scholarly journals Metamaterial CRLH Antennas on Silicon Substrate for Millimeter-Wave Integrated Circuits

2012 ◽  
Vol 2012 ◽  
pp. 1-9 ◽  
Author(s):  
Gheorghe Ioan Sajin ◽  
Iulia Andreea Mocanu
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Silicon Substrate ◽  
Return Loss ◽  
Coplanar Waveguide ◽  
Radiation Characteristic ◽  
Millimetric Wave ◽  
Monolithic Integrated Circuit ◽  
Left Handed

The paper presents two composite right/left-handed (CRLH) coplanar waveguide (CPW) zeroth-order resonant (ZOR) antennas which were designed, processed, and electrically characterized for applications in the millimetric wave frequency range. Two CRLH antennas were developed forf=27 GHz andf=38.5, GHz, respectively. The CRLH antenna onf=27 GHz shows a return loss ofRL<−18.78 dB atf=26.88 GHz. The −3 dB radiation characteristic beamwidth was approximately 37° and the gain wasGi=2.82 dBi. The CRLH antenna onf=38.5 GHz has a return loss ofRL<−38.5 dB atf=38.82 GHz and the −3 dB radiation characteristic beamwidth of approximately 17°. The gains wereGi=1.08 dBi atf=38 GHz andGi=1.2 dBi atf=38.6 GHz. The maximum measured gain wasGi=1.75 dBi atf=38.2 GHz. It is, upon the authors' knowledge, the first report of millimeter wave CRLH antennas on silicon substrate in CPW technique for use in mm-wave monolithic integrated circuit.

A Hybrid Antenna in Package Solution Using FOWLP Technology

2021 ◽  
Author(s):  
XueSong Zhang ◽  
Qian Wang ◽  
Bo Wang ◽  
Gang Wang ◽  
Xin Gu ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Transmission Loss ◽  
Rapid Development ◽  
Coplanar Waveguide ◽  
Organic Substrate ◽  
Hybrid Integration ◽  
Wafer Level ◽  
Monolithic Integrated Circuit

Abstract Widespread millimeter wave applications have promoted rapid development of System in Package (SiP) and Antenna in Package (AiP). Most AiP structures take the form of flip chip on antenna substrate, where interconnect losses are caused by solder bumps, and manufacturing difficulties may be encountered for chips with fine pad pitches. Fan-out wafer level package (FOWLP) with antenna patterning on Redistributed Layers (RDL) is another method for mm-wave AiP realization. In this project a hybrid integration AiP structure is developed. The Microwave Monolithic Integrated Circuit (MMIC) chip and antenna unit are integrated with chip-first FOWLP process. By using multilayer organic substrate and fine pitch RDL interconnection, proper antenna performance and lower transmission loss can be achieved. Modified coplanar waveguide is adopted to feed 2x2 aperture array formed on RDL. Package warpage is evaluated using ANSYS and Shadow Moire measurement. The antenna realizes bandwidth 25% and gain 8.5dBi using aperture-coupled stacked patch for 60GHz digital communication system. The proposed approach is a convenient solution for the hybrid integration of millimeter wave AiP systems.

scholarly journals Uniplanar Millimeter-Wave Log-Periodic Dipole Array Antenna Fed by Coplanar Waveguide

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Guohua Zhai ◽  
Yong Cheng ◽  
Qiuyan Yin ◽  
Shouzheng Zhu ◽  
Jianjun Gao
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
Return Loss ◽  
Low Cost ◽  
Coplanar Waveguide ◽  
Antenna Gain ◽  
Low Loss ◽  
Coupled Line ◽  
Field Patterns ◽  
Communication Circuits

A uniplanar millimeter-wave broadband printed log-periodic dipole array (PLPDA) antenna fed by coplanar waveguide (CPW) is introduced. This proposed structure consists of several active dipole elements, feeding lines, parallel coupled line, and the CPW, which are etched on a single metallic layer of the substrate. The parallel coupled line can be optimized to act as a transformer between the CPW and the PLPDA antenna. Meanwhile, this transform performs the task of a balun to achieve a wideband, low cost, low loss, simple directional antenna. The uniplanar nature makes the antenna suitable to be integrated into modern printed communication circuits, especially the monolithic millimeter-wave integrated circuits (MMIC). The antenna has been carefully examined and measured to present the return loss, far-field patterns, and antenna gain.

