New Thick-Film Temperature Sensors Applied in Some Hybrid Measurement Devices

Janusz J. Gondek; Marek A. Wójcicki

doi:10.1155/apec.10.95

New Thick-Film Temperature Sensors Applied in Some Hybrid Measurement Devices

ElectroComponent Science and Technology ◽

10.1155/apec.10.95 ◽

1983 ◽

Vol 10 (2-3) ◽

pp. 95-102 ◽

Cited By ~ 3

Author(s):

Janusz J. Gondek ◽

Marek A. Wójcicki

Keyword(s):

Thick Film ◽

Temperature Sensors ◽

Film Resistance ◽

Economic Aspects ◽

Screening Process ◽

Functional Parameters ◽

Wide Range ◽

Measurement Devices

The present paper is devoted to the technological problems connected with the construction, the choice of pastes and substrates, the screening process and the laser or abrasive trimming involved in the production of thick-film resistance temperature sensors designed by the authors. It also gives their main functional parameters and characteristics indicating the possility of the use of thick-film sensors not only in the measurement of temperatures, in a wide range, but also in determining the velocity and volume of flowing gases or liquids. On the basis of the relations investigated, the authors give examples of constructions of a few hybrid measurement devices for use in industry, transportation and medicine. Technical and economic aspects of the production of hybrid measurement devices are also dealt with.

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New thick-film temperature sensors applied in some hybrid measurement devices

Microelectronics Reliability ◽

10.1016/0026-2714(83)90949-6 ◽

1983 ◽

Vol 23 (6) ◽

pp. 1186

Keyword(s):

Thick Film ◽

Temperature Sensors ◽

Measurement Devices

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Thick Film Platinum Temperature Sensors

Microelectronics International ◽

10.1108/eb044212 ◽

1986 ◽

Vol 3 (1) ◽

pp. 33-35 ◽

Cited By ~ 3

Author(s):

Q.M. Reynolds ◽

M.G. Norton

Keyword(s):

Thick Film ◽

Temperature Sensors

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Environmental responsibility and financial policy of the company: methodological aspects of the analysis

10.12737/1246521 ◽

2021 ◽

Author(s):

Aleksey Makarov ◽

Irina Hvostova ◽

Elena Ryabova ◽

Aleksandr Larin

Keyword(s):

Empirical Analysis ◽

Environmental Responsibility ◽

Financial Policy ◽

Economic Aspects ◽

Financial Efficiency ◽

Credit Management ◽

Wide Range ◽

Corporate Financial Policy ◽

Methodological Aspects ◽

The Empirical Analysis

The actualization of environmental problems makes it necessary to study them in connection with the financial and economic aspects of the modern company. The main content of the monograph is formed by the conceptual, theoretical and methodological aspects of the analysis of corporate financial policy, studied in conjunction with the study of the factors of environmental responsibility of the company. The necessity of revision is analyzed and the directions of improvement of the methodological apparatus for the formation and implementation of financial policy in new conditions are determined. Particular attention is paid to the empirical analysis of indicators of environmental responsibility and environmental efficiency at different organizational levels. The results obtained are valuable in order to improve corporate practices for managing environmental responsibility factors and improving the financial efficiency of companies. For a wide range of readers, including researchers, practitioners, postgraduates, applicants and students studying in the areas of "Economics", "Finance and Credit", "Management".

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Smart Temperature Sensors

Process Analysis, Design, and Intensification in Microfluidics and Chemical Engineering - Advances in Chemical and Materials Engineering ◽

10.4018/978-1-5225-7138-4.ch008 ◽

2019 ◽

pp. 223-250

Author(s):

Ashraf A. Zaher

Keyword(s):

Weather Forecast ◽

Temperature Sensors ◽

Consumer Electronics ◽

Data Logging ◽

Industrial Processing ◽

Wide Range ◽

Scada Systems ◽

New Generation ◽

And Control ◽

Measurement And Control

Many real-world applications depend on temperature sensing and/or control. This includes a wide range of industrial processes, chemical reactors, and SCADA systems, in addition to other physical, mechanical, and biological systems. With the advancement of technology, it became possible to produce a new generation of smart and compact temperature sensors, which are capable of providing digital outputs that are more accurate, robust, and easily interfaced and integrated into measurement and control systems. This chapter first surveys traditional analog temperature sensors, such as RTDs and thermocouples, to provide a strong motivation for the need to adopt better and smarter techniques that mainly rely on digital technology (e.g., CMOS designs). Different interfacing techniques that do not need ADCs are introduced, including the programmable Arduino microcontrollers. Different applications will be explored that include automotive accessories, weather forecast, healthcare, industrial processing, firefighting, and consumer electronics. Both wired and wireless technologies, including the IoT, will be investigated as means for transmitting the sensed data for further processing and data logging. A special case study to provide information redundancy in industrial SCADA systems will be analyzed to illustrate the advantages and limitations of smart temperature sensors. The chapter concludes with a summary of the design effort, accuracy, performance, and cost effectiveness of smart temperature sensors while highlighting future trends in this field for different applications.

