Electrochemical Studies of W Corrosion for Low Resistive Contact in the 28 nm Technology Node

2011 ◽  
Vol 159 (2) ◽  
pp. H162-H165 ◽  
Author(s):  
Chia-Lin Hsu ◽  
Dung-Ching Perng ◽  
Yen-Ming Chen ◽  
Shu-Min Huang ◽  
Yu-Ting Li ◽  
...  
Keyword(s):  
Electrochemical Studies ◽  
Technology Node ◽  
28 Nm

Advanced Rework Process Development for Cu-CMP at 28 nm Technology Node

2019 ◽  
Vol 33 (10) ◽  
pp. 175-180
Author(s):  
Jen-Chieh Lin ◽  
Teng-Chun Tsai ◽  
Chia-Lin Hsu ◽  
Welch Lin ◽  
Chien-Chung Huang ◽  
...  
Keyword(s):  
Process Development ◽  
Technology Node ◽  
Cu Cmp ◽  
Rework Process ◽  
28 Nm

Strained p-Channel MOSFET Fabrication Challenge and Perspective for the 28-Nm Technology Node and Beyond

2015 ◽  
Vol 69 (10) ◽  
pp. 223-228 ◽  
Author(s):  
Z. Zheng ◽  
F. Xiao ◽  
H. Zhang
Keyword(s):  
Technology Node ◽  
28 Nm

Wafer edge overlay control for 28 nm and beyond technology node

2015 ◽  
Author(s):  
Rui Wang ◽  
Yuntao Jiang ◽  
Guogui Deng ◽  
Bin Xing ◽  
Chang Liu ◽  
...  
Keyword(s):  
Technology Node ◽  
Wafer Edge ◽  
28 Nm

A Perpendicular Spin Torque Switching based MRAM for the 28 nm Technology Node

2007 ◽  
Author(s):  
U.K. Klostermann ◽  
M. Angerbauer ◽  
U. Gruning ◽  
F. Kreupl ◽  
M. Ruhrig ◽  
...  
Keyword(s):  
Spin Torque ◽  
Technology Node ◽  
28 Nm

Asymmetric Keep-Out Zone of Through-Silicon Via Using 28-nm Technology Node

2015 ◽  
Vol 36 (9) ◽  
pp. 938-940 ◽  
Author(s):  
Jhih-Yang Yan ◽  
Sun-Rong Jan ◽  
Yi-Chung Huang ◽  
Huang-Siang Lan ◽  
Y.-H. Huang ◽  
...  
Keyword(s):  
Through Silicon Via ◽  
Technology Node ◽  
28 Nm

scholarly journals Laser Fault Injection at the CMOS 28 nm Technology Node: an Analysis of the Fault Model

2018 ◽  
Author(s):  
Jean-Max Dutertre ◽  
Vincent Beroulle ◽  
Philippe Candelier ◽  
Stephan De Castro ◽  
Louis-Barthelemy Faber ◽  
...  
Keyword(s):  
Fault Injection ◽  
Fault Model ◽  
Technology Node ◽  
Laser Fault Injection ◽  
28 Nm
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