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

Thin Film Processing of Complex Multilayer Structures of High-Temperature Superconductors

MRS Bulletin ◽  
1992 ◽  
Vol 17 (8) ◽  
pp. 34-38 ◽  
Author(s):  
Ronald H. Ono
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
High Temperature Superconductors ◽  
Dissimilar Materials ◽  
Film Structure ◽  
Monolithic Integrated Circuit ◽  
Fully Integrated ◽  
Economy Of Scale

The realization of a revolutionary generation of electronics based on high-temperature superconductors (HTS) crucially depends on the ability to make high-quality thin film microstructures. These will incorporate materials such as YBa2Cu3O7-δ (YBCO), TlBaCaCuO, or BiSrCaCuO in a fashion similar to the circuits and devices made of their low Tc counterparts Nb or NbN. Without exception, the most valuable structures will be composed of multiple layers of superconducting films and dielectrics, in some cases combined with normal metals, low-temperature superconductors, or a variety of semiconductors. Generically, these can be combined in two ways: in a hybrid design where specialized packages and bonding are used to attach dissimilar materials, or in a monolithic thin film structure such as the one seen in Figure 1.The division between hybrid and monolithic multilayers results from the historical development of electronic circuits. Hybrid designs typically require linewidths and alignment accuracy somewhat less demanding than those used in fully integrated circuits. The advantage of hybrid construction is the separation of incompatible processing steps onto different substrates or die. The monolithic integrated circuit, whether microelectronic, millimeter wave, or radio frequency, can be made in large batches with concomitant economy of scale and can be fabricated with fewer parasitic constraints. Superconducting integrated circuits have followed the semiconductor pattern of being developed in a hybrid fashion, then transferred to a fully integrated process.

Polymer-based micromachined rectangular coaxial filters for millimeter-wave applications

2011 ◽  
Vol 3 (2) ◽  
pp. 115-120 ◽  
Author(s):  
Aline Jaimes-Vera ◽  
Ignacio Llamas-Garro ◽  
Maolong Ke ◽  
Yi Wang ◽  
Michael J. Lancaster ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Millimeter Waves ◽  
Return Loss ◽  
Low Cost ◽  
Coplanar Waveguide ◽  
Coaxial Line ◽  
Center Conductor ◽  
Low Cost Manufacturing ◽  
Insertion Losses ◽  
Better Than

In this paper, micromachined devices for millimeter-wave applications at U- and V-bands are presented. These structures are designed using a rectangular coaxial line built of gold-coated SU-8 photoresist layers, where the coaxial center conductor is suspended in air by stubs. The designs include a stepped coplanar waveguide (CPW)-to-coaxial transition at 63 GHz, with an insertion loss of 0.39 dB at 67.75 GHz and a return loss better than −10 dB across the band of operation between 54.7 and 70.3 GHz. Two filters have been designed; one centered at 42 GHz with a 10% bandwidth, and another at 63 GHz with a 5% bandwidth. Measured insertion losses of 0.77 and 2.59 dB were obtained for these filters, respectively. Measured return loss lower than 13.8 dB over the passband was achieved for both designs. The structures presented in this paper involve a low-cost manufacturing process suitable to produce integrated subsystems at millimeter waves.

Millimeter-Wave Frequency Performance of Conductor-Backed Coplanar Waveguide on FR408 Packaging Material

2012 ◽  
Vol 9 (4) ◽  
pp. 166-170 ◽  
Author(s):  
Supreetha Aroor ◽  
Rashaunda Henderson
Keyword(s):  
Millimeter Wave ◽  
Return Loss ◽  
Low Cost ◽  
Coplanar Waveguide ◽  
Packaging Material ◽  
Attenuation Constant ◽  
Cost System ◽  
Ansoft Hfss ◽  
Cmos Ic ◽  
First Time

This work demonstrates the performance of conductor-backed coplanar waveguide (CBCPW) lines on FR408 for millimeter-wave applications. These lines can be used as interconnects to integrate a CMOS IC with an antenna fabricated on FR408 for a low-cost system-in-package solution. To our knowledge, this is the first time coplanar lines on FR4 have been studied for millimeter-wave applications. Ansoft HFSS simulation results for 50 Ω coplanar lines show a return loss of 20 dB and an insertion loss of 0.5 dB/mm at 100 GHz. Measured results up to 67 GHz show that on average, the CBCPW lines have an attenuation constant of 0.22 dB/mm.

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