scholarly journals Process to Improve the Adherences of Copper to a PTFE Plate

2016 ◽  
Vol 2016 ◽  
pp. 1-4
Author(s):  
Abel Pérez ◽  
Alfonso Torres ◽  
Reydezel Torres
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Low Pressure ◽  
Peel Strength ◽  
Plasma Power ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Free Process

A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.

High Temperature Laminate Characterization

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000235-000245
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Model Development ◽  
Peel Strength ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Mean Lifetime ◽  
The Mean

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization and modeling high temperature laminates for application at 200 to 250°C was conducted to better quantify the mean lifetime using accelerated testing of key functional parameters. Life testing and model development was applied for via cyclic life, peel strength, and weight loss. Four high temperature laminates consisting of 2 types were evaluated. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples.

scholarly journals Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

2018 ◽  
Vol 193 ◽  
pp. 140-153 ◽  
Author(s):  
Gautier Girard ◽  
Mohamad Jrad ◽  
Slim Bahi ◽  
Marion Martiny ◽  
Sébastien Mercier ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Woven Composites ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Numerical Characterization

High frequency measurement techniques for vias in printed circuit boards

2014 ◽  
Vol 3 (4) ◽  
pp. 104-113 ◽  
Author(s):  
Miroslav Kotzev ◽  
Young H. Kwark ◽  
Sebastian Muller ◽  
Andreas Hardock ◽  
Renato Rimolo-Donadio ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Measurement Techniques ◽  
Frequency Measurement ◽  
Circuit Boards ◽  
Printed Circuit

Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

2010 ◽  
Vol 18 (1) ◽  
pp. 47-52 ◽  
Author(s):  
Jae-Choon Cho ◽  
Hwa-Young Lee ◽  
Sung-Taek Lim ◽  
Moon-Soo Park ◽  
Yong-Soo Oh ◽  
...  
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Peel Strength ◽  
Circuit Boards ◽  
Curing Behavior ◽  
Printed Circuit

scholarly journals Increased Peel Strength of Copper Plating Using Supercritical Fluid Methods for Epoxy Printed Circuit Boards

2011 ◽  
Vol 67 (11) ◽  
pp. 240-244
Author(s):  
Hidebumi Ohnuki ◽  
Shinji Sumi ◽  
Shinji Takaku ◽  
Kazumasa Hirogaki ◽  
Teruo Hori
Keyword(s):  
Supercritical Fluid ◽  
Printed Circuit Boards ◽  
Peel Strength ◽  
Circuit Boards ◽  
Copper Plating ◽  
Printed Circuit
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