Scratch-Profiles Study in Thin Films Using SEM and EDS
The adhesion of evaporated or sputtered thin films to substrates is one of the most important characterising parameters in their fabrication. It is a conventional method to scratch the films using a stylus and evaluate the shearing stress, which is proportional to the energy of adhesion. For the evaluation it is necessary to determine the so-called critical load and the profile of the scratch.The aim during this experimental work was to find a method to evaluate the scratch profile from the X-ray-line profile and SEM pictures. From SEM pictures, the lateral dimensions and surface morphology of the scratches were studied. The thickness was also studied from X-ray-line profiles.In this paper the thickness profile measuring method and the conclusion for the scratch method are discussed.