Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding

2019 ◽  
Vol 18 (1) ◽  
pp. 777-785 ◽  
Author(s):  
Bob Chylak ◽  
Jamin Ling ◽  
Horst Clauberg ◽  
Tom Thieme
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Next Generation ◽  
Copper Wire Bonding ◽  
Bond Pads

Nickel–palladium bond pads for copper wire bonding

2011 ◽  
Vol 51 (1) ◽  
pp. 75-80 ◽  
Author(s):  
Horst Clauberg ◽  
Petra Backus ◽  
Bob Chylak
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Copper Wire Bonding ◽  
Bond Pads

Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads

2016 ◽  
Vol 156 ◽  
pp. 41-45 ◽  
Author(s):  
David Gross ◽  
Sabine Haag ◽  
Manfred Reinold ◽  
Martin Schneider-Ramelow ◽  
Klaus-Dieter Lang
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Silicon Chips ◽  
Copper Wire Bonding ◽  
Bond Pads

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

scholarly journals Development of high reliability semiconductor devices by copper wire bonding.

1988 ◽  
Vol 27 (4) ◽  
pp. 299-301
Author(s):  
J. Hirota ◽  
Y. Shibutani ◽  
T. Sugimura ◽  
K. Machida ◽  
T. Okuda
Keyword(s):  
High Reliability ◽  
Copper Wire ◽  
Semiconductor Devices ◽  
Wire Bonding ◽  
Copper Wire Bonding

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

scholarly journals Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

Crystals ◽  
2013 ◽  
Vol 3 (3) ◽  
pp. 391-404 ◽  
Author(s):  
Chwee Goh ◽  
Wee Chong ◽  
Teck Lee ◽  
Christopher Breach
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Microelectronics Packaging ◽  
Corrosion Study ◽  
Copper Wire Bonding
Sign in / Sign up

Export Citation Format

Share Document