Thick Film Platinum Temperature Sensors

1986 ◽  
Vol 3 (1) ◽  
pp. 33-35 ◽  
Author(s):  
Q.M. Reynolds ◽  
M.G. Norton
Keyword(s):  
Thick Film ◽  
Temperature Sensors

Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000053-000057
Author(s):  
Jaroslaw Kita ◽  
Sven Wiegärtner ◽  
Alistair Prince ◽  
Peter Weigand ◽  
Ralf Moos
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Temperature Sensors ◽  
Electrical Characteristics ◽  
Buried Structures ◽  
Ceramic Substrates ◽  
Temperature Characteristics ◽  
Film Type ◽  
Thick Film Technology

Abstract The application of thermocouples as temperature sensors has been well known and has already been established for many years. However, for classical thick-film technology using screen-printing and firing, no standardized solutions exist. The here-presented newly developed PtRh thick-film compositions (90% Pt,10% Rh) allows to construct thick-film type S thermocouples (Pt/PtRh), following the IEC temperature characteristics. They can be fired in air, and therefore can be easily integrated into existing thick-film components and devices. In an earlier study, the new Pt-Rh composition was successfully tested on alumina substrates. Their electrical characteristics is equal with classical wire type S thermocouples. This study continues the investigations of thick-film thermocouples. We tested the newly developed pastes for high temperature applications on alumina substrates and evaluated the application of the new screen-printable type S thermocouples on LTCC ceramics. Three possible configurations were investigated: deposited on already fired LTCC substrates (post-fired), screen-printed and co-fired with LTCC tapes on the top surface as well as as buried structures. The paper presents the results of our evaluation and discusses further possible applications.

Design and Fabrication of an LTCC Structure for a Microceramic Combustor

2012 ◽  
Vol 9 (3) ◽  
pp. 120-125 ◽  
Author(s):  
Darko Belavic ◽  
Marko Hrovat ◽  
Gregor Dolanc ◽  
Kostja Makarovic ◽  
Marina Santo Zarnik
Keyword(s):  
Thick Film ◽  
High Pressures ◽  
Three Dimensional ◽  
Temperature Sensors ◽  
Ceramic Technology ◽  
Electronic Components ◽  
Buried Structures ◽  
Flow Rates ◽  
Points Of View ◽  
Harsh Conditions

Advanced microsystems or macrosystems are in some cases made with multilayer ceramic technology. Low-temperature cofired ceramic (LTCC) technology is considered to be one of the more suitable technologies for the fabrication of ceramic microsystems that integrate screen-printed, thick-film electronic components as well as three-dimensional buried structures, for example, cavities and channels. One of the applications is a ceramic combustor. The chemical energy of the fuel is converted into thermal energy in a chemical microcombustor through a burning process, while the accompanying high temperatures and, frequently, high pressures, impose harsh conditions on the combustor structure. Therefore, the combustor must be carefully designed not only from the functional, thermal, and chemical points of view, but also with respect to the mechanical strength. The combustor device was prepared by lamination of Du Pont 951PX LTCC green tapes. The fabricated 3D LTCC structures with buried cavities and channels including two inlets (for fuel and air), the evaporator for the fuel, the mixing system of the channels (for mixing the evaporated fuel and air), the distribution channels and eight microburners were realized. The main parts are eight microburners realized as buried cavities. In the burners, a platinum-based catalyst was deposited to assist the oxidation, that is, the burning, of the methanol with the air. Thick-film, platinum-based heaters and temperature sensors are incorporated within the structure. The device was tested with different flow rates of liquid methanol (1 mL/h to 5 mL/h) and air (7 L/h to 15 L/h). The temperatures obtained were between 250°C and 450°C.

scholarly journals Microstructural Studies of Ni-P Thick Film Resistor Temperature Sensors

1986 ◽  
Vol 12 (2) ◽  
pp. 127-135 ◽  
Author(s):  
Barbara Holodnik ◽  
Abram Jakubowicz ◽  
Marian Lukaszewicz ◽  
Wolfgang Hauffe
Keyword(s):  
Thick Film ◽  
Electrical Conduction ◽  
Temperature Sensors ◽  
Film Resistor ◽  
Metallic Character ◽  
Thick Film Resistor ◽  
Microstructural Studies

Thick Ni-P films have been widely investigated at our Institute. This article tends to visualize by use of various microscopic methods how the growth and sintering of individual conducting grains, results in the formation of nickel dendrites responsible for the metallic character of electrical conduction.

