Highly Sensible ZnO Nanowire Ultraviolet Photodetectors Based on Mechanical Schottky Contact

2011 ◽  
Vol 159 (1) ◽  
pp. K10-K14 ◽  
Author(s):  
Dong Chan Kim ◽  
Byung Oh Jung ◽  
Yong Hun Kwon ◽  
Hyung Koun Cho
2019 ◽  
Vol 19 (3) ◽  
pp. 976-981
Author(s):  
Kihyun Kim ◽  
Hyeon-Tak Kwak ◽  
Hyeonsu Cho ◽  
M. Meyyappan ◽  
Chang-Ki Baek

2017 ◽  
Vol 395 ◽  
pp. 72-75 ◽  
Author(s):  
Dakuan Zhang ◽  
Yun Sheng ◽  
Jianyu Wang ◽  
Fan Gao ◽  
Shancheng Yan ◽  
...  

2016 ◽  
Vol 4 (34) ◽  
pp. 7948-7958 ◽  
Author(s):  
Janghoon Park ◽  
Jongsu Lee ◽  
Youngwook Noh ◽  
Kee-Hyun Shin ◽  
Dongjin Lee

Ultraviolet (UV) photodetectors containing flexible films were fabricated by a roll-to-roll processing method.


2020 ◽  
Vol 257 (5) ◽  
pp. 1900684 ◽  
Author(s):  
Xiaoyi Wang ◽  
Hongda Wu ◽  
Guanxin Wang ◽  
Xiaohui Ma ◽  
Yingtian Xu ◽  
...  

2019 ◽  
Vol 6 (4) ◽  
pp. 045002 ◽  
Author(s):  
Xuchao Shen ◽  
Lianfeng Duan ◽  
Jialun Li ◽  
Xueyu Zhang ◽  
Xuesong Li ◽  
...  

2014 ◽  
Vol 16 (20) ◽  
pp. 9525 ◽  
Author(s):  
Zhiming Bai ◽  
Xiang Chen ◽  
Xiaoqin Yan ◽  
Xin Zheng ◽  
Zhuo Kang ◽  
...  

2013 ◽  
Vol 13 (1) ◽  
pp. 165-169 ◽  
Author(s):  
Zhiming Bai ◽  
Xiaoqin Yan ◽  
Xiang Chen ◽  
Hanshuo Liu ◽  
Yanwei Shen ◽  
...  

Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.


2012 ◽  
Vol 27 (3) ◽  
pp. 301-304 ◽  
Author(s):  
Zhi-Yuan ZHENG ◽  
Tie-Xin CHEN ◽  
Liang CAO ◽  
Yu-Yan HAN ◽  
Fa-Qiang XU

2021 ◽  
Vol 68 (3) ◽  
pp. 1101-1106
Author(s):  
Yong Fang ◽  
Zhiwei Zhao ◽  
Mengru Zhu ◽  
Zhengjin Weng ◽  
Chao Fang ◽  
...  

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