Correlation Between Thick-Film Resistance Values

1977 ◽  
Vol 13 (2) ◽  
pp. 138-143 ◽  
Author(s):  
A. Thorbjornsen ◽  
M. Dvorack ◽  
A. Riad
Keyword(s):  
Thick Film ◽  
Film Resistance

Thermal impedance of thick-film resistance thermometers below 0.2 K

Cryogenics ◽  
1997 ◽  
Vol 37 (12) ◽  
pp. 877-878 ◽  
Author(s):  
G. Ventura ◽  
L. Lanzi ◽  
I. Peroni ◽  
A. Peruzzi ◽  
G. Ponti
Keyword(s):  
Thick Film ◽  
Film Resistance ◽  
Thermal Impedance ◽  
Resistance Thermometers

scholarly journals New Thick-Film Temperature Sensors Applied in Some Hybrid Measurement Devices

1983 ◽  
Vol 10 (2-3) ◽  
pp. 95-102 ◽  
Author(s):  
Janusz J. Gondek ◽  
Marek A. Wójcicki
Keyword(s):  
Thick Film ◽  
Temperature Sensors ◽  
Film Resistance ◽  
Economic Aspects ◽  
Screening Process ◽  
Functional Parameters ◽  
Wide Range ◽  
Measurement Devices

The present paper is devoted to the technological problems connected with the construction, the choice of pastes and substrates, the screening process and the laser or abrasive trimming involved in the production of thick-film resistance temperature sensors designed by the authors. It also gives their main functional parameters and characteristics indicating the possility of the use of thick-film sensors not only in the measurement of temperatures, in a wide range, but also in determining the velocity and volume of flowing gases or liquids. On the basis of the relations investigated, the authors give examples of constructions of a few hybrid measurement devices for use in industry, transportation and medicine. Technical and economic aspects of the production of hybrid measurement devices are also dealt with.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Fabrication of a Zn-Ferrite Thick Film Planar Power Inductor for DC-DC Converter LSI Package

2011 ◽  
Vol 131 (7) ◽  
pp. 484-489 ◽  
Author(s):  
Shinya Okazaki ◽  
Asako Takeuchi ◽  
Akihiro Takeshima ◽  
Makoto Sonehara ◽  
Toshiro Sato ◽  
...  
Keyword(s):  
Thick Film ◽  
Zn Ferrite ◽  
Power Inductor

Predicting the Effect of Tire Tread Pattern Design on Thick Film Wet Traction

1977 ◽  
Vol 5 (1) ◽  
pp. 6-28 ◽  
Author(s):  
A. L. Browne
Keyword(s):  
Experimental Data ◽  
Network Design ◽  
Thick Film ◽  
Digital Computer ◽  
Analytical Tool ◽  
Design Practice ◽  
Pattern Design ◽  
Performance Results ◽  
Good Agreement

Abstract An analytical tool is presented for the prediction of the effects of changes in tread pattern design on thick film wet traction performance. Results are reported for studies in which the analysis, implemented on a digital computer, was used to determine the effect of different tread geometry features, among these being the number, width, and lateral spacing of longitudinal grooves and the angle of zigzags in longitudinal grooves, on thick film wet traction. These results are shown to be in good agreement with experimental data appearing in the literature and are used to formulate guidelines for tread groove network design practice.

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