(Invited) High Performance and Highly Uniform Metal Hi-K Gate-All-Around Silicon Nanowire MOSFETs

2019 ◽  
Vol 28 (1) ◽  
pp. 179-189 ◽  
Author(s):  
Jeffrey W. Sleight ◽  
Sarunya Bangsaruntip ◽  
Guy Cohen ◽  
Amlan Majumdar ◽  
Ying Zhang ◽  
...  
Author(s):  
Amlan Majumdar ◽  
Sarunya Bangsaruntip ◽  
Guy M. Cohen ◽  
Lynne M. Gignac ◽  
Michael Guillorn ◽  
...  

Author(s):  
B. H. Hong ◽  
Y. C. Jung ◽  
S. W. Hwang ◽  
K. H. Cho ◽  
K. H. Yeo ◽  
...  

2010 ◽  
Vol 7 (19) ◽  
pp. 1499-1503 ◽  
Author(s):  
Seongjae Cho ◽  
In Man Kang ◽  
Kyung Rok Kim

2021 ◽  
Author(s):  
Yejin Yang ◽  
Juhee Jeon ◽  
Jaemin Son ◽  
Kyoungah Cho ◽  
Sangsig Kim

Abstract The processing of large amounts of data requires a high energy efficiency and fast processing time for high-performance computing systems. However, conventional von Neumann computing systems have performance limitations because of bottlenecks in data movement between separated processing and memory hierarchy, which causes latency and high power consumption. To overcome this hindrance, logic-in-memory (LIM) has been proposed that performs both data processing and memory operations. Here, we present a NAND and NOR LIM composed of silicon nanowidre feedback field-effect transistors, whose configuration resembles that of CMOS logic gate circuits. The LIM can perform memory operations to retain its output logic under zero-bias conditions as well as logic operations with a high processing speed of nanoseconds. The newly proposed dynamic voltage-transfer characteristics verify the operating principle of the LIM. This study demonstrates that the NAND and NOR LIM has promising potential to resolve power and processing speed issues.


2015 ◽  
Vol 62 (11) ◽  
pp. 3547-3553 ◽  
Author(s):  
Yawei Lv ◽  
Hao Wang ◽  
Sheng Chang ◽  
Jin He ◽  
Qijun Huang

Nano Research ◽  
2018 ◽  
Vol 11 (8) ◽  
pp. 4356-4367 ◽  
Author(s):  
Guodong Dong ◽  
Jie Zhao ◽  
Lijun Shen ◽  
Jiye Xia ◽  
Hu Meng ◽  
...  

2018 ◽  
Vol 8 (9) ◽  
pp. 1553 ◽  
Author(s):  
Ming Li ◽  
Gong Chen ◽  
Ru Huang

In this paper, we present a gate-all-around silicon nanowire transistor (GAA SNWT) with a triangular cross section by simulation and experiments. Through the TCAD simulation, it was found that with the same nanowire width, the triangular cross-sectional SNWT was superior to the circular or quadrate one in terms of the subthreshold swing, on/off ratio, and SCE immunity, which resulted from the smallest equivalent distance from the nanowire center to the surface in triangular SNWTs. Following this, we fabricated triangular cross-sectional GAA SNWTs with a nanowire width down to 20 nm by TMAH wet etching. This process featured its self-stopped etching behavior on a silicon (1 1 1) crystal plane, which made the triangular cross section smooth and controllable. The fabricated triangular SNWT showed an excellent performance with a large Ion/Ioff ratio (~107), low SS (85 mV/dec), and preferable DIBL (63 mV/V). Finally, the surface roughness mobility of the fabricated device at a low temperature was also extracted to confirm the benefit of a stable cross section.


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