Effects of Bias Pulsing on Etching of SiO2 Pattern in Capacitively-Coupled Plasmas for Nano-Scale Patterning of Multi-Level Hard Masks
2016 ◽
Vol 16
(5)
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pp. 5143-5149
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2014 ◽
Vol 14
(12)
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pp. 9470-9476
2016 ◽
Vol 16
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pp. 11817-11822
2015 ◽
Vol 33
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pp. 021310
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2015 ◽
Vol 24
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pp. 045013
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