Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Substrates

2019 ◽  
Vol 44 (1) ◽  
pp. 885-890
Author(s):  
Fan Yang ◽  
Luwei Liu ◽  
Qiang Zhou ◽  
Ting Liu ◽  
Mingliang Huang
Keyword(s):  
Interfacial Reaction ◽  
Solder Volume ◽  
Solder Balls

scholarly journals Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate

2017 ◽  
Vol 184 ◽  
pp. 604-610
Author(s):  
M.A. Rabiatul Adawiyah ◽  
O. Saliza Azlina
Keyword(s):  
Interfacial Reaction ◽  
Volume Effect ◽  
Solder Volume

Fabrication and interfacial reaction of carbon nanotube-embedded Sn–3.5Ag solder balls for ball grid arrays

2014 ◽  
Vol 583 ◽  
pp. 155-161 ◽  
Author(s):  
Young-Ki Ko ◽  
Sang-Hyun Kwon ◽  
Young-Kyu Lee ◽  
Jun-Ki Kim ◽  
Chang-Woo Lee ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Interfacial Reaction ◽  
Ball Grid Arrays ◽  
Solder Balls

Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization

2006 ◽  
Vol 512 ◽  
pp. 355-360
Author(s):  
Akio Hirose ◽  
Tomoyuki Hiramori ◽  
Mototaka Ito ◽  
Yoshiharu Tanii ◽  
Kojiro F. Kobayashi
Keyword(s):  
Solder Joint ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Joint Strength ◽  
Aging Treatment ◽  
Interfacial Microstructure ◽  
Interfacial Reaction Layer ◽  
Solder Balls ◽  
Lead Free Solders ◽  
Electroless Ni

Sn-3.5Ag (Sn-Ag) and Sn-3.5Ag-0.75Cu (Sn-Ag-Cu) solder balls were reflowed on electroless Ni-P/Au plated Cu pad with varying thickness of Au layer (0 to 500nm). In the Sn-Ag solder joint, a P-rich layer including voids, which resulted from Ni diffusion from the Ni-P plating to form Ni3Sn4 interfacial reaction layer, formed at the interface regardless of Au plating thickness. This caused the degradation of the joint strength. On the contrary, the Sn-Ag-Cu solder joint had no continuous P-rich layer formed and showed a higher joint strength than the Sn-Ag solder joint in the case of Au plating of 50nm or less. Cu alloying to the solder promote the formation of (Cu, Ni)6Sn5 instead to Ni3Sn4 as the interfacial reaction layer. The (Cu, Ni)6Sn5 reaction layer can suppress the diffusion of Ni from the N-P plating and thereby inhibit the formation of the P-rich layer. However, in the case of thick Au plating of 250nm or more, a thin P-rich layer formed at the interface even in the Sn-Ag-Cu solder joint and the joint strength was degraded. Au dissolving into the solder from the Au plating during the reflow process may encourage the diffusion of Ni from the Ni-P plating into the solder. As a result, the Sn-Ag-Cu solder joints with 50nm Au coating provided the best joint strength, although its joint strength considerably degraded after the aging treatment at 423K.

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