Millimeter-Wave Frequency Performance of Conductor-Backed Coplanar Waveguide on FR408 Packaging Material

2012 ◽  
Vol 9 (4) ◽  
pp. 166-170 ◽  
Author(s):  
Supreetha Aroor ◽  
Rashaunda Henderson

This work demonstrates the performance of conductor-backed coplanar waveguide (CBCPW) lines on FR408 for millimeter-wave applications. These lines can be used as interconnects to integrate a CMOS IC with an antenna fabricated on FR408 for a low-cost system-in-package solution. To our knowledge, this is the first time coplanar lines on FR4 have been studied for millimeter-wave applications. Ansoft HFSS simulation results for 50 Ω coplanar lines show a return loss of 20 dB and an insertion loss of 0.5 dB/mm at 100 GHz. Measured results up to 67 GHz show that on average, the CBCPW lines have an attenuation constant of 0.22 dB/mm.

2011 ◽  
Vol 3 (2) ◽  
pp. 115-120 ◽  
Author(s):  
Aline Jaimes-Vera ◽  
Ignacio Llamas-Garro ◽  
Maolong Ke ◽  
Yi Wang ◽  
Michael J. Lancaster ◽  
...  

In this paper, micromachined devices for millimeter-wave applications at U- and V-bands are presented. These structures are designed using a rectangular coaxial line built of gold-coated SU-8 photoresist layers, where the coaxial center conductor is suspended in air by stubs. The designs include a stepped coplanar waveguide (CPW)-to-coaxial transition at 63 GHz, with an insertion loss of 0.39 dB at 67.75 GHz and a return loss better than −10 dB across the band of operation between 54.7 and 70.3 GHz. Two filters have been designed; one centered at 42 GHz with a 10% bandwidth, and another at 63 GHz with a 5% bandwidth. Measured insertion losses of 0.77 and 2.59 dB were obtained for these filters, respectively. Measured return loss lower than 13.8 dB over the passband was achieved for both designs. The structures presented in this paper involve a low-cost manufacturing process suitable to produce integrated subsystems at millimeter waves.


2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Guohua Zhai ◽  
Yong Cheng ◽  
Qiuyan Yin ◽  
Shouzheng Zhu ◽  
Jianjun Gao

A uniplanar millimeter-wave broadband printed log-periodic dipole array (PLPDA) antenna fed by coplanar waveguide (CPW) is introduced. This proposed structure consists of several active dipole elements, feeding lines, parallel coupled line, and the CPW, which are etched on a single metallic layer of the substrate. The parallel coupled line can be optimized to act as a transformer between the CPW and the PLPDA antenna. Meanwhile, this transform performs the task of a balun to achieve a wideband, low cost, low loss, simple directional antenna. The uniplanar nature makes the antenna suitable to be integrated into modern printed communication circuits, especially the monolithic millimeter-wave integrated circuits (MMIC). The antenna has been carefully examined and measured to present the return loss, far-field patterns, and antenna gain.


Author(s):  
V. Harini ◽  
M. V. S. Sairam ◽  
R. Madhu

Abstract A 16-element coplanar waveguide series fed hexagonal array antenna is proposed at millimeter-wave frequency range. In this paper, the analysis is initiated from a single-element hexagonal patch then extended to 1×2 array, 1×4 array, and 4×4 series fed hexagonal patch array antennas. The idea behind this design is to improve fractional bandwidth stage-wise with improved gain maintaining constant efficiency with all the structures. The 16-element array antenna is fabricated on Rogers RT Duriod 5880™ substrate with ɛ r = 2.2 and 0.508 mm thickness. This array antenna exhibits low return loss at 28 GHz with a reflection coefficient value of −31.02 dB including almost 102% radiation efficiency and attained a maximum gain value of 8.98 dBi. The results are quite comparable with simulated 4×4 array antenna using the HFSS tool. The size of the proposed antenna is quite small which will be best suited for 5 G Femtobase stations to provide indoor communications at millimeter-wave frequencies.


