(Invited) Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substrates - Experiment and Simulation

2013 ◽  
Vol 52 (1) ◽  
pp. 753-758 ◽  
Author(s):  
M. Huang ◽  
F. Yang ◽  
N. Zhao ◽  
X. Liu
Keyword(s):  
Interfacial Reaction ◽  
Volume Effect ◽  
Solder Volume ◽  
Solder Balls ◽  
Cu Substrates ◽  
Experiment And Simulation

scholarly journals Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate

2017 ◽  
Vol 184 ◽  
pp. 604-610
Author(s):  
M.A. Rabiatul Adawiyah ◽  
O. Saliza Azlina
Keyword(s):  
Interfacial Reaction ◽  
Volume Effect ◽  
Solder Volume

Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Substrates

2019 ◽  
Vol 44 (1) ◽  
pp. 885-890
Author(s):  
Fan Yang ◽  
Luwei Liu ◽  
Qiang Zhou ◽  
Ting Liu ◽  
Mingliang Huang
Keyword(s):  
Interfacial Reaction ◽  
Solder Volume ◽  
Solder Balls

Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates

2007 ◽  
Vol 37 (1) ◽  
pp. 84-89 ◽  
Author(s):  
Han-Byul Kang ◽  
Jee-Hwan Bae ◽  
Jae-Wook Lee ◽  
Min-Ho Park ◽  
Jeong-Won Yoon ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Cu Substrates ◽  
Electroless Ni

Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders

2007 ◽  
Vol 37 (3) ◽  
pp. 314-323 ◽  
Author(s):  
Yoshikazu Takaku ◽  
Lazuardi Felicia ◽  
Ikuo Ohnuma ◽  
Ryosuke Kainuma ◽  
Kiyohito Ishida
Keyword(s):  
High Temperature ◽  
Interfacial Reaction ◽  
Cu Substrates

Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging

2019 ◽  
Vol 33 (06) ◽  
pp. 1950060
Author(s):  
Shengli Li ◽  
Yang Liu ◽  
Hongming Cai ◽  
Hao Zhang ◽  
Fenglian Sun
Keyword(s):  
Aging Time ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Isothermal Aging ◽  
Total Thickness ◽  
Aging Condition ◽  
Sac305 Solder ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Solder Bulk

This study investigated the influences of Cu, high temperature-treated Cu (H-Cu) and graphene-coated Cu (G-Cu) substrates on interfacial reaction, microstructure and hardness of Sn-3.0g-0.5Cu (SAC305) solder alloy. Intermetallic compound (IMC) layer evolution and mechanical property of Sn-3.0g-0.5Cu-0.3Ni (SAC305-0.3Ni) solder joints were also studied under different aging duration. A continuous scallop-like IMC layer was observed at SAC305/Cu, SAC305/H-Cu, SAC305/G-Cu interfaces during reflow and isothermal aging. After adding Ni in the SAC305-0.3Ni solder alloy, the roughness of IMC layer on Cu, H-Cu substrates increased. In contrast, the addition of Ni had a limited impact on the roughness of IMC layer on G-Cu substrates. The total thickness of IMC layer grew as aging time increases, proportionated to the square root of aging duration. The addition of Ni in the solder alloy promoted the growth of IMC layer on Cu and H-Cu substrates, but it was restrained on G-Cu substrate. The amount of the IMC phases in SAC305 and SAC305-0.3Ni solder bulks on the three substrates increased significantly as aging time prolonged. Thus, the hardness of SAC305 and SAC305-0.3Ni solder bulks on the three substrates rose. The addition of Ni in the solder bulks on the three substrates sharply enhanced the formation of [Formula: see text]-Sn phases and increased the quantity of the IMCs. Consequently, the hardness of SAC305-0.3Ni solder bulks was higher than that of SAC305 solder bulk on the three substrates under same aging condition. In addition, the graphene-coated layer on G-Cu substrate could improve the hardness of SAC305 and SAC305-0.3Ni solder bulks.

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