Novel thermoelectric temperature sensors

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000230-000233 ◽  
Author(s):  
L. Rebenklau ◽  
K. Irrgang ◽  
A. Wodtke ◽  
K. Augsburg ◽  
F. Bechtold ◽  
...  
Keyword(s):  
Thick Film ◽  
Material Flow ◽  
Temperature Sensors ◽  
The Novel ◽  
Circuit Boards ◽  
Pipe System ◽  
Pharmaceutical Production ◽  
Thermoelectric Temperature ◽  
Typical Temperature ◽  
Thick Film Technology

Nearly every industrial application needs temperature measurement. Typical temperature sensors are based on thermocouples or resistance elements. Nevertheless, these sensors are not always desired for every application. For example, temperature sensing of fluids or gases in pipes. A standard sensor inside such a material flow has an influence on the flow itself (flow resistance, turbulences) which would lead to incorrect temperature result. Additionally, application that need periodical cleaning of their pipe system (food or pharmaceutical production) can't use such sensors because of hygienically reasons. Novel thermoelectric temperature sensors, which could reduce the previously demonstrated problems have been developed as part of a research project. The basic idea of the novel sensor concept is to use thick film technology to enable novel sensor geometries. The typical use of thick film technology is realization of ceramic circuit boards, in which metal-based thick film pastes were screen printed and fired as conductive material. The sensor concept uses a combination of different commercially available metal-based pastes (platinum, silver, nickel, gold) to creates thermocouples based on the Seebeck effect.

Thick-film Temperature Sensors and LTCC Substrates - Evaluation and Characterization

2007 ◽  
Author(s):  
Marko Hrovat ◽  
Darko Belavic ◽  
Jaroslaw Kita ◽  
Janez Holc ◽  
Jena Cilensek ◽  
...  
Keyword(s):  
Thick Film ◽  
Temperature Sensors

scholarly journals New Thick-Film Temperature Sensors Applied in Some Hybrid Measurement Devices

1983 ◽  
Vol 10 (2-3) ◽  
pp. 95-102 ◽  
Author(s):  
Janusz J. Gondek ◽  
Marek A. Wójcicki
Keyword(s):  
Thick Film ◽  
Temperature Sensors ◽  
Film Resistance ◽  
Economic Aspects ◽  
Screening Process ◽  
Functional Parameters ◽  
Wide Range ◽  
Measurement Devices

The present paper is devoted to the technological problems connected with the construction, the choice of pastes and substrates, the screening process and the laser or abrasive trimming involved in the production of thick-film resistance temperature sensors designed by the authors. It also gives their main functional parameters and characteristics indicating the possility of the use of thick-film sensors not only in the measurement of temperatures, in a wide range, but also in determining the velocity and volume of flowing gases or liquids. On the basis of the relations investigated, the authors give examples of constructions of a few hybrid measurement devices for use in industry, transportation and medicine. Technical and economic aspects of the production of hybrid measurement devices are also dealt with.

Thick-film resistive temperature sensors

1997 ◽  
Vol 8 (1) ◽  
pp. 78-85 ◽  
Author(s):  
Andrzej Dziedzic ◽  
Leszek J Golonka ◽  
Janusz Kozlowski ◽  
Benedykt W Licznerski ◽  
Karol Nitsch
Keyword(s):  
Thick Film ◽  
Temperature Sensors
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