Electronics ◽  
2021 ◽  
Vol 10 (22) ◽  
pp. 2870
Author(s):  
Hijab Zahra ◽  
Musa Hussain ◽  
Syeda Iffat Naqvi ◽  
Syed Muzahir Abbas ◽  
Subhas Mukhopadhyay

A simple and compact antenna with a switchable beam for millimeter-wave communication is proposed in this paper. The antenna has a planar structure, and the design evolution is discussed. The beam switching functionality was achieved by incorporating two PIN diodes in the ground plane of the antenna. By switching ON either of the PIN diodes, the inverted L-shaped stub becomes connected to the ground plane and behaves as a cavity, which causes the dispersion of the radiation pattern. Therefore, a wide-angle (±18∘) beam-switching property can be achieved using a simple and low-cost technique, without the necessity to implement additional conventional circuits. The proposed antenna is characterized by a good performance in terms of return loss, bandwidth, measured gain up to 7.95 dB, and radiation efficiency up to 84%, making it a proper candidate for IoT technology and millimeter-wave 5G devices.


2012 ◽  
Vol 2012 ◽  
pp. 1-9 ◽  
Author(s):  
Gheorghe Ioan Sajin ◽  
Iulia Andreea Mocanu

The paper presents two composite right/left-handed (CRLH) coplanar waveguide (CPW) zeroth-order resonant (ZOR) antennas which were designed, processed, and electrically characterized for applications in the millimetric wave frequency range. Two CRLH antennas were developed forf=27 GHz andf=38.5, GHz, respectively. The CRLH antenna onf=27 GHz shows a return loss ofRL<−18.78 dB atf=26.88 GHz. The −3 dB radiation characteristic beamwidth was approximately 37° and the gain wasGi=2.82 dBi. The CRLH antenna onf=38.5 GHz has a return loss ofRL<−38.5 dB atf=38.82 GHz and the −3 dB radiation characteristic beamwidth of approximately 17°. The gains wereGi=1.08 dBi atf=38 GHz andGi=1.2 dBi atf=38.6 GHz. The maximum measured gain wasGi=1.75 dBi atf=38.2 GHz. It is, upon the authors' knowledge, the first report of millimeter wave CRLH antennas on silicon substrate in CPW technique for use in mm-wave monolithic integrated circuit.


2007 ◽  
Vol 40 (11) ◽  
pp. 53
Author(s):  
BRUCE K. DIXON
Keyword(s):  
Low Cost ◽  

Author(s):  
Ramin Sattari ◽  
Stephan Barcikowski ◽  
Thomas Püster ◽  
Andreas Ostendorf ◽  
Heinz Haferkamp

2018 ◽  
Vol 3 (1) ◽  
pp. 35 ◽  
Author(s):  
Cihat Şeker ◽  
Turgut Ozturk ◽  
Muhammet Tahir Güneşer

In this proposed paper, a single band microstrip patch antenna for fifth generation (5G) wireless application was presented. 28, 38, 60 and 73 GHz frequency bands have been allocated for 5G mobile communications by International Telecommunications Union (ITU). In this paper, we proposed an antenna, which is suitable for the millimeter wave frequency. The single band antenna consists of new slot loaded on the radiating patch with the 50 ohms microstrip line feeding used. This single band antenna was simulated on a FR4 dielectric substrate have relative permittivity 4.4, loss tangent 0.02, and height 1.6 mm. The antenna was simulated by Electromagnetic simulation, computer software technology High Frequency Structural Simulator. And simulated result on return loss, VSWR, radiation pattern and 3D gain was presented. The parameters of the results well coherent and proved the literature for millimeter wave 5G wireless application at 38 GHz.


Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 169
Author(s):  
Mengcheng Wang ◽  
Shenglin Ma ◽  
Yufeng Jin ◽  
Wei Wang ◽  
Jing Chen ◽  
...  

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio frequency system-in-package (RF SIP) substrates. This paper presents a redundant TSV interconnect design for high resistivity Si interposers for millimeter-wave applications. To verify its feasibility, a set of test structures capable of working at millimeter waves are designed, which are composed of three pieces of CPW (coplanar waveguide) lines connected by single TSV, dual redundant TSV, and quad redundant TSV interconnects. First, HFSS software is used for modeling and simulation, then, a modified equivalent circuit model is established to analysis the effect of the redundant TSVs on the high-frequency transmission performance to solidify the HFSS based simulation. At the same time, a failure simulation was carried out and results prove that redundant TSV can still work normally at 44 GHz frequency when failure occurs. Using the developed TSV process, the sample is then fabricated and tested. Using L-2L de-embedding method to extract S-parameters of the TSV interconnection. The insertion loss of dual and quad redundant TSVs are 0.19 dB and 0.46 dB at 40 GHz, respectively.


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