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Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016cicmt-tp1b1 ◽

2016 ◽

Vol 2016 (CICMT) ◽

pp. 000053-000057

Author(s):

Jaroslaw Kita ◽

Sven Wiegärtner ◽

Alistair Prince ◽

Peter Weigand ◽

Ralf Moos

Keyword(s):

High Temperature ◽

Thick Film ◽

Screen Printing ◽

Temperature Sensors ◽

Electrical Characteristics ◽

Buried Structures ◽

Ceramic Substrates ◽

Temperature Characteristics ◽

Film Type ◽

Thick Film Technology

Abstract The application of thermocouples as temperature sensors has been well known and has already been established for many years. However, for classical thick-film technology using screen-printing and firing, no standardized solutions exist. The here-presented newly developed PtRh thick-film compositions (90% Pt,10% Rh) allows to construct thick-film type S thermocouples (Pt/PtRh), following the IEC temperature characteristics. They can be fired in air, and therefore can be easily integrated into existing thick-film components and devices. In an earlier study, the new Pt-Rh composition was successfully tested on alumina substrates. Their electrical characteristics is equal with classical wire type S thermocouples. This study continues the investigations of thick-film thermocouples. We tested the newly developed pastes for high temperature applications on alumina substrates and evaluated the application of the new screen-printable type S thermocouples on LTCC ceramics. Three possible configurations were investigated: deposited on already fired LTCC substrates (post-fired), screen-printed and co-fired with LTCC tapes on the top surface as well as as buried structures. The paper presents the results of our evaluation and discusses further possible applications.

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Design and Fabrication of an LTCC Structure for a Microceramic Combustor

Journal of Microelectronics and Electronic Packaging ◽

10.4071/imaps.342 ◽

2012 ◽

Vol 9 (3) ◽

pp. 120-125 ◽

Cited By ~ 2

Author(s):

Darko Belavic ◽

Marko Hrovat ◽

Gregor Dolanc ◽

Kostja Makarovic ◽

Marina Santo Zarnik

Keyword(s):

Thick Film ◽

High Pressures ◽

Three Dimensional ◽

Temperature Sensors ◽

Ceramic Technology ◽

Electronic Components ◽

Buried Structures ◽

Flow Rates ◽

Points Of View ◽

Harsh Conditions

Advanced microsystems or macrosystems are in some cases made with multilayer ceramic technology. Low-temperature cofired ceramic (LTCC) technology is considered to be one of the more suitable technologies for the fabrication of ceramic microsystems that integrate screen-printed, thick-film electronic components as well as three-dimensional buried structures, for example, cavities and channels. One of the applications is a ceramic combustor. The chemical energy of the fuel is converted into thermal energy in a chemical microcombustor through a burning process, while the accompanying high temperatures and, frequently, high pressures, impose harsh conditions on the combustor structure. Therefore, the combustor must be carefully designed not only from the functional, thermal, and chemical points of view, but also with respect to the mechanical strength. The combustor device was prepared by lamination of Du Pont 951PX LTCC green tapes. The fabricated 3D LTCC structures with buried cavities and channels including two inlets (for fuel and air), the evaporator for the fuel, the mixing system of the channels (for mixing the evaporated fuel and air), the distribution channels and eight microburners were realized. The main parts are eight microburners realized as buried cavities. In the burners, a platinum-based catalyst was deposited to assist the oxidation, that is, the burning, of the methanol with the air. Thick-film, platinum-based heaters and temperature sensors are incorporated within the structure. The device was tested with different flow rates of liquid methanol (1 mL/h to 5 mL/h) and air (7 L/h to 15 L/h). The temperatures obtained were between 250°C and 450°C.

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The Role of Sacrificial and/or Protective Layers to Improve the Sintering of Electroactive Ceramics: Application to Piezoelectric PZT-Printed Thick Films for MEMS

Ceramics ◽

10.3390/ceramics3040038 ◽

2020 ◽

Vol 3 (4) ◽

pp. 453-475

Author(s):

Hélène Debéda ◽

Maria-Isabel Rua-Taborda ◽

Onuma Santawitee ◽

Simon Grall ◽

Mario Maglione ◽

...

Keyword(s):

Thick Film ◽

Sacrificial Layer ◽

Low Cost ◽

Thick Films ◽

Protective Layer ◽

Protective Layers ◽

Plasma Sintering ◽

Wide Range ◽

Spark Plasma ◽

Pros And Cons

Piezoelectric thick films are of real interest for devices such as ceramic Micro-ElectroMechanical Systems (MEMS) because they bridge the gap between thin films and bulk ceramics. The basic design of MEMS includes electrodes, a functional material, and a substrate, and efforts are currently focused on simplified processes. In this respect, screen-printing combined with a sacrificial layer approach is attractive due to its low cost and the wide range of targeted materials. Both the role and the nature of the sacrificial layer, usually a carbon or mineral type, depend on the process and the final device. First, a sacrificial layer method dedicated to screen-printed thick-film ceramic and LTCC MEMS is presented. Second, the recent processing of piezoelectric thick-film ceramic MEMS using spark plasma sintering combined with a protective layer approach is introduced. Whatever the approach, the focus is on the interdependent effects of the microstructure, chemistry, and strain/stress, which need to be controlled to ensure reliable and performant properties of the multilayer electroceramics. Here the goal is to highlight the benefits and the large perspectives of using sacrificial/protective layers, with an emphasis on the pros and cons of such a strategy when targeting a complex piezoelectric MEMS design.

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