scholarly journals Uniplanar Millimeter-Wave Log-Periodic Dipole Array Antenna Fed by Coplanar Waveguide

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Guohua Zhai ◽  
Yong Cheng ◽  
Qiuyan Yin ◽  
Shouzheng Zhu ◽  
Jianjun Gao

A uniplanar millimeter-wave broadband printed log-periodic dipole array (PLPDA) antenna fed by coplanar waveguide (CPW) is introduced. This proposed structure consists of several active dipole elements, feeding lines, parallel coupled line, and the CPW, which are etched on a single metallic layer of the substrate. The parallel coupled line can be optimized to act as a transformer between the CPW and the PLPDA antenna. Meanwhile, this transform performs the task of a balun to achieve a wideband, low cost, low loss, simple directional antenna. The uniplanar nature makes the antenna suitable to be integrated into modern printed communication circuits, especially the monolithic millimeter-wave integrated circuits (MMIC). The antenna has been carefully examined and measured to present the return loss, far-field patterns, and antenna gain.

2011 ◽  
Vol 3 (2) ◽  
pp. 115-120 ◽  
Author(s):  
Aline Jaimes-Vera ◽  
Ignacio Llamas-Garro ◽  
Maolong Ke ◽  
Yi Wang ◽  
Michael J. Lancaster ◽  
...  

In this paper, micromachined devices for millimeter-wave applications at U- and V-bands are presented. These structures are designed using a rectangular coaxial line built of gold-coated SU-8 photoresist layers, where the coaxial center conductor is suspended in air by stubs. The designs include a stepped coplanar waveguide (CPW)-to-coaxial transition at 63 GHz, with an insertion loss of 0.39 dB at 67.75 GHz and a return loss better than −10 dB across the band of operation between 54.7 and 70.3 GHz. Two filters have been designed; one centered at 42 GHz with a 10% bandwidth, and another at 63 GHz with a 5% bandwidth. Measured insertion losses of 0.77 and 2.59 dB were obtained for these filters, respectively. Measured return loss lower than 13.8 dB over the passband was achieved for both designs. The structures presented in this paper involve a low-cost manufacturing process suitable to produce integrated subsystems at millimeter waves.


2012 ◽  
Vol 9 (4) ◽  
pp. 166-170 ◽  
Author(s):  
Supreetha Aroor ◽  
Rashaunda Henderson

This work demonstrates the performance of conductor-backed coplanar waveguide (CBCPW) lines on FR408 for millimeter-wave applications. These lines can be used as interconnects to integrate a CMOS IC with an antenna fabricated on FR408 for a low-cost system-in-package solution. To our knowledge, this is the first time coplanar lines on FR4 have been studied for millimeter-wave applications. Ansoft HFSS simulation results for 50 Ω coplanar lines show a return loss of 20 dB and an insertion loss of 0.5 dB/mm at 100 GHz. Measured results up to 67 GHz show that on average, the CBCPW lines have an attenuation constant of 0.22 dB/mm.


2012 ◽  
Vol 2012 ◽  
pp. 1-9 ◽  
Author(s):  
Gheorghe Ioan Sajin ◽  
Iulia Andreea Mocanu

The paper presents two composite right/left-handed (CRLH) coplanar waveguide (CPW) zeroth-order resonant (ZOR) antennas which were designed, processed, and electrically characterized for applications in the millimetric wave frequency range. Two CRLH antennas were developed forf=27 GHz andf=38.5, GHz, respectively. The CRLH antenna onf=27 GHz shows a return loss ofRL<−18.78 dB atf=26.88 GHz. The −3 dB radiation characteristic beamwidth was approximately 37° and the gain wasGi=2.82 dBi. The CRLH antenna onf=38.5 GHz has a return loss ofRL<−38.5 dB atf=38.82 GHz and the −3 dB radiation characteristic beamwidth of approximately 17°. The gains wereGi=1.08 dBi atf=38 GHz andGi=1.2 dBi atf=38.6 GHz. The maximum measured gain wasGi=1.75 dBi atf=38.2 GHz. It is, upon the authors' knowledge, the first report of millimeter wave CRLH antennas on silicon substrate in CPW technique for use in mm-wave monolithic integrated circuit.


2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000050-000053
Author(s):  
Alexander Schulz ◽  
Sven Rentsch ◽  
Lei Xia ◽  
Robert Mueller ◽  
Jens Mueller

This paper presents a low loss fully embedded bandpass filter (BPF) using low temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications for the unlicensed 60 GHz band. The measured insertion loss was 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB was achieved, including two grounded coplanar waveguide transmission line (CPWg) to stripline transitions. The four layers BPF has a 3 dB bandwidth of about 11 GHz which supplies e.g. broadband and high data rate applications. The whole BPF requires a substrate area of 5.6 × 2.1 × 0.42 mm3 with transitions and a shielding via fence. This BPF suits well for V-band applications in a LTCC package because of the compact dimensions and the good performance.


2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.


1997 ◽  
Vol 486 ◽  
Author(s):  
G. Cocorullo ◽  
F. G. Della Corte ◽  
R. De Rosa ◽  
I. Rendina ◽  
A. Rubino ◽  
...  

AbstractThis paper reports about the fabrication and experimental test of an interferometric light intensity modulator integrated in a low loss (0.7 dB/cm), amorphous silicon based waveguide. It measures approximately 1 mm in length, while its cross section is 30-μm-wide and 3-μm-high. The device, which exploits the strong thermo-optic effect in thin film a-Si for its operation, is designed for application at the infrared wavelengths of 1.3 and 1.55 μm. The measured maximum operating on-off switching frequency of the device is 600 kHz. The very simple fabrication technology involves maximum process temperatures of 230 °C, and is therefore compatible with the standard microelectronic technology. This offers a new opportunity for the integration of optical and electronic functions on the same substrate.


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