueline A. Coelho ◽  
Edna R. Spada ◽  
Daniel R. B. Amorim ◽  
Livia M. C. Souza ◽  
...  

2017 ◽  
Vol 71 (10) ◽  
pp. 707-710 ◽  
Author(s):  
In Ho Kang ◽  
Moon Kyong Na ◽  
Ogyun Seok ◽  
Jeong Hyun Moon ◽  
H. W. Kim ◽  
...  

2018 ◽  
Vol 10 (5) ◽  
pp. 690-693
Author(s):  
Hee Soo Kim ◽  
Seung Hyun Ha ◽  
Sang Joon Park ◽  
Ji Hyeon Kim

2012 ◽  
Vol 55 (6) ◽  
pp. 1469-1474 ◽  
Author(s):  
Le Wang ◽  
Ke Wu ◽  
QianMin Dong ◽  
XiaoYan Li ◽  
SiYu Xiong ◽  
...  

2011 ◽  
Vol 25 (04) ◽  
pp. 531-542
Author(s):  
CABİR TEMİRCİ ◽  
BAHRI BATI

We have fabricated the Sn/p-Si Schottky barrier diodes with the interfacial layer metal–insulator–semiconductor (D-MIS) and the surface passivation metal–semiconductor MS (D-MS) by the anodization or chemical treatment method. The current–voltage (I–V) and capacitance–voltage (C–V) characteristics of the devices were measured at room temperature. We obtained that the excess capacitance (C0) value of the MIS Sn/p-Si diode with the anodic oxide layer of 16.88 pF and 0.12 pF for the MS Sn/p-Si ideal diode with the surface passivation by the anodization or chemical treatment method from reverse bias C–V characteristics. Thus, we have succeeded to diminish the excess capacitance value to the limit of 0.12 pF for the MS Sn/p-Si diode by using the anodization or chemical treatment method.


2000 ◽  
Vol 77 (26) ◽  
pp. 4383-4385 ◽  
Author(s):  
Shouvik Datta ◽  
M. R. Gokhale ◽  
A. P. Shah ◽  
B. M. Arora ◽  
Shailendra Kumar

2015 ◽  
Vol 653 ◽  
pp. 624-628 ◽  
Author(s):  
Fikria Jabli ◽  
Mohamed Ali Zaidi ◽  
Nawfel Ben Hamadi ◽  
S. Althoyaib ◽  
Malek Gassoumi

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